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paperback. Condition: Very Good. Fast Shipping - Safe and Secure 7 days a week!
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Condition: New.
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Condition: As New. Unread book in perfect condition.
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Die-stacking Architecture (Synthesis Lectures on Computer Architecture)
Seller: Ria Christie Collections, Uxbridge, United Kingdom
Seller rating 5 out of 5 stars
£ 40.27
£ 11.98 shipping
Ships from United Kingdom to U.S.A.Quantity: Over 20 available
Add to basketCondition: New. In English.
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Condition: New. 1st edition NO-PA16APR2015-KAP.
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Die-stacking Architecture
Seller: GreatBookPricesUK, Woodford Green, United Kingdom
Seller rating 5 out of 5 stars
Condition: New.
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Die-stacking Architecture
Seller: GreatBookPricesUK, Woodford Green, United Kingdom
Seller rating 5 out of 5 stars
Condition: As New. Unread book in perfect condition.
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Die-stacking Architecture
Language: English
Published by Springer International Publishing, Springer International Publishing Jun 2015, 2015
ISBN 10: 3031006194 ISBN 13: 9783031006197
Seller: buchversandmimpf2000, Emtmannsberg, BAYE, Germany
Seller rating 5 out of 5 stars
Taschenbuch. Condition: Neu. Neuware -The emerging three-dimensional (3D) chip architectures, with their intrinsic capability of reducing the wire length, promise attractive solutions to reduce the delay of interconnects in future microprocessors. 3D memory stacking enables much higher memory bandwidth for future chip-multiprocessor design, mitigating the 'memory wall' problem. In addition, heterogenous integration enabled by 3D technology can also result in innovative designs for future microprocessors. This book first provides a brief introduction to this emerging technology, and then presents a variety of approaches to designing future 3D microprocessor systems, by leveraging the benefits of low latency, high bandwidth, and heterogeneous integration capability which are offered by 3D technology.Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 128 pp. Englisch.
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Die-stacking Architecture
Language: English
Published by Springer International Publishing, 2015
ISBN 10: 3031006194 ISBN 13: 9783031006197
Taschenbuch. Condition: Neu. Druck auf Anfrage Neuware - Printed after ordering - The emerging three-dimensional (3D) chip architectures, with their intrinsic capability of reducing the wire length, promise attractive solutions to reduce the delay of interconnects in future microprocessors. 3D memory stacking enables much higher memory bandwidth for future chip-multiprocessor design, mitigating the 'memory wall' problem. In addition, heterogenous integration enabled by 3D technology can also result in innovative designs for future microprocessors. This book first provides a brief introduction to this emerging technology, and then presents a variety of approaches to designing future 3D microprocessor systems, by leveraging the benefits of low latency, high bandwidth, and heterogeneous integration capability which are offered by 3D technology.
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Condition: New. Print on Demand.
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Die-stacking Architecture
Language: English
Published by Springer International Publishing Jun 2015, 2015
ISBN 10: 3031006194 ISBN 13: 9783031006197
Seller: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, Germany
Seller rating 5 out of 5 stars
Taschenbuch. Condition: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -The emerging three-dimensional (3D) chip architectures, with their intrinsic capability of reducing the wire length, promise attractive solutions to reduce the delay of interconnects in future microprocessors. 3D memory stacking enables much higher memory bandwidth for future chip-multiprocessor design, mitigating the 'memory wall' problem. In addition, heterogenous integration enabled by 3D technology can also result in innovative designs for future microprocessors. This book first provides a brief introduction to this emerging technology, and then presents a variety of approaches to designing future 3D microprocessor systems, by leveraging the benefits of low latency, high bandwidth, and heterogeneous integration capability which are offered by 3D technology. 128 pp. Englisch.
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Condition: New. PRINT ON DEMAND.
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Die-stacking Architecture
Language: English
Published by Springer, Berlin|Springer International Publishing|Morgan & Claypool|Springer, 2015
ISBN 10: 3031006194 ISBN 13: 9783031006197
Condition: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. The emerging three-dimensional (3D) chip architectures, with their intrinsic capability of reducing the wire length, promise attractive solutions to reduce the delay of interconnects in future microprocessors. 3D memory stacking enables much higher memory b.
