Encyclopedia of Packaging Materials, Processes, and Mechanics - Set 1: Die-Attach and Wafer Bonding Technology (a 4-Volume Set)

ISBN 10: 9811201110 ISBN 13: 9789811201110
Published by World Scientific Publishing Company, Incorporated, 2019
Language: English
Condition: Used Hardcover

Sold by Biblios, Frankfurt am main, HESSE, Germany

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Used - Hardcover

Condition: Used

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