Xiaoning Qi (14 results)
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- Softcover
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- Softcover
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- Softcover
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- Softcover
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Taschenbuch. Condition: Neu. High Frequency Interconnect Characterization and Modeling | For VLSI On-Chip Interconnects and RF Package Wire Bonds | Xiaoning Qi | Taschenbuch | Einband - flex.(Paperback) | Englisch | 2009 | VDM Verlag Dr. Müller | EAN 9783639130959 | Verantwortliche Person für die EU: OmniScriptum GmbH & Co. KG,…Bahnhofstr. 28, 66111 Saarbrücken, info[at]akademikerverlag[dot]de | Anbieter: preigu.
- Softcover
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- Softcover
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- Softcover
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- Softcover
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- Softcover
- Print on Demand
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PAP. Condition: New. New Book. Shipped from UK. THIS BOOK IS PRINTED ON DEMAND. Established seller since 2000.
- Softcover
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PAP. Condition: New. New Book. Delivered from our UK warehouse in 4 to 14 business days. THIS BOOK IS PRINTED ON DEMAND. Established seller since 2000.
- Softcover
- Print on Demand
Seller: moluna, Greven, Germanymoluna
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Kartoniert / Broschiert. Condition: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Autor/Autorin: Qi XiaoningXiaoning Qi, Ph.D.: Studied Electrical Engineering at StanfordnUniversity. Senior Staff Engineer at Intel Corp. on signal andnpower integrity for semiconductor system…s. He worked on powernintegrity for high speed I/O, proc.
- Softcover
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Seller: AHA-BUCH GmbH, Einbeck, GermanyAHA-BUCH GmbH
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Taschenbuch. Condition: Neu. nach der Bestellung gedruckt Neuware - Printed after ordering - Continuous scaling of transistors combined withincreased chip area results in the ratio of globalwire delay to gate delay increasing at a super-linearrate. Simple RC models have become inadequate forsimulation of VLSI circuits. In additi…on, parasiticinductance and capacitance of IC packages imposelimits on the circuit performance at RF frequencies.This book presents modeling of on-chip inductance forchips with ground grids that emulate those used inreal circuits. S-parameter characterization of testchips up to 10 GHz shows good agreement withsimulation and analytical calculations. On-chip 3-Dcapacitance modeling capabilities for arbitrarilyshaped objects are also presented. In addition, anapproach to fast 3-D modeling of the geometry forbonding wires in RF circuits and packages isdemonstrated. The geometry and an equivalent circuitare presented to model the frequency response ofbonding wires. Excellent agreement between modeledresults and measured data is achieved for frequenciesup to 10 GHz. The book should be useful to thesemiconductor professionals in academia and industry,who are interested in the on-chip and packageinterconnects researches.
