Advanced electronic packaging technology series. flip chip packaging technology(Chinese Edition)

712227683X / 9787122276834

  • Softcover
  • New
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Seller: liu xing, Nanjing, JS, Chinaliu xing

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AbeBooks seller since April 7, 2009

Softcover

Condition: New

£ 168.71

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Item description from seller

Paperback. Pub Date: 2017-02-01 Pages: 447 Language: Chinese Publisher: chemical industry press The book written by flip chip package technology world-class specialist. and summarized the past more than ten years of flip chip packaging technology development and new achievements. and made a prospect of the future development trend.The content covers the flip chip market and technology.

Seller Inventory # DO043579

Bibliographic details

Title
Advanced electronic packaging technology series. flip chip packaging technology(Chinese Edition)
Author
TANG HE MING . LAI YI SHAO DENG BIAN
Condition
New
Binding
paperback
ISBN 10
712227683X
ISBN 13
9787122276834

liu xing

Nanjing, JS, China

5-star seller

AbeBooks seller since April 7, 2009

Shipping rates from China to U.S.A.

Item16 to 30 business days8 to 16 business days
First item£ 13.62£ 22.70
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Store description

Thank you for visiting My bookstore! We are an online bookstore, and Is the China's largest online book sales. Generally our books are from China, with reasonable price and decent printing quality. We are always trying our best to satisfy customer's needs!

Specialty

Chemistry, Mathematics, Computer, Physics, Environment, Social Sciences

Seller's business information

NAN JING SHI JIANG NING QU NING YUAN DIAN ZI SHANG WU ZHONG XIN

Room 264, Oujiang Shopping Center, No. 1 Dongxin South Road, Dongshan Street, Jiangning District, NanJing
Nanjing, JS China 211100