Stacked Chips Emerging Processes (23 results)

Language: English
Published by Cham, Springer International Publishing. 2015
- Hardcover
Seller: Universitätsbuchhandlung Herta Hold GmbH, Berlin, , GermanyUniversitätsbuchhandlung Herta Hold GmbH
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£ 14.29
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Aufl. 2016. 235 mm x 155 mm, 0 g. XXIII, 339 p. Hardcover. Versand aus Deutschland / We dispatch from Germany via Air Mail. Einband bestoßen, daher Mängelexemplar gestempelt, sonst sehr guter Zustand. Imperfect copy due to slightly bumped cover, apart from this in very good condition. Stamped. Sprache: Englisch.

- Hardcover
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- Softcover
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- Softcover
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- Hardcover
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- Softcover
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- Hardcover
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- Softcover
Seller: Ria Christie Collections, Uxbridge, United KingdomRia Christie Collections
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- Hardcover
Seller: GreatBookPricesUK, Woodford Green, United KingdomGreatBookPricesUK
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- Hardcover
Seller: Books Puddle, New York, NY, U.S.A.Books Puddle
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- Hardcover
Seller: GreatBookPricesUK, Woodford Green, United KingdomGreatBookPricesUK
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- Hardcover
Seller: Revaluation Books, Exeter, , United KingdomRevaluation Books
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Language: English
Published by Springer International Publishing, Springer International Publishing 2018
- Softcover
Seller: AHA-BUCH GmbH, Einbeck, GermanyAHA-BUCH GmbH
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Taschenbuch. Condition: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book explains for readers how 3D chip stacks promise to increase the level of on-chip integration, and to design new heterogeneous semiconductor devices that combine chips of different integration technologies (incl. sensors) in a single packa…ge of the smallest possible size. The authors focus on heterogeneous 3D integration, addressing some of the most important challenges in this emerging technology, including contactless, optics-based, and carbon-nanotube-based 3D integration, as well as signal-integrity and thermal management issues in copper-based 3D integration. Coverage also includes the 3D heterogeneous integration of power sources, photonic devices, and non-volatile memories based on new materials systems.

- Hardcover
Seller: AHA-BUCH GmbH, Einbeck, GermanyAHA-BUCH GmbH
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Buch. Condition: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book explains for readers how 3D chip stacks promise to increase the level of on-chip integration, and to design new heterogeneous semiconductor devices that combine chips of different integration technologies (incl. sensors) in a single package of t…he smallest possible size. The authors focus on heterogeneous 3D integration, addressing some of the most important challenges in this emerging technology, including contactless, optics-based, and carbon-nanotube-based 3D integration, as well as signal-integrity and thermal management issues in copper-based 3D integration. Coverage also includes the 3D heterogeneous integration of power sources, photonic devices, and non-volatile memories based on new materials systems.

- Softcover
Seller: preigu, Osnabrück, Germanypreigu
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Taschenbuch. Condition: Neu. 3D Stacked Chips | From Emerging Processes to Heterogeneous Systems | Ibrahim M. Elfadel (u. a.) | Taschenbuch | xxiii | Englisch | 2018 | Springer | EAN 9783319793054 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]…com | Anbieter: preigu.

- Softcover
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- Softcover
Seller: Books Puddle, New York, NY, U.S.A.Books Puddle
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- Hardcover
- Print on Demand
Seller: Brook Bookstore On Demand, Napoli, NA, ItalyBrook Bookstore On Demand
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- Softcover
- Print on Demand
Seller: Brook Bookstore On Demand, Napoli, NA, ItalyBrook Bookstore On Demand
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Condition: new. Questo è un articolo print on demand.

- Hardcover
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Seller: Majestic Books, Hounslow, , United KingdomMajestic Books
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- Hardcover
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Seller: Biblios, frankfurt am main, HESSE, GermanyBiblios
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- Softcover
- Print on Demand
Seller: Majestic Books, Hounslow, , United KingdomMajestic Books
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Condition: New. Print on Demand pp. 339.

- Softcover
- Print on Demand
Seller: Biblios, frankfurt am main, HESSE, GermanyBiblios
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Condition: New. PRINT ON DEMAND pp. 339.