Materials, Processes, Integration and Reliability in Advanced Interconnects for Micro- and Nanoelectronics: Symposium Held April 10–12, 2007, San Francisco, California, U.S.A. (MRS Proceedings) - Softcover

Lin, Qinghuang

 
9781107408715: Materials, Processes, Integration and Reliability in Advanced Interconnects for Micro- and Nanoelectronics: Symposium Held April 10–12, 2007, San Francisco, California, U.S.A. (MRS Proceedings)
Softcover
ISBN 10: 1107408717 ISBN 13: 9781107408715
Publisher: Cambridge University Press, 2014

Synopsis

In 2004, the microelectronics industry quietly ushered in the Nanoelectronics Era with the mass production of sub-100nm node devices. The current leading-edge semiconductor chips in mass production - the so-called 90nm node devices - have a transistor gate length of less than 50nm. This rapid technological advancement in the semiconductor industry has been made possible by innovations in materials employed in both transistor fabrication (front-end-of-the-line, FEOL) and interconnect fabrication (back-end-of-the-line, BEOL). The 90nm node BEOL features copper (Cu) interconnects and dielectric materials with a low-dielectric constant (k) of about 3.0. However, for the next generations of 65nm node and beyond, evolutionary and revolutionary innovations in BEOL materials and processes are needed to fuel the continued, healthy growth of the semiconductor. This book provides a forum to exchange advances in materials, processes, integration, and reliability in advanced interconnects and packaging. The book also addresses interconnects for emerging technologies, including 3D chip stacking and optical interconnects, as well as interconnects for optoelectronics, plastic electronics and molecular electronics.

"synopsis" may belong to another edition of this title.

Book Description

This book provides a forum to exchange advances in materials, processes, integration, and reliability in advanced interconnects and packaging. The book also addresses interconnects for emerging technologies, including 3D chip stacking and optical interconnects, as well as interconnects for optoelectronics, plastic electronics and molecular electronics.

"About this title" may belong to another edition of this title.

Publisher
Cambridge University Press
Publication date
2014
Language
English
ISBN 10 
1107408717
ISBN 13 
9781107408715
Binding
Paperback
Number of pages
356

Other Popular Editions of the Same Title

9781558999503: Materials, Processes, Integration and Reliability in Advanced Interconnects for Micro- and Nanoelectronics: Volume 990: Symposium Held April 10–12, ... California, U.S.A. (MRS Proceedings)

Featured Edition

ISBN 10:  1558999507 ISBN 13:  9781558999503
Publisher: Cambridge University Press, 2007
Hardcover