Gosele U (19 results)

1. Aufl. XII, 267 Seiten. Gr.-8vo. Leinen mit Schutzumschlag. Schutzumschlag etwas gerbäunt. Sehr ordentliches Exemplar. 9783163384620 Sprache: Deutsch Gewicht in Gramm: 600.

Hardcover. Condition: Gut. 294, 256 p., with numerous figures, 29 cm, Good condition. Ex-Library with usual markings. Sprache: Englisch Gewicht in Gramm: 1960.

Hardcover/Pappeinband. Condition: Gut. 312 Seiten mit Ill. und graph. Darst.; 31 cm. Noch guter Zustand. Bibliotheksexemplar mit Stempeln und Signatur auf Einband. Einband berieben. Sonst Seiten sauber. / Good. Ex-library with usual markings. Clean pages. Sprache: Deutsch Gewicht in Gramm: 1600.

Condition: As New. Unread book in perfect condition.

Condition: New.

Condition: New.

Condition: New.

Condition: gut. 1996. C, H, N and O in Si and Characterization and Simulation of Materials and Processes. Part I and II. (European Materials Research Society Symposia Proceedings, Vol. 56). In englischer Sprache. pages.

Condition: New. In English.

Hardback. Condition: New. A one-stop resource on all aspects of semiconductor wafer bonding for materials scientists and electrical engineers Semiconductor Wafer Bonding addresses the entire spectrum of mainstream and likely future applications of wafer bonding. It examines all of the important issues surrounding this technology, including basic interactions between flat surfaces, the influence of particles, surface steps and cavities, surface preparation and room-temperature wafer bonding, thermal treatment of bonded wafer pairs, and much more. This unique, one-stop resource consolidates information previously available only by time-consuming searches through technical journals, proceedings, and book chapters for more than 1,000 published articles on wafer bonding. It covers all materials used for wafer bonding-including silicon, III-V compounds, fused and crystalline quartz, glass, silicon carbide, sapphire, ferroelectrics, and many others. For materials scientists and electrical engineers who need to exploit the potential of this flourishing technology, Semiconductor Wafer Bonding is a convenient one-stop resource for answers to many common questions. It is also an excellent text/reference for graduate students eager to learn about this interdisciplinary field, which spans surface chemistry, solid-state physics, materials science, and electrical engineering.…

Hardcover. Condition: Brand New. 1st edition. 297 pages. 9.75x6.50x0.75 inches. In Stock.

hardcover. Condition: Wie neu. minimale Lagerspuren am Buch, Inhalt einwandfrei und ungelesen Sprache: Englisch Gewicht in Gramm: 635.

Condition: As New. Unread book in perfect condition.

Hardback. Condition: New. A one-stop resource on all aspects of semiconductor wafer bonding for materials scientists and electrical engineers Semiconductor Wafer Bonding addresses the entire spectrum of mainstream and likely future applications of wafer bonding. It examines all of the important issues surrounding this technology, including basic interactions between flat surfaces, the influence of particles, surface steps and cavities, surface preparation and room-temperature wafer bonding, thermal treatment of bonded wafer pairs, and much more. This unique, one-stop resource consolidates information previously available only by time-consuming searches through technical journals, proceedings, and book chapters for more than 1,000 published articles on wafer bonding. It covers all materials used for wafer bonding-including silicon, III-V compounds, fused and crystalline quartz, glass, silicon carbide, sapphire, ferroelectrics, and many others. For materials scientists and electrical engineers who need to exploit the potential of this flourishing technology, Semiconductor Wafer Bonding is a convenient one-stop resource for answers to many common questions. It is also an excellent text/reference for graduate students eager to learn about this interdisciplinary field, which spans surface chemistry, solid-state physics, materials science, and electrical engineering.…

Hardcover. Condition: Brand New. 1st edition. 499 pages. 9.25x6.25x0.75 inches. In Stock.

hardcover. Condition: Gut. 315 Seiten; 9783481003975.3 Gewicht in Gramm: 2.

30 x 24 cm, Leinen mit OSchU. Zweite Auflage. 319 S. mit zahlr. Ill. Schutzumschlag berieben und mit Einrissen. Sprache: Deutsch Gewicht in Gramm: 1100.

Taschenbuch. Condition: Neu. Umweltethik | Eine Einführung in globaler Perspektive | Michael/Gösele, Andreas/Köhler, Lukas u a Reder | Taschenbuch | 156 S. | Deutsch | 2019 | Kohlhammer | EAN 9783170314672 | Verantwortliche Person für die EU: W. Kohlhammer GmbH, Heßbrühlstr. 69, 70565 Stuttgart, produktsicherheit[at]kohlhammer[dot]de | Anbieter: preigu. …

Gebunden. Condition: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Presents the current state of the art in wafer bonding - a technology important to microelectronic device manufacturingPresents the current state of the art in wafer bonding - a technology important to microelectronic device manufacturingInclu.…