Isbn: 9787122394842 - Advanced Electronic Packaging Technology and Key Materials Series--tsv 3d Rf Integration: Hr-si Int(chinese Edition) (1 results)

Hardcover. Condition: New. HardCover.Pub Date:2021-12-01 Pages:273 Language:English Publisher:Chemical Industry Press 3D RF integration application is an important application development direction of through silicon via (TSV) 3D integration technology. With the rise of 5G and millimeter-wave applications. thin-film bulk acoustic resonator (FBAR) devices based on high-resistance silicon TSV wafer-level packaging. and radio frequency microelectromechanical system (RF MEMS) switching devices have gradually achieved comme.…