Yi Yasha (19 results)

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  • Language: English

    Published by Springer, 2025

    3031915070 / 9783031915079

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  • Language: English

    Published by Springer International Publishing AG, Cham, 2025

    3031915070 / 9783031915079

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    Hardcover. Condition: new. Hardcover. The integration of photonics and electronics has transformed the landscape of modern technology. At the forefront of this revolution is the development of Photonic Integrated Circuits (PICs). Historically rooted in the traditional 2-D fabrication processes inherited from electronic Integrated Circuits, PICs shifted to 3-D configurations, introducing new design philosophies that impact scalability, efficiency, and performance. This convergence of electronic and photonic circuits presents unique challenges and great opportunities.This book provides an introduction to photonic integrated circuits and the transition from 2D to 3D PICs. It then describes design and fabrication techniques of 3D PICs and related challenges and solutions. Finally, applications of 3D photonics, emerging technologies and industry outlook are also discussed. This convergence of electronic and photonic circuits presents unique challenges and great opportunities.This book provides an introduction to photonic integrated circuits and the transition from 2D to 3D PICs. Shipping may be from multiple locations in the US or from the UK, depending on stock availability.…

  • Language: English

    Published by Springer, 2025

    3031915070 / 9783031915079

    • Hardcover

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  • Language: English

    Published by Springer, 2025

    3031915070 / 9783031915079

    • Hardcover

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  • Language: English

    Published by Springer, 2026

    3031915100 / 9783031915109

    • Softcover

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    Taschenbuch. Condition: Neu. Druck auf Anfrage Neuware - Printed after ordering - The integration of photonics and electronics has transformed the landscape of modern technology. At the forefront of this revolution is the development of Photonic Integrated Circuits (PICs). Historically rooted in the traditional 2-D fabrication processes inherited from electronic Integrated Circuits, PICs shifted to 3-D configurations, introducing new design philosophies that impact scalability, efficiency, and performance. This convergence of electronic and photonic circuits presents unique challenges and great opportunities.This book provides an introduction to photonic integrated circuits and the transition from 2D to 3D PICs. It then describes design and fabrication techniques of 3D PICs and related challenges and solutions. Finally, applications of 3D photonics, emerging technologies and industry outlook are also discussed.…

  • Language: English

    Published by Springer, 2025

    3031915070 / 9783031915079

    • Hardcover

    Seller: AHA-BUCH GmbH, Einbeck, GermanyAHA-BUCH GmbH

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    Buch. Condition: Neu. Druck auf Anfrage Neuware - Printed after ordering - The integration of photonics and electronics has transformed the landscape of modern technology. At the forefront of this revolution is the development of Photonic Integrated Circuits (PICs). Historically rooted in the traditional 2-D fabrication processes inherited from electronic Integrated Circuits, PICs shifted to 3-D configurations, introducing new design philosophies that impact scalability, efficiency, and performance. This convergence of electronic and photonic circuits presents unique challenges and great opportunities.This book provides an introduction to photonic integrated circuits and the transition from 2D to 3D PICs. It then describes design and fabrication techniques of 3D PICs and related challenges and solutions. Finally, applications of 3D photonics, emerging technologies and industry outlook are also discussed.…

  • Language: English

    Published by Springer, 2025

    3031915070 / 9783031915079

    • Hardcover

    Seller: Books Puddle, Woodside, NY, U.S.A.Books Puddle

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  • Language: English

    Published by Springer Nature, 2025

    3031915070 / 9783031915079

    • Hardcover

    Seller: Revaluation Books, Exeter, United KingdomRevaluation Books

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    Hardcover. Condition: Brand New. 223 pages. 9.44x6.61x9.45 inches. In Stock.

  • Language: English

    Published by Springer, 2026

    3031915100 / 9783031915109

    • Softcover

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    Taschenbuch. Condition: Neu. From 2D to 3D Photonic Integrated Circuits | Yasha Yi | Taschenbuch | Synthesis Lectures on Emerging Engineering Technologies | xv | Englisch | 2026 | Springer | EAN 9783031915109 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu.…

  • Language: English

    Published by Springer International Publishing AG, Cham, 2025

    3031915070 / 9783031915079

    • Hardcover

    Seller: AussieBookSeller, Truganina, VIC, AustraliaAussieBookSeller

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    Hardcover. Condition: new. Hardcover. The integration of photonics and electronics has transformed the landscape of modern technology. At the forefront of this revolution is the development of Photonic Integrated Circuits (PICs). Historically rooted in the traditional 2-D fabrication processes inherited from electronic Integrated Circuits, PICs shifted to 3-D configurations, introducing new design philosophies that impact scalability, efficiency, and performance. This convergence of electronic and photonic circuits presents unique challenges and great opportunities.This book provides an introduction to photonic integrated circuits and the transition from 2D to 3D PICs. It then describes design and fabrication techniques of 3D PICs and related challenges and solutions. Finally, applications of 3D photonics, emerging technologies and industry outlook are also discussed. This convergence of electronic and photonic circuits presents unique challenges and great opportunities.This book provides an introduction to photonic integrated circuits and the transition from 2D to 3D PICs. Shipping may be from our Sydney, NSW warehouse or from our UK or US warehouse, depending on stock availability.…

  • Language: English

    Published by Springer, 2025

    3031915070 / 9783031915079

    • Hardcover
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    Seller: Brook Bookstore On Demand, Napoli, NA, ItalyBrook Bookstore On Demand

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  • Language: English

    Published by Springer, Berlin, Springer Jun 2026, 2026

    3031915100 / 9783031915109

    • Softcover
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    Seller: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, GermanyBuchWeltWeit Ludwig Meier e.K.

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    Taschenbuch. Condition: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -The integration of photonics and electronics has transformed the landscape of modern technology. At the forefront of this revolution is the development of Photonic Integrated Circuits (PICs). Historically rooted in the traditional 2-D fabrication processes inherited from electronic Integrated Circuits, PICs shifted to 3-D configurations, introducing new design philosophies that impact scalability, efficiency, and performance. This convergence of electronic and photonic circuits presents unique challenges and great opportunities.This book provides an introduction to photonic integrated circuits and the transition from 2D to 3D PICs. It then describes design and fabrication techniques of 3D PICs and related challenges and solutions. Finally, applications of 3D photonics, emerging technologies and industry outlook are also discussed. 208 pp. Englisch. …

  • Language: English

    Published by Springer, Springer Jun 2025, 2025

    3031915070 / 9783031915079

    • Hardcover
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    Seller: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, GermanyBuchWeltWeit Ludwig Meier e.K.

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    Buch. Condition: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -The integration of photonics and electronics has transformed the landscape of modern technology. At the forefront of this revolution is the development of Photonic Integrated Circuits (PICs). Historically rooted in the traditional 2-D fabrication processes inherited from electronic Integrated Circuits, PICs shifted to 3-D configurations, introducing new design philosophies that impact scalability, efficiency, and performance. This convergence of electronic and photonic circuits presents unique challenges and great opportunities.This book provides an introduction to photonic integrated circuits and the transition from 2D to 3D PICs. It then describes design and fabrication techniques of 3D PICs and related challenges and solutions. Finally, applications of 3D photonics, emerging technologies and industry outlook are also discussed. 224 pp. Englisch.…

  • Language: English

    Published by Springer Verlag GmbH, 2026

    3031915100 / 9783031915109

    • Softcover
    • Print on Demand

    Seller: moluna, Greven, Germanymoluna

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  • Language: English

    Published by Springer Verlag GmbH, 2025

    3031915070 / 9783031915079

    • Hardcover
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  • Language: English

    Published by Springer, 2025

    3031915070 / 9783031915079

    • Hardcover
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    Seller: Majestic Books, Hounslow, United KingdomMajestic Books

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  • Language: English

    Published by Springer, 2025

    3031915070 / 9783031915079

    • Hardcover
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    Seller: Biblios, frankfurt am main, HESSE, GermanyBiblios

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  • Language: English

    Published by Palgrave Macmillan Jun 2026, 2026

    3031915100 / 9783031915109

    • Softcover
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    Seller: buchversandmimpf2000, Emtmannsberg, BAYE, Germanybuchversandmimpf2000

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    Taschenbuch. Condition: Neu. This item is printed on demand - Print on Demand Titel. Neuware -The integration of photonics and electronics has transformed the landscape of modern technology. At the forefront of this revolution is the development of Photonic Integrated Circuits (PICs). Historically rooted in the traditional 2-D fabrication processes inherited from electronic Integrated Circuits, PICs shifted to 3-D configurations, introducing new design philosophies that impact scalability, efficiency, and performance. This convergence of electronic and photonic circuits presents unique challenges and great opportunities. This book provides an introduction to photonic integrated circuits and the transition from 2D to 3D PICs. It then describes design and fabrication techniques of 3D PICs and related challenges and solutions. Finally, applications of 3D photonics, emerging technologies and industry outlook are also discussed.Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 224 pp. Englisch.…

  • Language: English

    Published by Springer, Birkhäuser Jun 2025, 2025

    3031915070 / 9783031915079

    • Hardcover
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    Seller: buchversandmimpf2000, Emtmannsberg, BAYE, Germanybuchversandmimpf2000

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    Buch. Condition: Neu. This item is printed on demand - Print on Demand Titel. Neuware -The integration of photonics and electronics has transformed the landscape of modern technology. At the forefront of this revolution is the development of Photonic Integrated Circuits (PICs). Historically rooted in the traditional 2-D fabrication processes inherited from electronic Integrated Circuits, PICs shifted to 3-D configurations, introducing new design philosophies that impact scalability, efficiency, and performance. This convergence of electronic and photonic circuits presents unique challenges and great opportunities.Springer-Verlag KG, Sachsenplatz 4-6, 1201 Wien 224 pp. Englisch.…