Items related to Materials, Processes, Integration and Reliability in...
Materials, Processes, Integration and Reliability in Advanced Interconnects for Micro- and Nanoelectronics: Symposium Held April 10–12, 2007, San Francisco, California, U.S.A. (MRS Proceedings) - Softcover
Synopsis
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
"synopsis" may belong to another edition of this title.
Book Description
This book provides a forum to exchange advances in materials, processes, integration, and reliability in advanced interconnects and packaging. The book also addresses interconnects for emerging technologies, including 3D chip stacking and optical interconnects, as well as interconnects for optoelectronics, plastic electronics and molecular electronics.
"About this title" may belong to another edition of this title.
Search results for Materials, Processes, Integration and Reliability in...
Stock Image
Materials, Processes, Integration and Reliability in Advanced Interconnects for Micro- and Nanoelectronics: Volume 990: Symposium Held April 10-12, ... California, U.S.A. (MRS Proceedings)
Published by
Cambridge University Press, 2014
ISBN 10: 1107408717
ISBN 13: 9781107408715
New
Softcover
Seller: California Books, Miami, FL, U.S.A.
Seller rating 4 out of 5 stars
Condition: New. Seller Inventory # I-9781107408715
Stock Image
Materials, Processes, Integration and Reliability in Advanced Interconnects for Micro- and Nanoelectronics: Symposium Held April 10-12, 2007, San . U.S.A.: Volume 990 (MRS Proceedings)
Published by
Cambridge University Press 2014-06-05, 2014
ISBN 10: 1107408717
ISBN 13: 9781107408715
New
Paperback
Seller: Chiron Media, Wallingford, United Kingdom
Seller rating 5 out of 5 stars
Paperback. Condition: New. Seller Inventory # 6666-IUK-9781107408715
Buy New
£ 30.05
£ 15.49 shipping
Ships from United Kingdom to U.S.A.
Ships from United Kingdom to U.S.A.
Quantity: Over 20 available
Stock Image
Materials, Processes, Integration and Reliability in Advanced Interconnects for Micro- and Nanoelectronics: Symposium Held April 10-12, 2007, San Francisco, California, U.S.A. (MRS Proceedings)
Published by
Cambridge University Press, 2014
ISBN 10: 1107408717
ISBN 13: 9781107408715
New
Softcover
Seller: Kennys Bookshop and Art Galleries Ltd., Galway, GY, Ireland
Seller rating 5 out of 5 stars
Condition: New. Seller Inventory # V9781107408715
Buy New
£ 39.77
£ 8.18 shipping
Ships from Ireland to U.S.A.
Ships from Ireland to U.S.A.
Quantity: Over 20 available
Stock Image
Materials, Processes, Integration and Reliability in Advanced Interconnects for Micro- and Nanoelectronics: Volume 990: Symposium Held April 10-12, ... California, U.S.A. (MRS Proceedings)
Published by
Cambridge University Press, 2014
ISBN 10: 1107408717
ISBN 13: 9781107408715
New
Softcover
Seller: Ria Christie Collections, Uxbridge, United Kingdom
Seller rating 5 out of 5 stars
Condition: New. In English. Seller Inventory # ria9781107408715_new
Buy New
£ 36.78
£ 11.29 shipping
Ships from United Kingdom to U.S.A.
Ships from United Kingdom to U.S.A.
Quantity: Over 20 available
Stock Image
Materials, Processes, Integration and Reliability in Advanced Interconnects for Micro- and Nanoelectronics: Volume 990: Symposium Held April 10-12, 2007, San Francisco, California, U.S.A.
Published by
Cambridge University Press, 2014
ISBN 10: 1107408717
ISBN 13: 9781107408715
New
Paperback / softback
Seller: THE SAINT BOOKSTORE, Southport, United Kingdom
Seller rating 5 out of 5 stars
Paperback / softback. Condition: New. This item is printed on demand. New copy - Usually dispatched within 5-9 working days. Seller Inventory # C9781107408715
Buy New
£ 34.53
£ 15.55 shipping
Ships from United Kingdom to U.S.A.
Ships from United Kingdom to U.S.A.
Quantity: Over 20 available
Stock Image
Materials, Processes, Integration and Reliability in Advanced Interconnects for Micro - and Nanoelectronics
Published by
Cambridge University Press CUP, 2014
ISBN 10: 1107408717
ISBN 13: 9781107408715
New
Softcover
Seller: Books Puddle, Woodside, NY, U.S.A.
Seller rating 4 out of 5 stars
Condition: New. pp. 358. Seller Inventory # 2697808504
Stock Image
Materials, Processes, Integration and Reliability in Advanced Interconnects for Micro- and Nanoelectronics: Symposium Held April 10?12, 2007, San Francisco, California, U.S.A. (MRS Proceedings)
Published by
Cambridge University Press, 2014
ISBN 10: 1107408717
ISBN 13: 9781107408715
New
Softcover
Seller: Kennys Bookstore, Olney, MD, U.S.A.
Seller rating 5 out of 5 stars
Condition: New. Seller Inventory # V9781107408715
Stock Image
Materials, Processes, Integration and Reliability in Advanced Interconnects for Micro - and Nanoelectronics
Published by
Cambridge University Press, 2014
ISBN 10: 1107408717
ISBN 13: 9781107408715
New
Softcover
Seller: Biblios, Frankfurt am main, HESSE, Germany
Seller rating 4 out of 5 stars
Condition: New. PRINT ON DEMAND pp. 358. Seller Inventory # 1897808498
Stock Image
Materials, Processes, Integration and Reliability in Advanced Interconnects for Micro- and Nanoelectronics: Volume 990 (Paperback)
Published by
Cambridge University Press, Cambridge, 2014
ISBN 10: 1107408717
ISBN 13: 9781107408715
New
Paperback
Seller: CitiRetail, Stevenage, United Kingdom
Seller rating 5 out of 5 stars
Paperback. Condition: new. Paperback. In 2004, the microelectronics industry quietly ushered in the Nanoelectronics Era with the mass production of sub-100nm node devices. The current leading-edge semiconductor chips in mass production - the so-called 90nm node devices - have a transistor gate length of less than 50nm. This rapid technological advancement in the semiconductor industry has been made possible by innovations in materials employed in both transistor fabrication (front-end-of-the-line, FEOL) and interconnect fabrication (back-end-of-the-line, BEOL). The 90nm node BEOL features copper (Cu) interconnects and dielectric materials with a low-dielectric constant (k) of about 3.0. However, for the next generations of 65nm node and beyond, evolutionary and revolutionary innovations in BEOL materials and processes are needed to fuel the continued, healthy growth of the semiconductor. This book provides a forum to exchange advances in materials, processes, integration, and reliability in advanced interconnects and packaging. The book also addresses interconnects for emerging technologies, including 3D chip stacking and optical interconnects, as well as interconnects for optoelectronics, plastic electronics and molecular electronics. This book provides a forum to exchange advances in materials, processes, integration, and reliability in advanced interconnects and packaging. The book also addresses interconnects for emerging technologies, including 3D chip stacking and optical interconnects, as well as interconnects for optoelectronics, plastic electronics and molecular electronics. This item is printed on demand. Shipping may be from our UK warehouse or from our Australian or US warehouses, depending on stock availability. Seller Inventory # 9781107408715
Buy New
£ 37.49
£ 37 shipping
Ships from United Kingdom to U.S.A.
Ships from United Kingdom to U.S.A.
Quantity: 1 available
Seller Image
Materials, Processes, Integration and Reliability in Advanced Interconnects for Micro- And Nanoelectronics
Published by
Cambridge University Press, 2012
ISBN 10: 1107408717
ISBN 13: 9781107408715
New
Softcover
Seller: moluna, Greven, Germany
Seller rating 5 out of 5 stars
Condition: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. This book provides a forum to exchange advances in materials, processes, integration, and reliability in advanced interconnects and packaging. The book also addresses interconnects for emerging technologies, including 3D chip stacking and optical interconne. Seller Inventory # 447217847
Buy New
£ 37.29
£ 42.18 shipping
Ships from Germany to U.S.A.
Ships from Germany to U.S.A.
Quantity: Over 20 available