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Taschenbuch. Condition: Neu. 3D Stacked Chips | From Emerging Processes to Heterogeneous Systems | Ibrahim M. Elfadel (u. a.) | Taschenbuch | xxiii | Englisch | 2018 | Springer | EAN 9783319793054 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu.
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VLSI-SoC: Opportunities and Challenges Beyond the Internet of Things | 25th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2017, Abu Dhabi, United Arab Emirates, October 23-25, 2017, Revised and Extended Selected Papers
Book 212 of 292: IFIP Advances in Information and Communication TechnologyTaschenbuch. Condition: Neu. VLSI-SoC: Opportunities and Challenges Beyond the Internet of Things | 25th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2017, Abu Dhabi, United Arab Emirates, October 23-25, 2017, Revised and Extended Selected Papers | Michail Maniatakos (u. a.) | Taschenbuch | IFIP Advances in Information and Communication Technology | xiv | Englisch | 2020 | Springer | EAN 9783030156657 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu.
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Taschenbuch. Condition: Neu. The IoT Physical Layer | Design and Implementation | Ibrahim M. Elfadel (u. a.) | Taschenbuch | xxxiii | Englisch | 2019 | Springer | EAN 9783030065881 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu.
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VLSI-SoC: Opportunities and Challenges Beyond the Internet of Things | 25th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2017, Abu Dhabi, United Arab Emirates, October 23-25, 2017, Revised and Extended Selected Papers
Book 212 of 292: IFIP Advances in Information and Communication TechnologyBuch. Condition: Neu. VLSI-SoC: Opportunities and Challenges Beyond the Internet of Things | 25th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2017, Abu Dhabi, United Arab Emirates, October 23-25, 2017, Revised and Extended Selected Papers | Michail Maniatakos (u. a.) | Buch | xiv | Englisch | 2019 | Springer | EAN 9783030156626 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu Print on Demand.
