Isbn: 9780444513397 - Rapid Thermal Processing for Future Semiconductor Devices (13 results)
- Softcover
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Rapid Thermal Processing for Future Semiconductor Devices
Fukuda, Hisashi (EDT); INTERNATIONAL CONFERENCE ON RAPID THERMA
- Softcover
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- Softcover
Seller: Ria Christie Collections, Uxbridge, United KingdomRia Christie Collections
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Condition: New. In English.
Rapid Thermal Processing for Future Semiconductor Devices
Fukuda, Hisashi (EDT); INTERNATIONAL CONFERENCE ON RAPID THERMA
- Softcover
Seller: GreatBookPrices, Columbia, MD, U.S.A.GreatBookPrices
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Rapid Thermal Processing for Future Semiconductor Devices
Fukuda, Hisashi (EDT); INTERNATIONAL CONFERENCE ON RAPID THERMA
- Softcover
Seller: GreatBookPricesUK, Woodford Green, United KingdomGreatBookPricesUK
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Rapid Thermal Processing for Future Semiconductor Devices
Fukuda, Hisashi (EDT); INTERNATIONAL CONFERENCE ON RAPID THERMA
- Softcover
Seller: GreatBookPricesUK, Woodford Green, United KingdomGreatBookPricesUK
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- Softcover
Seller: moluna, Greven, Germanymoluna
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£ 138.80
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Condition: New. A collection of papers which were presented at the 2001 International Conference on Rapid Thermal Processing (RTP 2001) held at Ise Shima, Mie, on November 14-16, 2001. It covers the following areas such as advanced MOS gate stack, integration technologies..
- Softcover
Seller: Books Puddle, New York, NY, U.S.A.Books Puddle
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Condition: New. pp. 164.
- Softcover
Seller: Majestic Books, Hounslow, United KingdomMajestic Books
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Condition: New. pp. 164 Illus.
- Softcover
Seller: AHA-BUCH GmbH, Einbeck, GermanyAHA-BUCH GmbH
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Taschenbuch. Condition: Neu. Neuware - This volume is a collection of papers which were presented at the 2001 International Conference on Rapid Thermal Processing (RTP 2001) held at Ise Shima, Mie, on November 14-16, 2001. This symposium is second conference followed the previous successful first International RTP conference held at Hokkaido in 1997. The RTP 2001 covered the latest developments in RTP and other short-time processing continuously aiming to point out the future direction in the Silicon ULSI devices and II-VI, III-V compound semiconductor devices. This book covers the following areas: advanced MOS gate stack, integration technologies, advancd channel engineering including shallow junction, SiGe, hetero-structure, novel metallization, inter-connect, silicidation, low-k materials, thin dielectrics including gate dielectrics and high-k materials, thin film deposition including SiGe, SOI and SiC, process and device modelling, Laser-assisted crystallization and TFT device fabrication technologies, temperature monitoring and slip-free technologies.…
- Softcover
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Seller: PBShop.store UK, Fairford, GLOS, United KingdomPBShop.store UK
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PAP. Condition: New. New Book. Delivered from our UK warehouse in 4 to 14 business days. THIS BOOK IS PRINTED ON DEMAND. Established seller since 2000.
- Softcover
- Print on Demand
Seller: THE SAINT BOOKSTORE, Southport, United KingdomTHE SAINT BOOKSTORE
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£ 178.80
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Paperback / softback. Condition: New. This item is printed on demand. New copy - Usually dispatched within 5-9 working days.
- Softcover
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Seller: PBShop.store US, Wood Dale, IL, U.S.A.PBShop.store US
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PAP. Condition: New. New Book. Shipped from UK. THIS BOOK IS PRINTED ON DEMAND. Established seller since 2000.
