9780815512813 - Handbook of Vlsi Microlithography: Principles, Technology and Applications (materials Science and Process Technology) (15 results)
- Hardcover
Seller: Basi6 International, Irving, TX, U.S.A.Basi6 International
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£ 48.97
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- Hardcover
Seller: Majestic Books, Hounslow, , United KingdomMajestic Books
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£ 49.16
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Condition: New. pp. 672 Illus.
- Hardcover
Seller: GreatBookPrices, Columbia, MD, U.S.A.GreatBookPrices
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- Hardcover
Seller: Chiron Media, Wallingford, , United KingdomChiron Media
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Hardcover. Condition: New.
- Hardcover
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- Hardcover
Seller: Ria Christie Collections, Uxbridge, United KingdomRia Christie Collections
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- Hardcover
Seller: GreatBookPricesUK, Woodford Green, United KingdomGreatBookPricesUK
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- Hardcover
Seller: Books Puddle, New York, NY, U.S.A.Books Puddle
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Condition: New. pp. 672.
- Hardcover
Seller: Biblios, frankfurt am main, HESSE, GermanyBiblios
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Condition: New. pp. 672.
- Hardcover
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- Hardcover
Seller: moluna, Greven, , Germanymoluna
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Condition: New. Redaktion: William B. GlendinningJohn Helbert is a Senior Member of the Motorola Technical Staff. He earned his doctorate in PhysicalThis handbook gives readers a close look at the entire technology of printing very high resolution and high den.
- Hardcover
- Print on Demand
Seller: Brook Bookstore On Demand, Napoli, NA, ItalyBrook Bookstore On Demand
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Condition: new. Questo è un articolo print on demand.
Handbook of Vlsi Microlithography: Principles, Technology and Applications
Glendinning, William B. (Editor)/ Helbert, John N. (Editor)/ Glendinning, William B.
- Hardcover
- Print on Demand
Seller: Revaluation Books, Exeter, , United KingdomRevaluation Books
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Hardcover. Condition: Brand New. 1st edition. 671 pages. 10.00x6.75x2.25 inches. In Stock. This item is printed on demand.
- Hardcover
- Print on Demand
Seller: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, , GermanyBuchWeltWeit Ludwig Meier e.K.
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£ 133.67
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Buch. Condition: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -This handbook gives readers a close look at the entire technology of printing very high resolution and high density integrated circuit (IC) patterns into thin resist process transfer coatings-- including optical lithography, electron beam,… ion beam, and x-ray lithography. The book's main theme is the special printing process needed to achieve volume high density IC chip production, especially in the Dynamic Random Access Memory (DRAM) industry. The book leads off with a comparison of various lithography methods, covering the three major patterning parameters of line/space, resolution, line edge and pattern feature dimension control. The book's explanation of resist and resist process equipment technology may well be the first practical description of the relationship between the resist process and equipment parameters. The basics of resist technology are completely covered -- including an entire chapter on resist process defectivity and the potential yield limiting effect on device production. Each alternative lithographic technique and testing method is considered and evaluated: basic metrology including optical, scanning-electron-microscope (SEM) techniques and electrical test devices, along with explanations of actual printing tools and their design, construction and performance. The editor devotes an entire chapter to today's sophisticated, complex electron-beam printers, and to the emerging x-ray printing technology now used in high-density CMOS devices. Energetic ion particle printing is a controllable, steerable technology that does not rely on resist, and occupies a final section of the handbook. 672 pp. Englisch.
- Hardcover
- Print on Demand
Seller: AHA-BUCH GmbH, Einbeck, GermanyAHA-BUCH GmbH
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£ 111.82
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Buch. Condition: Neu. nach der Bestellung gedruckt Neuware - Printed after ordering - This handbook gives readers a close look at the entire technology of printing very high resolution and high density integrated circuit (IC) patterns into thin resist process transfer coatings-- including optical lithography, electron beam, ion…beam, and x-ray lithography. The book's main theme is the special printing process needed to achieve volume high density IC chip production, especially in the Dynamic Random Access Memory (DRAM) industry. The book leads off with a comparison of various lithography methods, covering the three major patterning parameters of line/space, resolution, line edge and pattern feature dimension control. The book's explanation of resist and resist process equipment technology may well be the first practical description of the relationship between the resist process and equipment parameters. The basics of resist technology are completely covered -- including an entire chapter on resist process defectivity and the potential yield limiting effect on device production. Each alternative lithographic technique and testing method is considered and evaluated: basic metrology including optical, scanning-electron-microscope (SEM) techniques and electrical test devices, along with explanations of actual printing tools and their design, construction and performance. The editor devotes an entire chapter to today's sophisticated, complex electron-beam printers, and to the emerging x-ray printing technology now used in high-density CMOS devices. Energetic ion particle printing is a controllable, steerable technology that does not rely on resist, and occupies a final section of the handbook.
