Yi Yasha (20 results)

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  • Language: English

    Published by Springer, 2025

    3031915070 / 9783031915079

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    Seller: Basi6 International, Irving, TX, U.S.A.Basi6 International

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  • Language: English

    Published by Springer, 2025

    3031915070 / 9783031915079

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  • Language: English

    Published by Springer, 2025

    3031915070 / 9783031915079

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  • Language: English

    Published by Springer, 2026

    3031915100 / 9783031915109

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  • Language: English

    Published by Springer Nature, 2025

    3031915070 / 9783031915079

    • Hardcover

    Seller: Revaluation Books, Exeter, United KingdomRevaluation Books

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    Hardcover. Condition: Brand New. 223 pages. 9.44x6.61x9.45 inches. In Stock.

  • Language: English

    Published by Springer, 2026

    3031915100 / 9783031915109

    • Softcover

    Seller: preigu, Osnabrück, Germanypreigu

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    Taschenbuch. Condition: Neu. From 2D to 3D Photonic Integrated Circuits | Yasha Yi | Taschenbuch | Synthesis Lectures on Emerging Engineering Technologies | xv | Englisch | 2026 | Springer | EAN 9783031915109 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]s

  • Language: English

    Published by Springer, 2025

    3031915070 / 9783031915079

    • Hardcover

    Seller: AHA-BUCH GmbH, Einbeck, GermanyAHA-BUCH GmbH

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    Buch. Condition: Neu. Druck auf Anfrage Neuware - Printed after ordering - The integration of photonics and electronics has transformed the landscape of modern technology. At the forefront of this revolution is the development of Photonic Integrated Circuits (PICs). Historically rooted in the traditional 2-D fabrication processe

  • Language: English

    Published by Springer, 2025

    3031915070 / 9783031915079

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    Seller: Brook Bookstore On Demand, Napoli, NA, ItalyBrook Bookstore On Demand

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    Condition: new. Questo è un articolo print on demand.

  • Language: English

    Published by Springer, Berlin, Springer Jun 2026, 2026

    3031915100 / 9783031915109

    • Softcover
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    Seller: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, GermanyBuchWeltWeit Ludwig Meier e.K.

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    Taschenbuch. Condition: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -The integration of photonics and electronics has transformed the landscape of modern technology. At the forefront of this revolution is the development of Photonic Integrated Circuits (PICs). Historically rooted in the traditional 2

  • Language: English

    Published by Springer, Springer Jun 2025, 2025

    3031915070 / 9783031915079

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    Seller: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, GermanyBuchWeltWeit Ludwig Meier e.K.

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    Buch. Condition: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -The integration of photonics and electronics has transformed the landscape of modern technology. At the forefront of this revolution is the development of Photonic Integrated Circuits (PICs). Historically rooted in the traditional 2-D fabr

  • Language: English

    Published by Springer, 2025

    3031915070 / 9783031915079

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    Seller: Majestic Books, Hounslow, United KingdomMajestic Books

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  • Language: English

    Published by Springer, 2026

    3031915100 / 9783031915109

    • Softcover
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    Seller: Majestic Books, Hounslow, United KingdomMajestic Books

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  • Language: English

    Published by Springer, 2025

    3031915070 / 9783031915079

    • Hardcover
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    Seller: Biblios, frankfurt am main, HESSE, GermanyBiblios

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  • Language: English

    Published by Springer, 2026

    3031915100 / 9783031915109

    • Softcover
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    Seller: Biblios, frankfurt am main, HESSE, GermanyBiblios

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  • Language: English

    Published by Springer Verlag GmbH, 2026

    3031915100 / 9783031915109

    • Softcover
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    Seller: moluna, Greven, Germanymoluna

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  • Language: English

    Published by Springer Verlag GmbH, 2025

    3031915070 / 9783031915079

    • Hardcover
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    Seller: moluna, Greven, Germanymoluna

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    Condition: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt.

  • Language: English

    Published by Springer International Publishing AG, Cham, 2025

    3031915070 / 9783031915079

    • Hardcover
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    Seller: CitiRetail, Stevenage, United KingdomCitiRetail

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    Hardcover. Condition: new. Hardcover. The integration of photonics and electronics has transformed the landscape of modern technology. At the forefront of this revolution is the development of Photonic Integrated Circuits (PICs). Historically rooted in the traditional 2-D fabrication processes inherited from electronic Integrate

  • Language: English

    Published by Palgrave Macmillan Jun 2026, 2026

    3031915100 / 9783031915109

    • Softcover
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    Seller: buchversandmimpf2000, Emtmannsberg, BAYE, Germanybuchversandmimpf2000

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    Taschenbuch. Condition: Neu. This item is printed on demand - Print on Demand Titel. Neuware -The integration of photonics and electronics has transformed the landscape of modern technology. At the forefront of this revolution is the development of Photonic Integrated Circuits (PICs). Historically rooted in the traditional 2-D f

  • Language: English

    Published by Springer, Birkhäuser Jun 2025, 2025

    3031915070 / 9783031915079

    • Hardcover
    • Print on Demand

    Seller: buchversandmimpf2000, Emtmannsberg, BAYE, Germanybuchversandmimpf2000

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    Buch. Condition: Neu. This item is printed on demand - Print on Demand Titel. Neuware -The integration of photonics and electronics has transformed the landscape of modern technology. At the forefront of this revolution is the development of Photonic Integrated Circuits (PICs). Historically rooted in the traditional 2-D fabricat

  • Language: English

    Published by Palgrave Macmillan, 2026

    3031915100 / 9783031915109

    • Softcover
    • Print on Demand

    Seller: AHA-BUCH GmbH, Einbeck, GermanyAHA-BUCH GmbH

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    Taschenbuch. Condition: Neu. nach der Bestellung gedruckt Neuware - Printed after ordering - The integration of photonics and electronics has transformed the landscape of modern technology. At the forefront of this revolution is the development of Photonic Integrated Circuits (PICs). Historically rooted in the traditional 2-D fa