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Materials, Processes, Integration and Reliability in Advanced Interconnects for Micro- and Nanoelectronics: Volume 990: Symposium Held April 10-12, ... California, U.S.A. (MRS Proceedings)
Language: English
Published by Cambridge University Press, 2014
ISBN 10: 1107408717 ISBN 13: 9781107408715
Condition: New.
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Materials, Processes and Reliability for Advanced Interconnects for Micro- and Nanoelectronics ? 2009: Volume 1156 (MRS Proceedings)
Language: English
Published by Cambridge University Press, 2014
ISBN 10: 1107408318 ISBN 13: 9781107408319
Condition: New.
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Ion Beam Processes in Advanced Electronic Materials and Device Technology: Volume 45 (MRS Proceedings)
Language: English
Published by Cambridge University Press, 2014
ISBN 10: 1107405688 ISBN 13: 9781107405684
Condition: New.
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Proceedings of the Third Japan International SAMPE Symposium, Volume 1: "Advanced Materials", New Processes and Reliability
Language: English
Published by Society for the Advancement of Material and Process Engineering, Japan, 1993
ISBN 10: 4990002830 ISBN 13: 9784990002831
Seller: PsychoBabel & Skoob Books, Didcot, United Kingdom
Seller rating 5 out of 5 stars
First Edition
hardcover. Condition: Very Good. Dust Jacket Condition: No Dust Jacket. First Edition. Small black mark at the bottom page corner. Used.
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Ion Beam Processes in Advanced Electronic Materials and Device Technology: Volume 45 (MRS Proceedings)
Language: English
Published by Cambridge University Press, 1985
ISBN 10: 0931837103 ISBN 13: 9780931837104
Hardcover. Condition: Very Good. Ex-Library hardcover in very nice condition with all the usual markings and attachments.
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Materials, Processes and Reliability for Advanced Interconnects for Micro- and Nanoelectronics ? 2009: Volume 1156 (MRS Proceedings)
Language: English
Published by Cambridge University Press, 2014
ISBN 10: 1107408318 ISBN 13: 9781107408319
Seller: Ria Christie Collections, Uxbridge, United Kingdom
Seller rating 5 out of 5 stars
£ 30.70
£ 11.98 shipping
Ships from United Kingdom to U.S.A.Quantity: Over 20 available
Add to basketCondition: New. In.
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Materials, Processes, Integration and Reliability in Advanced Interconnects for Micro- and Nanoelectronics: Volume 990: Symposium Held April 10-12, ... California, U.S.A. (MRS Proceedings)
Language: English
Published by Cambridge University Press, 2014
ISBN 10: 1107408717 ISBN 13: 9781107408715
Seller: Ria Christie Collections, Uxbridge, United Kingdom
Seller rating 5 out of 5 stars
£ 30.70
£ 11.98 shipping
Ships from United Kingdom to U.S.A.Quantity: Over 20 available
Add to basketCondition: New. In.
-
Ion Beam Processes in Advanced Electronic Materials and Device Technology: Volume 45 (MRS Proceedings)
Language: English
Published by Cambridge University Press, 2014
ISBN 10: 1107405688 ISBN 13: 9781107405684
Seller: Ria Christie Collections, Uxbridge, United Kingdom
Seller rating 5 out of 5 stars
£ 30.70
£ 11.98 shipping
Ships from United Kingdom to U.S.A.Quantity: Over 20 available
Add to basketCondition: New. In.
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Materials, Processes and Reliability for Advanced Interconnects for Micro and Nanoelectronics - 2009: Volume 1156 (MRS Proceedings)
Language: English
Published by Cambridge University Press 2014-06-05, 2014
ISBN 10: 1107408318 ISBN 13: 9781107408319
Paperback. Condition: New.
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Materials, Processes, Integration and Reliability in Advanced Interconnects for Micro- And Nanoelectronics: Volume 990: Symposium Held April 10 12, 20
Language: English
Published by Cambridge University Press 2014-05, 2014
ISBN 10: 1107408717 ISBN 13: 9781107408715
PF. Condition: New.
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Ion Beam Processes in Advanced Electronic Materials and Device Technology: Volume 45
Language: English
Published by Cambridge University Press 2014-05, 2014
ISBN 10: 1107405688 ISBN 13: 9781107405684
PF. Condition: New.
-
Materials, Processes and Reliability for Advanced Interconnects for Micro and Nanoelectronics - 2009: Volume 1156 (MRS Proceedings)
Language: English
Published by Cambridge University Press, 2014
ISBN 10: 1107408318 ISBN 13: 9781107408319
Seller: Kennys Bookshop and Art Galleries Ltd., Galway, GY, Ireland
Seller rating 5 out of 5 stars
Condition: New.
-
Materials, Processes and Reliability for Advanced Interconnects for Micro and Nanoelectronics - 2009: Volume 1156 (MRS Proceedings)
Language: English
Published by Cambridge University Press, 2014
ISBN 10: 1107408318 ISBN 13: 9781107408319
Condition: New.
-
Condition: Fair. Volume 1. This is an ex-library book and may have the usual library/used-book markings inside.This book has hardback covers. In fair condition, suitable as a study copy. No dust jacket. Please note the Image in this listing is a stock photo and may not match the covers of the actual item,1450grams, ISBN:3883551618.
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Condition: Fair. Volume 2. This is an ex-library book and may have the usual library/used-book markings inside.This book has hardback covers. In fair condition, suitable as a study copy. No dust jacket. Please note the Image in this listing is a stock photo and may not match the covers of the actual item,1500grams, ISBN:3883551618.
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Ion Beam Processes in Advanced Electronic Materials and Device Technology: Volume 45 (MRS Proceedings)
Language: English
Published by Cambridge University Press, 2014
ISBN 10: 1107405688 ISBN 13: 9781107405684
Condition: New.
-
MATERIALS, PROCESSES AND RELIABILITY FOR ADVANCED INTERCONNECTS FOR MICRO- AND NANOELECTRONICS - 2009: VOLUME 1156
Language: English
Published by Cambridge University Press, 2009
ISBN 10: 1605111295 ISBN 13: 9781605111292
Condition: Brand New. New. US edition. Expediting shipping for all USA and Europe orders excluding PO Box. Excellent Customer Service.
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Ion Beam Processes in Advanced Electronic Materials and Device Technology: Volume 45 (MRS Proceedings)
Language: English
Published by Cambridge University Press, 2014
ISBN 10: 1107405688 ISBN 13: 9781107405684
Seller: Kennys Bookshop and Art Galleries Ltd., Galway, GY, Ireland
Seller rating 5 out of 5 stars
Condition: New.
-
Materials, Processes and Reliability for Advanced Interconnects for Micro- And Nanoelectronics 2009 : Volume 1156
Language: English
Published by Cambridge University Press, 2014
ISBN 10: 1107408318 ISBN 13: 9781107408319
Taschenbuch. Condition: Neu. Druck auf Anfrage Neuware - Printed after ordering - Enabled by the development and introduction of new materials, the semiconductor industry continues to follow Moore's law into 32nm and 22nm technologies. Advanced interconnect structures require the use of porous dielectrics with further reduced k-values and even weaker mechanical properties, as well as much thinner metallization liners. In addition, the increasing resistivity of Cu at decreasing dimensions must be addressed in order to maintain the performance of continuously shrinking devices. To deal with these issues, and to maintain the reliability of the interconnects, innovations in materials, processes and architectures are needed. This book brings together researchers from around the world to exchange the latest advances in materials, processes, integration and reliability in advanced interconnects and packaging, and to discuss interconnects for emerging technologies. Papers from a joint session with Symposium F, Packaging, Chip-Package Interactions and Solder Materials Challenges, are also included and focus on 3D chip stacking and molecular electronics.
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Materials, Processes, Integration and Reliability in Advanced Interconnects for Micro- And Nanoelectronics : Volume 990: Symposium Held April 10 12, 20
Language: English
Published by Cambridge University Press, 2014
ISBN 10: 1107408717 ISBN 13: 9781107408715
Taschenbuch. Condition: Neu. Druck auf Anfrage Neuware - Printed after ordering - In 2004, the microelectronics industry quietly ushered in the Nanoelectronics Era with the mass production of sub-100nm node devices. The current leading-edge semiconductor chips in mass production - the so-called 90nm node devices - have a transistor gate length of less than 50nm. This rapid technological advancement in the semiconductor industry has been made possible by innovations in materials employed in both transistor fabrication (front-end-of-the-line, FEOL) and interconnect fabrication (back-end-of-the-line, BEOL). The 90nm node BEOL features copper (Cu) interconnects and dielectric materials with a low-dielectric constant (k) of about 3.0. However, for the next generations of 65nm node and beyond, evolutionary and revolutionary innovations in BEOL materials and processes are needed to fuel the continued, healthy growth of the semiconductor. This book provides a forum to exchange advances in materials, processes, integration, and reliability in advanced interconnects and packaging. The book also addresses interconnects for emerging technologies, including 3D chip stacking and optical interconnects, as well as interconnects for optoelectronics, plastic electronics and molecular electronics.
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Ion Beam Processes in Advanced Electronic Materials and Device Technology : Volume 45
Language: English
Published by Cambridge University Press, 2014
ISBN 10: 1107405688 ISBN 13: 9781107405684
Taschenbuch. Condition: Neu. Druck auf Anfrage Neuware - Printed after ordering - The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
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Materials, Processes and Reliability for Advanced Interconnects for Micro- and Nanoelectronics ? 2009: Volume 1156 (MRS Proceedings)
Language: English
Published by Cambridge University Press, 2009
ISBN 10: 1605111295 ISBN 13: 9781605111292
Condition: New.
-
Materials, Processes and Reliability for Advanced Interconnects for Micro- and Nanoelectronics ? 2009: Volume 1156 (MRS Proceedings)
Language: English
Published by Cambridge University Press, 2009
ISBN 10: 1605111295 ISBN 13: 9781605111292
Seller: Ria Christie Collections, Uxbridge, United Kingdom
Seller rating 5 out of 5 stars
£ 104.29
£ 11.98 shipping
Ships from United Kingdom to U.S.A.Quantity: Over 20 available
Add to basketCondition: New. In.
-
Materials, Processes, and Reliability for Advanced Interconnects for Micro- and Nanoelectronics - 2011: Volume 1335 (MRS Proceedings)
Language: English
Published by Materials Research Society, 2011
ISBN 10: 1605113123 ISBN 13: 9781605113128
Hardcover. Condition: Like New. LIKE NEW. SHIPS FROM MULTIPLE LOCATIONS. book.
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Materials, Processes and Reliability for Advanced Interconnects for Micro- and Nanoelectronics ? 2009: Volume 1156: Symposium Held April 14-17, 2009, . California, U.s.a. (MRS Proceedings)
Language: English
Published by Cambridge University Press, 2009
ISBN 10: 1605111295 ISBN 13: 9781605111292
Seller: Kennys Bookshop and Art Galleries Ltd., Galway, GY, Ireland
Seller rating 5 out of 5 stars
First Edition
Condition: New. The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners. Editor(s): Gall, Martin; Grill, Alfred; Lacopi, Francesca; Usui, Takamasa; Koike, Junichi. Series: MRS Proceedings. Num Pages: 189 pages, Illustrations. BIC Classification: TGM. Category: (U) Tertiary Education (US: College). Dimension: 228 x 152 x 15. Weight in Grams: 400. . 2009. 1st Edition. hardcover. . . . .
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Materials, Processes and Reliability for Advanced Interconnects for Micro- and Nanoelectronics - 2009: Volume 1156 (MRS Proceedings)
Language: English
Published by Cambridge University Press, 2009
ISBN 10: 1605111295 ISBN 13: 9781605111292
Hardcover. Condition: Like New. LIKE NEW. SHIPS FROM MULTIPLE LOCATIONS. book.
-
Materials, Processes and Reliability for Advanced Interconnects for Micro- and Nanoelectronics ? 2009: Volume 1156: Symposium Held April 14-17, 2009, . California, U.s.a. (MRS Proceedings)
Language: English
Published by Cambridge University Press, 2009
ISBN 10: 1605111295 ISBN 13: 9781605111292
Condition: New. The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners. Editor(s): Gall, Martin; Grill, Alfred; Lacopi, Francesca; Usui, Takamasa; Koike, Junichi. Series: MRS Proceedings. Num Pages: 189 pages, Illustrations. BIC Classification: TGM. Category: (U) Tertiary Education (US: College). Dimension: 228 x 152 x 15. Weight in Grams: 400. . 2009. 1st Edition. hardcover. . . . . Books ship from the US and Ireland.
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Condition: New. 1st edition NO-PA16APR2015-KAP.
