Suresh K P U A (21 results)

Taschenbuch. Condition: Neu. ANFIS Controller Based Energy Management System | A New Topology Of ANFIS Controller Based Energy Management System In Renewable Energy Sources | Suresh K. P. (u. a.) | Taschenbuch | Englisch | 2020 | LAP LAMBERT Academic Publishing | EAN 9786200568601 | Verantwortliche Person für die EU: preigu GmbH & Co. KG, Lengericher Landstr. 19, 49078 Osnabrück, mail[at]preigu[dot]de | Anbieter: preigu.…

Taschenbuch. Condition: Neu. Photovoltaic Based Multilevel Inverter For Grid System | Solar converter | Suresh K. P. (u. a.) | Taschenbuch | 76 S. | Englisch | 2018 | LAP LAMBERT Academic Publishing | EAN 9786139913244 | Verantwortliche Person für die EU: preigu GmbH & Co. KG, Lengericher Landstr. 19, 49078 Osnabrück, mail[at]preigu[dot]de | Anbieter: preigu. …

Taschenbuch. Condition: Neu. Sustainable Procurement in Supply Chain Operations | Sachin K. Mangla (u. a.) | Taschenbuch | Einband - flex.(Paperback) | Englisch | 2021 | CRC Press | EAN 9780367779672 | Verantwortliche Person für die EU: Taylor & Francis Verlag GmbH, Kaufingerstr. 24, 80331 München, gpsr[at]taylorandfrancis[dot]com | Anbieter: preigu. …

Taschenbuch. Condition: Neu. Urban Ecology, Water Quality and Climate Change | Arup K. Sarma (u. a.) | Taschenbuch | Water Science and Technology Library | xviii | Englisch | 2018 | Springer | EAN 9783030090067 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu.…

Taschenbuch. Condition: Neu. Additive Manufacturing for Chemical Sciences and Engineering | Suresh K. Bhargava (u. a.) | Taschenbuch | xiii | Englisch | 2023 | Springer | EAN 9789811922954 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu. …

Taschenbuch. Condition: Neu. Urban Hydrology, Watershed Management and Socio-Economic Aspects | Arup K. Sarma (u. a.) | Taschenbuch | Water Science and Technology Library | xiv | Englisch | 2018 | Springer | EAN 9783319820507 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu. …

Taschenbuch. Condition: Neu. Preclinical cancer models for translational research and drug development | Suresh P. K. (u. a.) | Taschenbuch | xi | Englisch | 2026 | Springer | EAN 9789819757442 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu. …

Taschenbuch. Condition: Neu. ICT and Critical Infrastructure: Proceedings of the 48th Annual Convention of Computer Society of India- Vol I | Hosted by CSI Vishakapatnam Chapter | Suresh Chandra Satapathy (u. a.) | Taschenbuch | Advances in Intelligent Systems and Computing | xx | Englisch | 2013 | Springer | EAN 9783319031064 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu.…

Taschenbuch. Condition: Neu. ICT and Critical Infrastructure: Proceedings of the 48th Annual Convention of Computer Society of India- Vol II | Hosted by CSI Vishakapatnam Chapter | Suresh Chandra Satapathy (u. a.) | Taschenbuch | Advances in Intelligent Systems and Computing | xx | Englisch | 2013 | Springer | EAN 9783319030944 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu.…

Hardcover. Condition: gut. 2019. Encyclopedia of Packaging Materials, Processes, and Mechanics - Set 1: Die-Attach and Wafer Bonding Technology (a 4-Volume Set) In deutscher Sprache. pages.

Condition: New. This is a Brand-new US Edition. This Item may be shipped from US or any other country as we have multiple locations worldwide.

Condition: Brand New. New. US edition. Expediting shipping for all USA and Europe orders excluding PO Box. Excellent Customer Service.

Buch. Condition: Neu. Neuware - Packaging materials, assembly processes, and the detailed understanding of multilayer mechanics have enabled much of the progress in miniaturization, reliability, and functional density achieved by modern electronic, microelectronic, and nanoelectronic products. The design and manufacture of miniaturized packages, providing low-loss electrical and/or optical communication, while protecting the semiconductor chips from environmental stresses and internal power cycling, require a carefully balanced selection of packaging materials and processes. Due to the relative fragility of these semiconductor chips, as well as the underlying laminated substrates and the bridging interconnect, selection of the packaging materials and processes is inextricably bound with the mechanical behavior of the intimately packaged multilayer structures, in all phases of development for traditional, as well as emerging, electronic product categories.The Encyclopedia of Packaging Materials, Processes, and Mechanics, compiled in 8, multi-volume sets, provides comprehensive coverage of the configurations and techniques, assembly materials and processes, modeling and simulation tools, and experimental characterization and validation techniques for electronic packaging. Each of the volumes presents the accumulated wisdom and shared perspectives of leading researchers and practitioners in the packaging of electronic components. The Encyclopedia of Packaging Materials, Processes, and Mechanics will provide the novice and student with a complete reference for a quick ascent on the packaging 'learning curve, ' the practitioner with a validated set of techniques and tools to face every challenge in packaging design and development, and researchers with a clear definition of the state-of-the-art and emerging needs to guide their future efforts. This encyclopedia will, thus, be of great interest to packaging engineers, electronic product development engineers, and product managers, as well as to researchers in the assembly and mechanical behavior of electronic and photonic components and systems. It will be most beneficial to undergraduate and graduate students studying materials, mechanical, electrical, and electronic engineering, with a strong interest in electronic packaging applications.…

Gebunden. Condition: New. KlappentextPackaging materials, assembly processes, and the detailed understanding of multilayer mechanics have enabled much of the progress in miniaturization, reliability, and functional density achieved by modern electronic, microelec.

Condition: Used.

Hardcover. Condition: New. NEW. SHIPS FROM MULTIPLE LOCATIONS. book.

Condition: Used.

Condition: Used.

Hardcover. Condition: Brand New. 1080 pages. 10.08x7.60x2.72 inches. In Stock.

Taschenbuch. Condition: Neu. Photovoltaik-basierter Multilevel-Wechselrichter für Netzsysteme | Solarwandler | Suresh K. P. (u. a.) | Taschenbuch | 68 S. | Deutsch | 2023 | Verlag Unser Wissen | EAN 9786206569497 | Verantwortliche Person für die EU: SIA OmniScriptum Publishing, Brivibas Gatve 197, 1039 RIGA, LETTLAND, customerservice[at]vdm-vsg[dot]de | Anbieter: preigu. …

Buch. Condition: Neu. Preclinical cancer models for translational research and drug development | Suresh P. K. (u. a.) | Buch | xi | Englisch | 2025 | Springer | EAN 9789819757411 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu Print on Demand. …