Hardcover. Condition: Very Good. No Jacket. Hardcover, 204 pp. Name on ffep, light cover wear, one corner fold, else text clean. Book.
Language: English
Published by Kluwer Academic Pub, Secaucus, New Jersey, U.S.A., 1994
ISBN 10: 0792394003 ISBN 13: 9780792394006
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Seller: GreatBookPrices, Columbia, MD, U.S.A.
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Seller: Ria Christie Collections, Uxbridge, United Kingdom
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Seller: Ria Christie Collections, Uxbridge, United Kingdom
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Seller: GreatBookPrices, Columbia, MD, U.S.A.
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Language: English
Published by Kluwer Academic Publishers, 1993
ISBN 10: 0792394003 ISBN 13: 9780792394006
Seller: Kennys Bookshop and Art Galleries Ltd., Galway, GY, Ireland
Condition: New. Covers research on package-induced noise problems in single and multi-chip package assemblies. This book examines the methods for calculating SSN and overall noise containment in a system. It is suitable for experienced engineers in packaging and systems areas and also for students entering these fields. Series: The Springer International Series in Engineering and Computer Science. Num Pages: 205 pages, biography. BIC Classification: TJFC; TJFD. Category: (P) Professional & Vocational; (UP) Postgraduate, Research & Scholarly; (UU) Undergraduate. Dimension: 234 x 156 x 14. Weight in Grams: 504. . 1993. Hardback. . . . .
Condition: New. pp. 232.
Condition: New. pp. 232.
Paperback. Condition: Brand New. 226 pages. 9.30x6.20x0.60 inches. In Stock.
Language: English
Published by Kluwer Academic Publishers, 1993
ISBN 10: 0792394003 ISBN 13: 9780792394006
Seller: Kennys Bookstore, Olney, MD, U.S.A.
Condition: New. Covers research on package-induced noise problems in single and multi-chip package assemblies. This book examines the methods for calculating SSN and overall noise containment in a system. It is suitable for experienced engineers in packaging and systems areas and also for students entering these fields. Series: The Springer International Series in Engineering and Computer Science. Num Pages: 205 pages, biography. BIC Classification: TJFC; TJFD. Category: (P) Professional & Vocational; (UP) Postgraduate, Research & Scholarly; (UU) Undergraduate. Dimension: 234 x 156 x 14. Weight in Grams: 504. . 1993. Hardback. . . . . Books ship from the US and Ireland.
Taschenbuch. Condition: Neu. Druck auf Anfrage Neuware - Printed after ordering - This monograph presents our recent research on Simultaneous Switching Noise (SSN) and related issues for CMOS based systems. Although some SSN related work was previously reported in the literature, it were mainly for Emitter Coupled Logic (ECL) gates using Bipolar Junction Transistors (BJTs). This present work covers in-depth analysis on estimating SSN and its impact for CMOS based devices and systems. At present semiconductor industries are moving towards scaled CMOS devices and reduced supply voltage. SSN together with coupled noise may limit the packing density, and thereby the frequency of operation of packaged systems. Our goal is to provide efficient and yet reliable methodologies and algorithms to estimate the overall noise containment in single chip and multi-chip package assemblies. We hope that the techniques and results described in this book will be useful as guides for design, package, and system engineers and academia working in this area. Through this monograph, we hope that we have shown the necessity of interactions that are essential between chip design, system design and package design engineers to design and manufacture optimal packaged systems. Work reported in this monograph was partially supported by the grant from Semiconductor Research Corporation (SRC Contract No. 92-MP-086).
Buch. Condition: Neu. Druck auf Anfrage Neuware - Printed after ordering - This monograph presents our recent research on Simultaneous Switching Noise (SSN) and related issues for CMOS based systems. Although some SSN related work was previously reported in the literature, it were mainly for Emitter Coupled Logic (ECL) gates using Bipolar Junction Transistors (BJTs). This present work covers in-depth analysis on estimating SSN and its impact for CMOS based devices and systems. At present semiconductor industries are moving towards scaled CMOS devices and reduced supply voltage. SSN together with coupled noise may limit the packing density, and thereby the frequency of operation of packaged systems. Our goal is to provide efficient and yet reliable methodologies and algorithms to estimate the overall noise containment in single chip and multi-chip package assemblies. We hope that the techniques and results described in this book will be useful as guides for design, package, and system engineers and academia working in this area. Through this monograph, we hope that we have shown the necessity of interactions that are essential between chip design, system design and package design engineers to design and manufacture optimal packaged systems. Work reported in this monograph was partially supported by the grant from Semiconductor Research Corporation (SRC Contract No. 92-MP-086).
Seller: moluna, Greven, Germany
Condition: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. This monograph presents our recent research on Simultaneous Switching Noise (SSN) and related issues for CMOS based systems. Although some SSN related work was previously reported in the literature, it were mainly for Emitter Coupled Logic (ECL) gates using.
Seller: moluna, Greven, Germany
Condition: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. This monograph presents our recent research on Simultaneous Switching Noise (SSN) and related issues for CMOS based systems. Although some SSN related work was previously reported in the literature, it were mainly for Emitter Coupled Logic (ECL) gates using.
Seller: Majestic Books, Hounslow, United Kingdom
Condition: New. Print on Demand pp. 232 49:B&W 6.14 x 9.21 in or 234 x 156 mm (Royal 8vo) Perfect Bound on White w/Gloss Lam.
Seller: Majestic Books, Hounslow, United Kingdom
Condition: New. Print on Demand pp. 232 52:B&W 6.14 x 9.21in or 234 x 156mm (Royal 8vo) Case Laminate on White w/Gloss Lam.
Seller: Biblios, Frankfurt am main, HESSE, Germany
Condition: New. PRINT ON DEMAND pp. 232.
Seller: preigu, Osnabrück, Germany
Buch. Condition: Neu. Simultaneous Switching Noise of CMOS Devices and Systems | Ramesh Senthinathan (u. a.) | Buch | xxi | Englisch | 1993 | Springer | EAN 9780792394006 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu Print on Demand.
Seller: Biblios, Frankfurt am main, HESSE, Germany
Condition: New. PRINT ON DEMAND pp. 232.
Language: English
Published by Springer, Springer Nov 1993, 1993
ISBN 10: 0792394003 ISBN 13: 9780792394006
Seller: buchversandmimpf2000, Emtmannsberg, BAYE, Germany
Buch. Condition: Neu. This item is printed on demand - Print on Demand Titel. Neuware -This monograph presents our recent research on Simultaneous Switching Noise (SSN) and related issues for CMOS based systems. Although some SSN related work was previously reported in the literature, it were mainly for Emitter Coupled Logic (ECL) gates using Bipolar Junction Transistors (BJTs). This present work covers in-depth analysis on estimating SSN and its impact for CMOS based devices and systems. At present semiconductor industries are moving towards scaled CMOS devices and reduced supply voltage. SSN together with coupled noise may limit the packing density, and thereby the frequency of operation of packaged systems. Our goal is to provide efficient and yet reliable methodologies and algorithms to estimate the overall noise containment in single chip and multi-chip package assemblies. We hope that the techniques and results described in this book will be useful as guides for design, package, and system engineers and academia working in this area. Through this monograph, we hope that we have shown the necessity of interactions that are essential between chip design, system design and package design engineers to design and manufacture optimal packaged systems. Work reported in this monograph was partially supported by the grant from Semiconductor Research Corporation (SRC Contract No. 92-MP-086).Springer-Verlag KG, Sachsenplatz 4-6, 1201 Wien 230 pp. Englisch.