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Materials, Processes and Reliability for Advanced Interconnects for Micro- and Nanoelectronics ? 2009: Volume 1156 (MRS Proceedings)
Language: English
Published by Cambridge University Press, 2014
ISBN 10: 1107408318 ISBN 13: 9781107408319
Condition: New.
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Materials, Processes and Reliability for Advanced Interconnects for Micro- and Nanoelectronics ? 2009: Volume 1156 (MRS Proceedings)
Language: English
Published by Cambridge University Press, 2014
ISBN 10: 1107408318 ISBN 13: 9781107408319
Seller: Ria Christie Collections, Uxbridge, United Kingdom
Seller rating 5 out of 5 stars
£ 30.70
£ 11.98 shipping
Ships from United Kingdom to U.S.A.Quantity: Over 20 available
Add to basketCondition: New. In.
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Materials, Processes and Reliability for Advanced Interconnects for Micro and Nanoelectronics - 2009: Volume 1156 (MRS Proceedings)
Language: English
Published by Cambridge University Press 2014-06-05, 2014
ISBN 10: 1107408318 ISBN 13: 9781107408319
Paperback. Condition: New.
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Materials, Processes and Reliability for Advanced Interconnects for Micro and Nanoelectronics - 2009: Volume 1156 (MRS Proceedings)
Language: English
Published by Cambridge University Press, 2014
ISBN 10: 1107408318 ISBN 13: 9781107408319
Seller: Kennys Bookshop and Art Galleries Ltd., Galway, GY, Ireland
Seller rating 5 out of 5 stars
Condition: New.
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Materials, Processes and Reliability for Advanced Interconnects for Micro-and Nanoelectronics, 2009
Language: English
Published by Cambridge University Press CUP, 2014
ISBN 10: 1107408318 ISBN 13: 9781107408319
Condition: New. pp. 204.
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Materials, Processes and Reliability for Advanced Interconnects for Micro and Nanoelectronics - 2009: Volume 1156 (MRS Proceedings)
Language: English
Published by Cambridge University Press, 2014
ISBN 10: 1107408318 ISBN 13: 9781107408319
Condition: New.
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MATERIALS, PROCESSES AND RELIABILITY FOR ADVANCED INTERCONNECTS FOR MICRO- AND NANOELECTRONICS - 2009: VOLUME 1156
Language: English
Published by Cambridge University Press, 2009
ISBN 10: 1605111295 ISBN 13: 9781605111292
Condition: Brand New. New. US edition. Expediting shipping for all USA and Europe orders excluding PO Box. Excellent Customer Service.
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Materials, Processes and Reliability for Advanced Interconnects for Micro- And Nanoelectronics 2009 : Volume 1156
Language: English
Published by Cambridge University Press, 2014
ISBN 10: 1107408318 ISBN 13: 9781107408319
Taschenbuch. Condition: Neu. Druck auf Anfrage Neuware - Printed after ordering - Enabled by the development and introduction of new materials, the semiconductor industry continues to follow Moore's law into 32nm and 22nm technologies. Advanced interconnect structures require the use of porous dielectrics with further reduced k-values and even weaker mechanical properties, as well as much thinner metallization liners. In addition, the increasing resistivity of Cu at decreasing dimensions must be addressed in order to maintain the performance of continuously shrinking devices. To deal with these issues, and to maintain the reliability of the interconnects, innovations in materials, processes and architectures are needed. This book brings together researchers from around the world to exchange the latest advances in materials, processes, integration and reliability in advanced interconnects and packaging, and to discuss interconnects for emerging technologies. Papers from a joint session with Symposium F, Packaging, Chip-Package Interactions and Solder Materials Challenges, are also included and focus on 3D chip stacking and molecular electronics.
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Materials, Processes and Reliability for Advanced Interconnects for Micro- and Nanoelectronics 2009 : Symposium Held April 14-17, 2009, San Francisco, California, U.s.a.
Language: English
Published by Cambridge University Press, 2009
ISBN 10: 1605111295 ISBN 13: 9781605111292
Condition: New.
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Materials, Processes and Reliability for Advanced Interconnects for Micro- and Nanoelectronics ? 2009: Volume 1156 (MRS Proceedings)
Language: English
Published by Cambridge University Press, 2009
ISBN 10: 1605111295 ISBN 13: 9781605111292
Condition: New.
-
Materials, Processes and Reliability for Advanced Interconnects for Micro- and Nanoelectronics ? 2009: Volume 1156 (MRS Proceedings)
Language: English
Published by Cambridge University Press, 2009
ISBN 10: 1605111295 ISBN 13: 9781605111292
Seller: Ria Christie Collections, Uxbridge, United Kingdom
Seller rating 5 out of 5 stars
£ 104.29
£ 11.98 shipping
Ships from United Kingdom to U.S.A.Quantity: Over 20 available
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Materials, Processes and Reliability for Advanced Interconnects for Micro- and Nanoelectronics 2009 : Symposium Held April 14-17, 2009, San Francisco, California, U.s.a.
Language: English
Published by Cambridge University Press, 2009
ISBN 10: 1605111295 ISBN 13: 9781605111292
Seller: GreatBookPricesUK, Woodford Green, United Kingdom
Seller rating 5 out of 5 stars
£ 104.28
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Condition: Fine. Number of books: 1.
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Bijutsu Techo March 1986 Special feature on Schiele and Vienna
Published by Bijutsu Shuppan-Sha Co. Ltd., 1986
Condition: Fine. Number of pages: unconfirmed.
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Condition: Fine. Number of books: 1.
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Condition: Fine. Size: B5.
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Materials, Processes and Reliability for Advanced Interconnects for Micro- and Nanoelectronics ? 2009: Volume 1156: Symposium Held April 14-17, 2009, . California, U.s.a. (MRS Proceedings)
Language: English
Published by Cambridge University Press, 2009
ISBN 10: 1605111295 ISBN 13: 9781605111292
Seller: Kennys Bookshop and Art Galleries Ltd., Galway, GY, Ireland
Seller rating 5 out of 5 stars
First Edition
Condition: New. The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners. Editor(s): Gall, Martin; Grill, Alfred; Lacopi, Francesca; Usui, Takamasa; Koike, Junichi. Series: MRS Proceedings. Num Pages: 189 pages, Illustrations. BIC Classification: TGM. Category: (U) Tertiary Education (US: College). Dimension: 228 x 152 x 15. Weight in Grams: 400. . 2009. 1st Edition. hardcover. . . . .
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Materials, Processes and Reliability for Advanced Interconnects for Micro- and Nanoelectronics 2009 : Symposium Held April 14-17, 2009, San Francisco, California, U.s.a.
Language: English
Published by Cambridge University Press, 2009
ISBN 10: 1605111295 ISBN 13: 9781605111292
Seller: GreatBookPricesUK, Woodford Green, United Kingdom
Seller rating 5 out of 5 stars
£ 125.99
£ 15 shipping
Ships from United Kingdom to U.S.A.Quantity: Over 20 available
Add to basketCondition: As New. Unread book in perfect condition.
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Materials, Processes and Reliability for Advanced Interconnects for Micro- and Nanoelectronics - 2009: Volume 1156 (MRS Proceedings)
Language: English
Published by Cambridge University Press, 2009
ISBN 10: 1605111295 ISBN 13: 9781605111292
Hardcover. Condition: Like New. LIKE NEW. SHIPS FROM MULTIPLE LOCATIONS. book.
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Materials, Processes and Reliability for Advanced Interconnects for Micro-and Nanoelectronics, 2009
Language: English
Published by Materials Research Society, 2009
ISBN 10: 1605111295 ISBN 13: 9781605111292
Condition: New. pp. viii + 189.
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Materials, Processes and Reliability for Advanced Interconnects for Micro- and Nanoelectronics 2009 : Symposium Held April 14-17, 2009, San Francisco, California, U.s.a.
Language: English
Published by Cambridge University Press, 2009
ISBN 10: 1605111295 ISBN 13: 9781605111292
Condition: As New. Unread book in perfect condition.
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Hardcover. Condition: Brand New. 189 pages. 9.00x6.25x0.75 inches. In Stock.
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Materials, Processes and Reliability for Advanced Interconnects for Micro- and Nanoelectronics ? 2009: Volume 1156: Symposium Held April 14-17, 2009, . California, U.s.a. (MRS Proceedings)
Language: English
Published by Cambridge University Press, 2009
ISBN 10: 1605111295 ISBN 13: 9781605111292
Condition: New. The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners. Editor(s): Gall, Martin; Grill, Alfred; Lacopi, Francesca; Usui, Takamasa; Koike, Junichi. Series: MRS Proceedings. Num Pages: 189 pages, Illustrations. BIC Classification: TGM. Category: (U) Tertiary Education (US: College). Dimension: 228 x 152 x 15. Weight in Grams: 400. . 2009. 1st Edition. hardcover. . . . . Books ship from the US and Ireland.
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Materials, Processes and Reliability for Advanced Interconnects for Micro - and Nonelectronics 2009
Language: English
Published by Cambridge University Press, 2009
ISBN 10: 1605111295 ISBN 13: 9781605111292
Buch. Condition: Neu. Druck auf Anfrage Neuware - Printed after ordering - Enabled by the development and introduction of new materials, the semiconductor industry continues to follow Moore's law into 32nm and 22nm technologies. Advanced interconnect structures require the use of porous dielectrics with further reduced k-values and even weaker mechanical properties, as well as much thinner metallization liners. In addition, the increasing resistivity of Cu at decreasing dimensions must be addressed in order to maintain the performance of continuously shrinking devices. To deal with these issues, and to maintain the reliability of the interconnects, innovations in materials, processes and architectures are needed. This book brings together researchers from around the world to exchange the latest advances in materials, processes, integration and reliability in advanced interconnects and packaging, and to discuss interconnects for emerging technologies. Papers from a joint session with Symposium F, Packaging, Chip-Package Interactions and Solder Materials Challenges, are also included and focus on 3D chip stacking and molecular electronics.
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Materials, Processes and Reliability for Advanced Interconnects for Micro- and Nanoelectronics 2009: Volume 1156 (Paperback)
Language: English
Published by Cambridge University Press, Cambridge, 2014
ISBN 10: 1107408318 ISBN 13: 9781107408319
Paperback. Condition: new. Paperback. Enabled by the development and introduction of new materials, the semiconductor industry continues to follow Moore's law into 32nm and 22nm technologies. Advanced interconnect structures require the use of porous dielectrics with further reduced k-values and even weaker mechanical properties, as well as much thinner metallization liners. In addition, the increasing resistivity of Cu at decreasing dimensions must be addressed in order to maintain the performance of continuously shrinking devices. To deal with these issues, and to maintain the reliability of the interconnects, innovations in materials, processes and architectures are needed. This book brings together researchers from around the world to exchange the latest advances in materials, processes, integration and reliability in advanced interconnects and packaging, and to discuss interconnects for emerging technologies. Papers from a joint session with Symposium F, Packaging, Chip-Package Interactions and Solder Materials Challenges, are also included and focus on 3D chip stacking and molecular electronics. The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners. This item is printed on demand. Shipping may be from multiple locations in the US or from the UK, depending on stock availability.
-
Materials, Processes and Reliability for Advanced Interconnects for Micro- and Nanoelectronics â" 2009: Volume 1156
Language: English
Published by Cambridge University Press, 2014
ISBN 10: 1107408318 ISBN 13: 9781107408319
Paperback. Condition: Brand New. 1st edition. 204 pages. 9.02x5.98x0.43 inches. In Stock. This item is printed on demand.
-
Materials, Processes and Reliability for Advanced Interconnects for Micro- and Nanoelectronics - 2009: Volume 1156
Language: English
Published by Cambridge University Press, 2014
ISBN 10: 1107408318 ISBN 13: 9781107408319
Seller: THE SAINT BOOKSTORE, Southport, United Kingdom
Seller rating 5 out of 5 stars
£ 34.53
£ 13.55 shipping
Ships from United Kingdom to U.S.A.Quantity: Over 20 available
Add to basketPaperback / softback. Condition: New. This item is printed on demand. New copy - Usually dispatched within 5-9 working days.
-
Materials, Processes and Reliability for Advanced Interconnects for Micro-and Nanoelectronics, 2009
Language: English
Published by Cambridge University Press, 2014
ISBN 10: 1107408318 ISBN 13: 9781107408319
Condition: New. Print on Demand pp. 204.
-
Materials, Processes and Reliability for Advanced Interconnects for Micro-and Nanoelectronics, 2009
Language: English
Published by Cambridge University Press, 2014
ISBN 10: 1107408318 ISBN 13: 9781107408319
Condition: New. PRINT ON DEMAND pp. 204.
-
Materials, Processes and Reliability for Advanced Interconnects for Micro- and Nanoelectronics 2009: Volume 1156 (Paperback)
Language: English
Published by Cambridge University Press, Cambridge, 2014
ISBN 10: 1107408318 ISBN 13: 9781107408319
Paperback. Condition: new. Paperback. Enabled by the development and introduction of new materials, the semiconductor industry continues to follow Moore's law into 32nm and 22nm technologies. Advanced interconnect structures require the use of porous dielectrics with further reduced k-values and even weaker mechanical properties, as well as much thinner metallization liners. In addition, the increasing resistivity of Cu at decreasing dimensions must be addressed in order to maintain the performance of continuously shrinking devices. To deal with these issues, and to maintain the reliability of the interconnects, innovations in materials, processes and architectures are needed. This book brings together researchers from around the world to exchange the latest advances in materials, processes, integration and reliability in advanced interconnects and packaging, and to discuss interconnects for emerging technologies. Papers from a joint session with Symposium F, Packaging, Chip-Package Interactions and Solder Materials Challenges, are also included and focus on 3D chip stacking and molecular electronics. The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners. This item is printed on demand. Shipping may be from our UK warehouse or from our Australian or US warehouses, depending on stock availability.
