Advanced Electronic Packaging Technology (6 results)

paperback. Condition: New. Language:Chinese.Paperback. Pub Date: 2024-10 Pages: 236 Publisher: Chemical Industry Press This book systematically and comprehensively summarizes the fundamental knowledge and technologies of modern electronic packaging science. Part I provides an overview of electronic packaging technologies. including important packaging fundamentals such as wire bonding. automatic tape bonding. flip chip solder joint bonding. microbump bonding. and CUCU direct bonding. Part II introduces the circuit desi.…

Hardcover. Condition: New. HardCover.Pub Date:2021-12-01 Pages:273 Language:English Publisher:Chemical Industry Press 3D RF integration application is an important application development direction of through silicon via (TSV) 3D integration technology. With the rise of 5G and millimeter-wave applications. thin-film bulk acoustic resonator (FBAR) devices based on high-resistance silicon TSV wafer-level packaging. and radio frequency microelectromechanical system (RF MEMS) switching devices have gradually achieved comme.…

Hardcover. Condition: New. HardCover.Pub Date:2021-12-01 Pages:696 Language:English Publisher:Chemical Industry Press With the development of electronic packaging. electronic packaging has changed from the traditional four main functions (power system. signal distribution and transmission. heat dissipation and Mechanical protection) is expanded to six functions. namely. two new functions. DFX and system test. are added. Where DFX is designed for X. X includes: manufacturability. reliability. maintainability. cost. and .…

Hardcover. Condition: New. HardCover.Pub Date:2021-12-01 Pages:247 Language:English Publisher:Chemical Industry PressThe main advantages of solid-state lighting are energy saving. environmental friendliness and long life. and LED (Light Emitting Diode) packaging is the main guarantee for obtaining these advantages technology. This book not only covers the basic principles of lighting. colorimetry. photometry. light-emitting diodes. but also provides a comprehensive introduction to LED wafer and chip manufacturing. LED .…

Hardcover. Condition: New. HardCover. Pub Date: 2020-04-01 Pages: 355 Language: English Publisher: Chemical Industry Press Freeform optics is a new LED lighting optics technology. its advantage lies in the high degree of design freedom and accurate light energy distribution Control can provide an effective optical design method to achieve high-quality LED lighting.?This book systematically introduces a series of free-form optical algorithms and design methods for LED packaging and applications. including various circul.…

paperback. Condition: New. Paperback. Pub Date: 2017-02-01 Pages: 447 Language: Chinese Publisher: chemical industry press The book written by flip chip package technology world-class specialist. and summarized the past more than ten years of flip chip packaging technology development and new achievements. and made a prospect of the future development trend.The content covers the flip chip market and technology.…