Seller: liu xing, Nanjing, JS, China
paperback. Condition: New. Paperback. Pub Date: 2017-02-01 Pages: 447 Language: Chinese Publisher: chemical industry press The book written by flip chip package technology world-class specialist. and summarized the past more than ten years of flip chip packaging technology development and new achievements. and made a prospect of the future development trend.The content covers the flip chip market and technology. Seller Inventory # DO043579
Quantity: 3 available