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Influence Temperature Microelectronics System by Lall Pradeep (31 results)
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Hardcover. Condition: Fair. No Jacket. 1st Edition. This book is seriously flawed by the fact that pages 289 to 307 function as an insert. They are completely separated from the binding. But the book is all there and is otherwise in new condition. There are no tears or signs of wear to the clean pages or the cover.
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Influence of Temperature on Microelectronics and System Reliability : A Physics of Failure Approach (Electronic Packaging Series)
Book 4 of 4: Electronic PackagingLanguage: English
Published by CRC Press, Boca Raton, FL, 1997
ISBN 10: 0849394503 ISBN 13: 9780849394508
Seller: Dorley House Books, Inc., Hagerstown, MD, U.S.A.
Seller rating 4 out of 5 stars
First Edition
Hardcover. Condition: Near Fine. B/W Photos; Diagrams, Etc (illustrator). 1st. 1st printing; glossy pictorial c; 307 clean, unmarked pages.
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Hardcover. Condition: Acceptable. Connecting readers with great books since 1972. Used textbooks may not include companion materials such as access codes, etc. May have condition issues including wear and notes/highlighting. We ship orders daily and Customer Service is our top priority!
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Condition: As New. Unread book in perfect condition.
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Influence of Temperature on Microelectronics and System Reliability: A Physics of Failure Approach
Book 4 of 4: Electronic PackagingLanguage: English
Published by Taylor & Francis Ltd, 2020
ISBN 10: 0367400979 ISBN 13: 9780367400972
Seller: THE SAINT BOOKSTORE, Southport, United Kingdom
Seller rating 5 out of 5 stars
Paperback / softback. Condition: New. New copy - Usually dispatched within 4 working days.
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Condition: New. 1st edition NO-PA16APR2015-KAP.
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Influence of Temperature on Microelectronics and System Reliability : A Physics of Failure Approach
Book 4 of 4: Electronic PackagingSeller: GreatBookPricesUK, Woodford Green, United Kingdom
Seller rating 5 out of 5 stars
Condition: As New. Unread book in perfect condition.
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Influence of Temperature on Microelectronics and System Reliability : A Physics of Failure Approach
Book 4 of 4: Electronic PackagingSeller: GreatBookPricesUK, Woodford Green, United Kingdom
Seller rating 5 out of 5 stars
Condition: New.
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Influence of Temperature on Microelectronics and System Reliability
Book 4 of 4: Electronic PackagingSeller: Ria Christie Collections, Uxbridge, United Kingdom
Seller rating 5 out of 5 stars
£ 52.71
£ 11.98 shipping
Ships from United Kingdom to U.S.A.Quantity: Over 20 available
Add to basketCondition: New. In.
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Condition: Brand New. New. US edition. Expediting shipping for all USA and Europe orders excluding PO Box. Excellent Customer Service.
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Influence of Temperature on Microelectronics and System Reliability: A Physics of Failure Approach
Book 4 of 4: Electronic PackagingLanguage: English
Published by Taylor & Francis Ltd, 2019
ISBN 10: 0367400979 ISBN 13: 9780367400972
Paperback. Condition: Brand New. 336 pages. 10.00x7.01x0.67 inches. In Stock.
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Hardcover. Condition: Like New. Like NewLIKE NEW. book.
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Condition: As New. Unread book in perfect condition.
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Influence of Temperature on Microelectronics and System Reliability
Book 4 of 4: Electronic PackagingSeller: GreatBookPricesUK, Woodford Green, United Kingdom
Seller rating 5 out of 5 stars
Condition: New.
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Influence of Temperature on Microelectronics and System Reliability: A Physics of Failure Approach (Electronic Packaging)
Book 4 of 4: Electronic PackagingLanguage: English
Published by CRC Press 1997-04-24, 1997
ISBN 10: 0849394503 ISBN 13: 9780849394508
Hardcover. Condition: New.
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Influence of Temperature on Microelectronics and System Reliability
Book 4 of 4: Electronic PackagingSeller: GreatBookPricesUK, Woodford Green, United Kingdom
Seller rating 5 out of 5 stars
Condition: As New. Unread book in perfect condition.
-
Influence of Temperature on Microelectronics and System Reliability: A Physics of Failure Approach
Book 4 of 4: Electronic PackagingLanguage: English
Published by Taylor & Francis Inc, 1997
ISBN 10: 0849394503 ISBN 13: 9780849394508
Seller: THE SAINT BOOKSTORE, Southport, United Kingdom
Seller rating 5 out of 5 stars
Hardback. Condition: New. New copy - Usually dispatched within 4 working days.
-
Influence of Temperature on Microelectronics and System Reliability: A Physics of Failure Approach (Electronic Packaging)
Book 4 of 4: Electronic PackagingLanguage: English
Published by Taylor & Francis Group, 1997
ISBN 10: 0849394503 ISBN 13: 9780849394508
Condition: New. pp. 336 1st Edition.
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Influence of Temperature on Microelectronics and System Reliability: A Physics of Failure Approach (Electronic Packaging)
Book 4 of 4: Electronic PackagingLanguage: English
Published by Taylor & Francis Group, 1997
ISBN 10: 0849394503 ISBN 13: 9780849394508
Condition: New. pp. 336.
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Condition: New. Satisfaction Guaranteed or your money back.
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Buch. Condition: Neu. Neuware - This book raises the level of understanding of thermal design criteria. It provides the design team with sufficient knowledge to help them evaluate device architecture trade-offs and the effects of operating temperatures. The author provides readers a sound scientific basis for system operation at realistic steady state temperatures without reliability penalties. Higher temperature performance than is commonly recommended is shown to be cost effective in production for life cycle costs.The microelectronic package considered in the book is assumed to consist of a semiconductor device with first-level interconnects that may be wirebonds, flip-chip, or tape automated bonds; die attach; substrate; substrate attach; case; lid; lid seal; and lead seal. The temperature effects on electrical parameters of both bipolar and MOSFET devices are discussed, and models quantifying the temperature effects on package elements are identified. Temperature-related models have been used to derive derating criteria for determining the maximum and minimum allowable temperature stresses for a given microelectronic package architecture.The first chapter outlines problems with some of the current modeling strategies. The next two chapters present microelectronic device failure mechanisms in terms of their dependence on steady state temperature, temperature cycle, temperature gradient, and rate of change of temperature at the chip and package level. Physics-of-failure based models used to characterize these failure mechanisms are identified and the variabilities in temperature dependence of each of the failure mechanisms are characterized. Chapters 4 and 5 describe the effects of temperature on the performance characteristics of MOS and bipolar devices. Chapter 6 discusses using high-temperature stress screens, including burn-in, for high-reliability applications. The burn-in conditions used by some manufacturers are examined and a physics-of-failure approach is described. The.
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PAP. Condition: New. New Book. Shipped from UK. THIS BOOK IS PRINTED ON DEMAND. Established seller since 2000.
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Influence of Temperature on Microelectronics and System Reliability
Book 4 of 4: Electronic PackagingSeller: PBShop.store UK, Fairford, GLOS, United Kingdom
Seller rating 4 out of 5 stars
£ 53.21
£ 5.87 shipping
Ships from United Kingdom to U.S.A.Quantity: Over 20 available
Add to basketPAP. Condition: New. New Book. Delivered from our UK warehouse in 4 to 14 business days. THIS BOOK IS PRINTED ON DEMAND. Established seller since 2000.
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Condition: New. PRINT ON DEMAND.
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Influence of Temperature on Microelectronics and System Reliability: A Physics of Failure Approach
Book 4 of 4: Electronic PackagingLanguage: English
Published by Taylor & Francis Ltd, 2020
ISBN 10: 0367400979 ISBN 13: 9780367400972
Seller: THE SAINT BOOKSTORE, Southport, United Kingdom
Seller rating 5 out of 5 stars
Paperback / softback. Condition: New. This item is printed on demand. New copy - Usually dispatched within 5-9 working days.
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Taschenbuch. Condition: Neu. nach der Bestellung gedruckt Neuware - Printed after ordering - This book raises the level of understanding of thermal design criteria. It provides the design team with sufficient knowledge to help them evaluate device architecture trade-offs and the effects of operating temperatures. The author provides readers a sound scientific basis for system operation at realistic steady state temperatures without reliability penalties. Higher temperature performance than is commonly recommended is shown to be cost effective in production for life cycle costs.The microelectronic package considered in the book is assumed to consist of a semiconductor device with first-level interconnects that may be wirebonds, flip-chip, or tape automated bonds; die attach; substrate; substrate attach; case; lid; lid seal; and lead seal. The temperature effects on electrical parameters of both bipolar and MOSFET devices are discussed, and models quantifying the temperature effects on package elements are identified. Temperature-related models have been used to derive derating criteria for determining the maximum and minimum allowable temperature stresses for a given microelectronic package architecture.The first chapter outlines problems with some of the current modeling strategies. The next two chapters present microelectronic device failure mechanisms in terms of their dependence on steady state temperature, temperature cycle, temperature gradient, and rate of change of temperature at the chip and package level. Physics-of-failure based models used to characterize these failure mechanisms are identified and the variabilities in temperature dependence of each of the failure mechanisms are characterized. Chapters 4 and 5 describe the effects of temperature on the performance characteristics of MOS and bipolar devices. Chapter 6 discusses using high-temperature stress screens, including burn-in, for high-reliability applications. The burn-in conditions used by some manufacturers are examined and a physics-of-failure approach is described. The.
