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Advanced Electronic Packaging Technology and Key Materials Series--TSV 3D RF Integration: HR-Si Int(Chinese Edition) - Hardcover
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Language:English.HardCover.Pub Date:2021-12-01.publisher:Chemical Industry Press.description:HardCover.Pub Date:2021-12-01 Pages:273 Language:English Publisher:Chemical Industry Press 3D RF integration application is an important application development direction of through silicon via (TSV) 3D integration technology. With the rise of 5G and
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Advanced Electronic Packaging Technology and Key Materials Series--TSV 3D RF Integration: HR-Si Int(Chinese Edition)
Seller: liu xing, Nanjing, JS, China
Seller rating 5 out of 5 stars
Hardcover. Condition: New. HardCover.Pub Date:2021-12-01 Pages:273 Language:English Publisher:Chemical Industry Press 3D RF integration application is an important application development direction of through silicon via (TSV) 3D integration technology. With the rise of 5G and millimeter-wave applications. thin-film bulk acoustic resonator (FBAR) devices based on high-resistance silicon TSV wafer-level packaging. and radio frequency microelectromechanical system (RF MEMS) switching devices have gradually achieved comme. Seller Inventory # NX046084