From 2D to 3D Photonic Integrated Circuits
Language: English
Published by Palgrave Macmillan Jun 2026, 2026
- Softcover
- New
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This item is printed on demand - Print on Demand Titel. Neuware -The integration of photonics and electronics has transformed the landscape of modern technology. At the forefront of this revolution is the development of Photonic Integrated Circuits (PICs). Historically rooted in the traditional 2-D fabrication processes inherited from electronic Integrated Circuits, PICs shifted to 3-D configurations, introducing new design philosophies that impact scalability, efficiency, and performance. This convergence of electronic and photonic circuits presents unique challenges and great opportunities. This book provides an introduction to photonic integrated circuits and the transition from 2D to 3D PICs. It then describes design and fabrication techniques of 3D PICs and related challenges and solutions. Finally, applications of 3D photonics, emerging technologies and industry outlook are also discussed.Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 224 pp. Englisch.
Seller Inventory # 9783031915109
- Title
- From 2D to 3D Photonic Integrated Circuits
- Author
- Yasha Yi
- Publisher
- Palgrave Macmillan Jun 2026
- Publication year
- 2026
- Condition
- Neu
- Binding
- Taschenbuch
- Language
- English
- ISBN 10
- 3031915100
- ISBN 13
- 9783031915109
- Item weight
- 384 grams
- Dimensions
- 240x168x13 mm
The integration of photonics and electronics has transformed the landscape of modern technology. At the forefront of this revolution is the development of Photonic Integrated Circuits (PICs). Historically rooted in the traditional 2-D fabrication processes inherited from electronic Integrated Circuits, PICs shifted to 3-D configurations, introducing new design philosophies that impact scalability, efficiency, and performance. This convergence of electronic and photonic circuits presents unique challenges and great opportunities.
This book provides an introduction to photonic integrated circuits and the transition from 2D to 3D PICs. It then describes design and fabrication techniques of 3D PICs and related challenges and solutions. Finally, applications of 3D photonics, emerging technologies and industry outlook are also discussed.
"Synopsis" may belong to another edition of this title.
About the Author
Dr. Yi is currently Fellow of Optica (Optical Society of America), a full Professor of Electrical Engineering, was the founding EECE PhD program chair and Provost faculty fellow, University of Michigan, Dearborn campus, and LNF, University of Michigan, Ann Arbor campus. He received the Ph.D. degree from the Massachusetts Institute of Technology (MIT), Cambridge, MA, USA, and was a Post-Doctoral Associate with the MicroPhotonics Center, Massachusetts Institute of Technology, Cambridge, MA, USA, where he was involved in research on integrated nano optoelectronic devices and systems. He had extensive research experiences with the Los Alamos National Laboratory, and the 3M Corporate Research Laboratory. He is also a Professor Affiliate with the Microsystems Technology Laboratory at MIT. He has authored more than hundreds of top journal papers, edited four book/book chapters, and holds 33 issued patents (17 U.S. patents and 16 international patents). He has led several government/industry-funded projects, has been at review panels for NSF, DOE and DOD, and has been a reviewer for leading journals. His research interests are Integrated/Intelligent chips, Renewable energy, Smart micro sensors; Virtual Reality/Augmented Reality, Solid state on-chip Lidar for autonomous driving/UAVs/Robotics; Telecommunications; and Solid state lighting.
"About the title" may belong to another edition of this title.
buchversandmimpf2000
Emtmannsberg, BAYE, Germany
AbeBooks seller since January 23, 2017
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