Rapid Thermal Integrated Processing (19 results)
- Hardcover
Seller: Half Price Books Inc., Dallas, TX, U.S.A.Half Price Books Inc.
Contact seller5-star sellerCondition: Used - Very good
£ 9.73
£ 2.58 shippingShips within U.S.A.Quantity: 1 available
hardcover. Condition: Very Good. Connecting readers with great books since 1972! Used books may not include companion materials, and may have some shelf wear or limited writing. We ship orders daily and Customer Service is our top priority.
Rapid Thermal Annealing / Chemical Vapor Deposition and Integrated Processing
Hodul, David;Green, Martin L.;Gelpey, Jeffrey C.;Green Martin L.;Seidel, Thomas E.
Language: English
Published by Materials Research Society, Warrendale, Pennsylvania, U.S.A., 1989
- Hardcover
Seller: Reader's Corner, Inc., Raleigh, NC, U.S.A.Reader's Corner, Inc.
Contact seller5-star sellerCondition: New
£ 11.41
£ 4.06 shippingShips within U.S.A.Quantity: 1 available
Hardcover. Condition: New. No DJ. MRS Symposium Proceedings Vol 146. This is a new copy, blue faux leather binding with white lettering on the cover & spine.
Rapid Thermal Annealing/chemical Vapor Deposition and Integrated Processing: Volume 146
Hodul, David, Jeffrey C. Gelpey, Martin L. Green & Thomas E. Seidel (editors)
Language: English
Published by Materials Research Society, Pittsburgh, Pennsylvania, 1989
- Hardcover
Seller: Literary Cat Books, Machynlleth, Powys, WALES, United KingdomLiterary Cat Books
Contact seller4-star sellerAssociation member: IOBA
Condition: Used - Good
Original price: £ 6.0040% offCurrent price: £ 3.60
£ 15.00 shippingShips from United Kingdom to U.S.A.Quantity: 1 available
Original Boards. Condition: Good. No Dust Jacket. Reprint. 494 pages. With diagrams and illustrations. Stamped Damaged to verso title page. Slight wear to covers. Bottom edge slightly stained.; Hardcover; Octavo; The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitio…ners.
Rapid Thermal and Integrated Processing II: Volume 303 (MRS Proceedings)
Gelpey, Jeffrey C.; Elliott, J. Kiefer; Wortman, Jimmie J.; Ajmera, Atul
- Hardcover
Seller: RIVERLEE BOOKS, Waltham Cross, HERTS, United KingdomRIVERLEE BOOKS
Contact seller5-star sellerCondition: New
£ 49.00
£ 15.00 shippingShips from United Kingdom to U.S.A.Quantity: 1 available
Hardcover. Condition: New. Brand new Unread but may have "damaged" stamp on one of the title pages due to cosmetic imperfection such as minor dents on cover or edge of pages or scratches on cover etc. Hardcover.
- Hardcover
Seller: Buchpark, Trebbin, GermanyBuchpark
Contact seller5-star sellerCondition: Used - Very good
£ 37.24
£ 89.80 shippingShips from Germany to U.S.A.Quantity: 1 available
Condition: Gut. Zustand: Gut | Seiten: 455 | Sprache: Englisch | Produktart: Bücher | Keine Beschreibung verfügbar.
- Softcover
Seller: Ria Christie Collections, Uxbridge, United KingdomRia Christie Collections
Contact seller5-star sellerCondition: New
£ 363.12
£ 11.98 shippingShips from United Kingdom to U.S.A.Quantity: Over 20 available
Condition: New. In.
- Hardcover
Seller: Ria Christie Collections, Uxbridge, United KingdomRia Christie Collections
Contact seller5-star sellerCondition: New
£ 363.12
£ 11.98 shippingShips from United Kingdom to U.S.A.Quantity: Over 20 available
Condition: New. In.
Language: English
Published by Springer Netherlands, Springer Netherlands, 1996
- Hardcover
Seller: AHA-BUCH GmbH, Einbeck, GermanyAHA-BUCH GmbH
Contact seller5-star sellerCondition: New
£ 389.81
£ 55.72 shippingShips from Germany to U.S.A.Quantity: 1 available
Buch. Condition: Neu. Druck auf Anfrage Neuware - Printed after ordering - Rapid thermal and integrated processing is an emerging single-wafer technology in ULSI semiconductor manufacturing, electrical engineering, applied physics and materials science. Here, the physics and engineering of this technology are discussed at the gr…aduate level. Three interrelated areas are covered. First, the thermophysics of photon-induced annealing of semiconductor and related materials, including fundamental pyrometry and emissivity issues, the modelling of reactor designs and processes, and their relation to temperature uniformity. Second, process integration, treating the advances in basic equipment design, scale-up, integrated cluster-tool equipment, including wafer cleaning and integrated processing. Third, the deposition and processing of thin epitaxial, dielectric and metal films, covering selective deposition and epitaxy, integrated processing of layer stacks, and new areas of potential application, such as the processing of III-V semiconductor structures and thin- film head processing for high-density magnetic data storage.
Language: English
Published by Springer Netherlands, Springer Netherlands, 2010
- Softcover
Seller: AHA-BUCH GmbH, Einbeck, GermanyAHA-BUCH GmbH
Contact seller5-star sellerCondition: New
£ 388.13
£ 55.02 shippingShips from Germany to U.S.A.Quantity: 1 available
Taschenbuch. Condition: Neu. Druck auf Anfrage Neuware - Printed after ordering - Rapid thermal and integrated processing is an emerging single-wafer technology in ULSI semiconductor manufacturing, electrical engineering, applied physics and materials science. Here, the physics and engineering of this technology are discussed at… the graduate level. Three interrelated areas are covered. First, the thermophysics of photon-induced annealing of semiconductor and related materials, including fundamental pyrometry and emissivity issues, the modelling of reactor designs and processes, and their relation to temperature uniformity. Second, process integration, treating the advances in basic equipment design, scale-up, integrated cluster-tool equipment, including wafer cleaning and integrated processing. Third, the deposition and processing of thin epitaxial, dielectric and metal films, covering selective deposition and epitaxy, integrated processing of layer stacks, and new areas of potential application, such as the processing of III-V semiconductor structures and thin- film head processing for high-density magnetic data storage.
- Hardcover
Seller: Kennys Bookshop and Art Galleries Ltd., Galway, GY, IrelandKennys Bookshop and Art Galleries Ltd.
Contact seller5-star sellerCondition: New
£ 455.74
£ 8.12 shippingShips from Ireland to U.S.A.Quantity: 15 available
Condition: New. Proceedings of the NATO Advanced Study Institute, Acquafredda di Maratea, Italy, July 3-14, 1995 Editor(s): Roozeboom, Fred. Series: NATO Science Series E. Num Pages: 578 pages, biography. BIC Classification: PHFC; TJFD5. Category: (P) Professional & Vocational; (UP) Postgraduate, Research & Scholarly. Dimension:… 235 x 155 x 31. Weight in Grams: 989. . 1996. Hardback. . . . .
- Hardcover
Seller: Kennys Bookstore, Olney, MD, U.S.A.Kennys Bookstore
Contact seller5-star sellerCondition: New
£ 555.06
£ 7.76 shippingShips within U.S.A.Quantity: 15 available
Condition: New. Proceedings of the NATO Advanced Study Institute, Acquafredda di Maratea, Italy, July 3-14, 1995 Editor(s): Roozeboom, Fred. Series: NATO Science Series E. Num Pages: 578 pages, biography. BIC Classification: PHFC; TJFD5. Category: (P) Professional & Vocational; (UP) Postgraduate, Research & Scholarly. Dimension:… 235 x 155 x 31. Weight in Grams: 989. . 1996. Hardback. . . . . Books ship from the US and Ireland.
- Softcover
Seller: Revaluation Books, Exeter, United KingdomRevaluation Books
Contact seller5-star sellerCondition: New
£ 510.29
£ 12.50 shippingShips from United Kingdom to U.S.A.Quantity: 2 available
Paperback. Condition: Brand New. 584 pages. 9.00x6.25x1.31 inches. In Stock.
Published by Kluwer Academic s, 1996
- Hardcover
Seller: Buchpark, Trebbin, GermanyBuchpark
Contact seller5-star sellerCondition: Used - Fine
£ 644.41
£ 89.80 shippingShips from Germany to U.S.A.Quantity: 1 available
Add to basketCondition: Sehr gut. Zustand: Sehr gut | Produktart: Bücher | Keine Beschreibung verfügbar.
- Softcover
- Print on Demand
Seller: moluna, Greven, Germanymoluna
Contact seller5-star sellerCondition: New
£ 313.28
£ 41.90 shippingShips from Germany to U.S.A.Quantity: Over 20 available
Condition: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Proceedings of the NATO Advanced Study Institute, Acquafredda di Maratea, Italy, July 3-14, 1995 Rapid thermal and integrated processing is an emerging single-wafer technology in ULSI semiconductor manufacturing, elec…trical engineering, applied p.
- Hardcover
- Print on Demand
Seller: moluna, Greven, Germanymoluna
Contact seller5-star sellerCondition: New
£ 313.28
£ 41.90 shippingShips from Germany to U.S.A.Quantity: Over 20 available
Gebunden. Condition: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Proceedings of the NATO Advanced Study Institute, Acquafredda di Maratea, Italy, July 3-14, 1995 Rapid thermal and integrated processing is an emerging single-wafer technology in ULSI semiconductor manufactu…ring, electrical engineering, applied p.
- Softcover
- Print on Demand
Seller: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, GermanyBuchWeltWeit Ludwig Meier e.K.
Contact seller5-star sellerCondition: New
£ 345.91
£ 19.67 shippingShips from Germany to U.S.A.Quantity: 2 available
Taschenbuch. Condition: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -Rapid thermal and integrated processing is an emerging single-wafer technology in ULSI semiconductor manufacturing, electrical engineering, applied physics and materials science. Here, the physics and engineering of this technology…are discussed at the graduate level. Three interrelated areas are covered. First, the thermophysics of photon-induced annealing of semiconductor and related materials, including fundamental pyrometry and emissivity issues, the modelling of reactor designs and processes, and their relation to temperature uniformity. Second, process integration, treating the advances in basic equipment design, scale-up, integrated cluster-tool equipment, including wafer cleaning and integrated processing. Third, the deposition and processing of thin epitaxial, dielectric and metal films, covering selective deposition and epitaxy, integrated processing of layer stacks, and new areas of potential application, such as the processing of III-V semiconductor structures and thin- film head processing for high-density magnetic data storage. 580 pp. Englisch.
- Hardcover
- Print on Demand
Seller: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, GermanyBuchWeltWeit Ludwig Meier e.K.
Contact seller5-star sellerCondition: New
£ 377.00
£ 19.67 shippingShips from Germany to U.S.A.Quantity: 2 available
Buch. Condition: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -Rapid thermal and integrated processing is an emerging single-wafer technology in ULSI semiconductor manufacturing, electrical engineering, applied physics and materials science. Here, the physics and engineering of this technology are dis…cussed at the graduate level. Three interrelated areas are covered. First, the thermophysics of photon-induced annealing of semiconductor and related materials, including fundamental pyrometry and emissivity issues, the modelling of reactor designs and processes, and their relation to temperature uniformity. Second, process integration, treating the advances in basic equipment design, scale-up, integrated cluster-tool equipment, including wafer cleaning and integrated processing. Third, the deposition and processing of thin epitaxial, dielectric and metal films, covering selective deposition and epitaxy, integrated processing of layer stacks, and new areas of potential application, such as the processing of III-V semiconductor structures and thin- film head processing for high-density magnetic data storage. 582 pp. Englisch.
Language: English
Published by Springer Netherlands, Springer Netherlands Mär 1996, 1996
- Hardcover
- Print on Demand
Seller: buchversandmimpf2000, Emtmannsberg, BAYE, Germanybuchversandmimpf2000
Contact seller5-star sellerCondition: New
£ 377.00
£ 51.31 shippingShips from Germany to U.S.A.Quantity: 1 available
Buch. Condition: Neu. This item is printed on demand - Print on Demand Titel. Neuware -Rapid thermal and integrated processing is an emerging single-wafer technology in ULSI semiconductor manufacturing, electrical engineering, applied physics and materials science. Here, the physics and engineering of this technology are discuss…ed at the graduate level. Three interrelated areas are covered. First, the thermophysics of photon-induced annealing of semiconductor and related materials, including fundamental pyrometry and emissivity issues, the modelling of reactor designs and processes, and their relation to temperature uniformity. Second, process integration, treating the advances in basic equipment design, scale-up, integrated cluster-tool equipment, including wafer cleaning and integrated processing. Third, the deposition and processing of thin epitaxial, dielectric and metal films, covering selective deposition and epitaxy, integrated processing of layer stacks, and new areas of potential application, such as the processing of III-V semiconductor structures and thin- film head processing for high-density magnetic data storage.Springer-Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 582 pp. Englisch.
Language: English
Published by Springer Netherlands, Springer Netherlands Dez 2010, 2010
- Softcover
- Print on Demand
Seller: buchversandmimpf2000, Emtmannsberg, BAYE, Germanybuchversandmimpf2000
Contact seller5-star sellerCondition: New
£ 377.00
£ 51.31 shippingShips from Germany to U.S.A.Quantity: 1 available
Taschenbuch. Condition: Neu. This item is printed on demand - Print on Demand Titel. Neuware -Rapid thermal and integrated processing is an emerging single-wafer technology in ULSI semiconductor manufacturing, electrical engineering, applied physics and materials science. Here, the physics and engineering of this technology are…discussed at the graduate level. Three interrelated areas are covered. First, the thermophysics of photon-induced annealing of semiconductor and related materials, including fundamental pyrometry and emissivity issues, the modelling of reactor designs and processes, and their relation to temperature uniformity. Second, process integration, treating the advances in basic equipment design, scale-up, integrated cluster-tool equipment, including wafer cleaning and integrated processing. Third, the deposition and processing of thin epitaxial, dielectric and metal films, covering selective deposition and epitaxy, integrated processing of layer stacks, and new areas of potential application, such as the processing of III-V semiconductor structures and thin- film head processing for high-density magnetic data storage.Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 580 pp. Englisch.
