Wireless Interface Technologies Module by Kuroda Tadahiro (19 results)

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Hardback. Condition: New. Synthesising fifteen years of research, this authoritative text provides a comprehensive treatment of two major technologies for wireless chip and module interface design, covering technology fundamentals, design considerations and tradeoffs, practical implementation considerations, and discussion of practical applications in neural network, reconfigurable processors, and stacked SRAM. It explains the design principles and applications of two near-field wireless interface technologies for 2.5-3D IC and module integration respectively, and describes system-level performance benefits, making this an essential resource for researchers, professional engineers and graduate students performing research in next-generation wireless chip and module interface design.…

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Hardcover. Condition: Brand New. 300 pages. 9.61x6.69x0.75 inches. In Stock.

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Buch. Condition: Neu. Druck auf Anfrage Neuware - Printed after ordering - Synthesising fifteen years of research, this authoritative text provides a comprehensive treatment of two major technologies for wireless chip and module interface design, covering technology fundamentals, design considerations and tradeoffs, practical implementation considerations, and discussion of practical applications in neural network, reconfigurable processors, and stacked SRAM. It explains the design principles and applications of two near-field wireless interface technologies for 2.5-3D IC and module integration respectively, and describes system-level performance benefits, making this an essential resource for researchers, professional engineers and graduate students performing research in next-generation wireless chip and module interface design.…

Hardback. Condition: New. Synthesising fifteen years of research, this authoritative text provides a comprehensive treatment of two major technologies for wireless chip and module interface design, covering technology fundamentals, design considerations and tradeoffs, practical implementation considerations, and discussion of practical applications in neural network, reconfigurable processors, and stacked SRAM. It explains the design principles and applications of two near-field wireless interface technologies for 2.5-3D IC and module integration respectively, and describes system-level performance benefits, making this an essential resource for researchers, professional engineers and graduate students performing research in next-generation wireless chip and module interface design.…

Condition: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Synthesising fifteen years of research, this comprehensive text provides a treatment of two major technologies for wireless chip and module interface design, covering technology fundamentals, design considerations and tradeoffs, and practical considerations.…

Hardcover. Condition: new. Hardcover. Synthesising fifteen years of research, this authoritative text provides a comprehensive treatment of two major technologies for wireless chip and module interface design, covering technology fundamentals, design considerations and tradeoffs, practical implementation considerations, and discussion of practical applications in neural network, reconfigurable processors, and stacked SRAM. It explains the design principles and applications of two near-field wireless interface technologies for 2.5-3D IC and module integration respectively, and describes system-level performance benefits, making this an essential resource for researchers, professional engineers and graduate students performing research in next-generation wireless chip and module interface design. Synthesising fifteen years of research, this comprehensive text provides a treatment of two major technologies for wireless chip and module interface design, covering technology fundamentals, design considerations and tradeoffs, and practical considerations. An essential resource for researchers, professional engineers and graduate students. This item is printed on demand. Shipping may be from our UK warehouse or from our Australian or US warehouses, depending on stock availability.…

Buch. Condition: Neu. Wireless Interface Technologies for 3D IC and Module Integration | Tadahiro Kuroda (u. a.) | Buch | Englisch | 2021 | Cambridge University Press | EAN 9781108841214 | Verantwortliche Person für die EU: Libri GmbH, Europaallee 1, 36244 Bad Hersfeld, gpsr[at]libri[dot]de | Anbieter: preigu Print on Demand.…

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Hardback. Condition: New. This item is printed on demand. New copy - Usually dispatched within 5-9 working days.

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