Advanced Electronic Packaging Technology and Key Materials Series--Modeling and Simulation of Microelectronic Packaging and Integration (English version)(Chinese Edition) - Hardcover

LIU SHENG , LIU YONG

 
9787122392275: Advanced Electronic Packaging Technology and Key Materials Series--Modeling and Simulation of Microelectronic Packaging and Integration (English version)(Chinese Edition)

Synopsis

Language:English.HardCover.Pub Date:2021-12-01.publisher:Chemical Industry Press.description:HardCover.Pub Date:2021-12-01 Pages:696 Language:English Publisher:Chemical Industry Press With the development of electronic packaging. electronic packaging has changed from the traditional four main functions (power system. signal distribution and

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