3D Stacked Chips : From Emerging Processes to Heterogeneous Systems

Language: English

Published by Palgrave Macmillan, 2016

3319204807 / 9783319204802

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nach der Bestellung gedruckt Neuware - Printed after ordering - This book explains for readers how 3D chip stacks promise to increase the level of on-chip integration, and to design new heterogeneous semiconductor devices that combine chips of different integration technologies (incl. sensors) in a single package of the smallest possible size. The authors focus on heterogeneous 3D integration, addressing some of the most important challenges in this emerging technology, including contactless, optics-based, and carbon-nanotube-based 3D integration, as well as signal-integrity and thermal management issues in copper-based 3D integration. Coverage also includes the 3D heterogeneous integration of power sources, photonic devices, and non-volatile memories based on new materials systems.

Seller Inventory # 9783319204802

Title
3D Stacked Chips : From Emerging Processes to Heterogeneous Systems
Author
Gerhard Fettweis
Publisher
Palgrave Macmillan
Publication year
2016
Condition
Neu
Binding
Buch
Language
English
ISBN 10
3319204807
ISBN 13
9783319204802
Item weight
711 grams
Dimensions
241x160x26 mm

AHA-BUCH GmbH

Einbeck, Germany

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