Influence Temperature Microelectronics System by Lall Pradeep (22 results)
Language: English
Published by CRC Press, 1997
Series: Electronic Packaging, Book 4 of 4. Book 4 of 4 - Electronic Packaging
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Language: English
Published by CRC Press, Boca Raton, FL, 1997
Series: Electronic Packaging, Book 4 of 4. Book 4 of 4 - Electronic Packaging
- Hardcover
- First Edition
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Hardcover. Condition: Near Fine. Dust Jacket Condition: No Jacket as Issued. 1st. 1st printing; glossy pictorial c; 307 clean, unmarked pages. B/W Photos; Diagrams, Etc (illustrator).
Language: English
Published by CRC Press, 1997
Series: Electronic Packaging, Book 4 of 4. Book 4 of 4 - Electronic Packaging
- Hardcover
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Language: English
Published by CRC Press, 1997
Series: Electronic Packaging, Book 4 of 4. Book 4 of 4 - Electronic Packaging
- Hardcover
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Language: English
Published by CRC Press, 2020
Series: Electronic Packaging, Book 4 of 4. Book 4 of 4 - Electronic Packaging
- Softcover
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Language: English
Published by CRC Press, 2020
Series: Electronic Packaging, Book 4 of 4. Book 4 of 4 - Electronic Packaging
- Softcover
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Language: English
Published by CRC Press, 2020
Series: Electronic Packaging, Book 4 of 4. Book 4 of 4 - Electronic Packaging
- Softcover
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Language: English
Published by CRC Press, 2020
Series: Electronic Packaging, Book 4 of 4. Book 4 of 4 - Electronic Packaging
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Language: English
Published by Taylor & Francis Ltd, 2020
Series: Electronic Packaging, Book 4 of 4. Book 4 of 4 - Electronic Packaging
- Softcover
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Language: English
Published by CRC Press, 2020
Series: Electronic Packaging, Book 4 of 4. Book 4 of 4 - Electronic Packaging
- Softcover
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Language: English
Published by CRC Press 2019-06, 2019
Series: Electronic Packaging, Book 4 of 4. Book 4 of 4 - Electronic Packaging
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Language: English
Published by CRC Press, 2020
Series: Electronic Packaging, Book 4 of 4. Book 4 of 4 - Electronic Packaging
- Softcover
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Language: English
Published by CRC Press, 2020
Series: Electronic Packaging, Book 4 of 4. Book 4 of 4 - Electronic Packaging
- Softcover
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Language: English
Published by CRC Press, 2020
Series: Electronic Packaging, Book 4 of 4. Book 4 of 4 - Electronic Packaging
- Softcover
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Language: English
Published by CRC Press, 1997
Series: Electronic Packaging, Book 4 of 4. Book 4 of 4 - Electronic Packaging
- Hardcover
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Language: English
Published by Taylor & Francis Ltd, 2019
Series: Electronic Packaging, Book 4 of 4. Book 4 of 4 - Electronic Packaging
- Softcover
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Paperback. Condition: Brand New. 336 pages. 10.00x7.01x0.67 inches. In Stock.
Language: English
Published by CRC Press, 1997
Series: Electronic Packaging, Book 4 of 4. Book 4 of 4 - Electronic Packaging
- Hardcover
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Language: English
Published by CRC Press, 1997
Series: Electronic Packaging, Book 4 of 4. Book 4 of 4 - Electronic Packaging
- Hardcover
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Language: English
Published by CRC Press, 2019
Series: Electronic Packaging, Book 4 of 4. Book 4 of 4 - Electronic Packaging
- Softcover
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Language: English
Published by CRC Press, 2019
Series: Electronic Packaging, Book 4 of 4. Book 4 of 4 - Electronic Packaging
- Softcover
- Print on Demand
Seller: PBShop.store UK, Fairford, GLOS, United KingdomPBShop.store UK
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PAP. Condition: New. New Book. Delivered from our UK warehouse in 4 to 14 business days. THIS BOOK IS PRINTED ON DEMAND. Established seller since 2000.
Language: English
Published by Taylor & Francis Ltd, 2020
Series: Electronic Packaging, Book 4 of 4. Book 4 of 4 - Electronic Packaging
- Softcover
- Print on Demand
Seller: THE SAINT BOOKSTORE, Southport, United KingdomTHE SAINT BOOKSTORE
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Paperback / softback. Condition: New. This item is printed on demand. New copy - Usually dispatched within 5-9 working days.
Language: English
Published by CRC Press, 2020
Series: Electronic Packaging, Book 4 of 4. Book 4 of 4 - Electronic Packaging
- Softcover
- Print on Demand
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Taschenbuch. Condition: Neu. nach der Bestellung gedruckt Neuware - Printed after ordering - This book raises the level of understanding of thermal design criteria. It provides the design team with sufficient knowledge to help them evaluate device architecture trade-offs and the effects of operating temperatures. The author prov…ides readers a sound scientific basis for system operation at realistic steady state temperatures without reliability penalties. Higher temperature performance than is commonly recommended is shown to be cost effective in production for life cycle costs.The microelectronic package considered in the book is assumed to consist of a semiconductor device with first-level interconnects that may be wirebonds, flip-chip, or tape automated bonds; die attach; substrate; substrate attach; case; lid; lid seal; and lead seal. The temperature effects on electrical parameters of both bipolar and MOSFET devices are discussed, and models quantifying the temperature effects on package elements are identified. Temperature-related models have been used to derive derating criteria for determining the maximum and minimum allowable temperature stresses for a given microelectronic package architecture.The first chapter outlines problems with some of the current modeling strategies. The next two chapters present microelectronic device failure mechanisms in terms of their dependence on steady state temperature, temperature cycle, temperature gradient, and rate of change of temperature at the chip and package level. Physics-of-failure based models used to characterize these failure mechanisms are identified and the variabilities in temperature dependence of each of the failure mechanisms are characterized. Chapters 4 and 5 describe the effects of temperature on the performance characteristics of MOS and bipolar devices. Chapter 6 discusses using high-temperature stress screens, including burn-in, for high-reliability applications. The burn-in conditions used by some manufacturers are examined and a physics-of-failure approach is described. The.
