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Thermal And Power Management of Integrated Circuits
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Thermal and Power Management of Integrated Circuits (Integrated Circuits and Systems)
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Thermal And Power Management of Integrated Circuits
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Add to basketTaschenbuch. Condition: Neu. Druck auf Anfrage Neuware - Printed after ordering - In Thermal and Power Management of Integrated Circuits, power and thermal management issues in integrated circuits during normal operating conditions and stress operating conditions are addressed. Thermal management in VLSI circuits is becoming an integral part of the design, test, and manufacturing. Proper thermal management is the key to achieve high performance, quality and reliability. Performance and reliability of integrated circuits are strong functions of the junction temperature. A small increase in junction temperature may result in significant reduction in the device lifetime.This book reviews the significance of the junction temperature as a reliability measure under nominal and burn-in conditions. The latest research in the area of electro-thermal modeling of integrated circuits will also be presented. Recent models and associated CAD tools are covered and various techniques at the circuit and system levels are reviewed. Subsequently, the authors provide an insight into the concept of thermal runaway and how it may best be avoided. A section on low temperature operation of integrated circuits concludes the book.
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Thermal and Power Management of Integrated Circuits (Integrated Circuits and Systems)
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Add to basketGebunden. Condition: New. Covers the latest research that has been carried on in the area of thermal and power management of integrated circuits with emphasis on performance and reliability of ICs at system and circuit levelNo book provides cohesive treatment of the materi.
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Thermal and Power Management of Integrated Circuits
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Thermal and Power Management of Integrated Circuits
Published by Springer-Verlag New York Inc., 2006
ISBN 10: 0387257624 ISBN 13: 9780387257624
Language: English
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Add to basketCondition: New. Addresses power and thermal management issues in integrated circuits during normal operating conditions and stress operating conditions. This book provides an insight into the concept of thermal runaway and how it may best be avoided. It concludes with a section on low temperature operation of integrated circuits. Series: Integrated Circuits and Systems. Num Pages: 182 pages, biography. BIC Classification: TJFC. Category: (P) Professional & Vocational. Dimension: 234 x 156 x 12. Weight in Grams: 449. . 2006. Hardback. . . . .
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CMOS SRAM Circuit Design and Parametric Test in Nano-Scaled Technologies: Process-Aware SRAM Design and Test (Frontiers in Electronic Testing, 40)
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Defect-Oriented Testing for Nano-Metric CMOS VLSI Circuits (Frontiers in Electronic Testing, 34)
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Add to baskethardcover. Condition: Good. Connecting readers with great books since 1972! Used textbooks may not include companion materials such as access codes, etc. May have some wear or writing/highlighting. We ship orders daily and Customer Service is our top priority!
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ESD Protection Device and Circuit Design for Advanced CMOS Technologies
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ESD Protection Device and Circuit Design for Advanced CMOS Technologies
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