Shichun Qu (17 results)

hardcover. Condition: Very Good.

Condition: Good. : Este libro trata sobre el empaquetado a nivel de oblea a escala de chip y sus aplicaciones en semiconductores analógicos y de potencia. Cubre aplicaciones analógicas y de semiconductores de potencia. EAN: 9781493954384 Tipo: Libros Categoría: Tecnología Título: Wafer-Level Chip-Scale Packaging Autor: Yong Liu| Shichun Qu Editorial: Springer Idioma: en Páginas: 339 Formato: tapa blanda.…

Condition: Sehr gut. Zustand: Sehr gut | Seiten: 340 | Sprache: Englisch | Produktart: Bücher | Analog and Power Wafer Level Chip Scale Packaging presents a state-of-art and in-depth overview in analog and power WLCSP design, material characterization, reliability and modeling. Recent advances in analog and power electronic WLCSP packaging are presented based on the development of analog technology and power device integration. The book covers in detail how advances in semiconductor content, analog and power advanced WLCSP design, assembly, materials and reliability have co-enabled significant advances in fan-in and fan-out with redistributed layer (RDL) of analog and power device capability during recent years. Since the analog and power electronic wafer level packaging is different from regular digital and memory IC package, this book will systematically introduce the typical analog and power electronic wafer level packaging design, assembly process, materials, reliability and failure analysis, and material selection. Along with new analog and power WLCSP development, the roleof modeling is a key to assure successful package design. An overview of the analog and power WLCSP modeling and typical thermal, electrical and stress modeling methodologies is also presented in the book.…

Paperback. Condition: Brand New. reprint edition. 339 pages. 9.25x6.10x0.80 inches. In Stock.

Condition: New.

Condition: New.

Condition: New.

Hardcover. Condition: Brand New. 322 pages. 9.25x6.25x1.00 inches. In Stock.

Hardcover. Condition: Like New. LIKE NEW. SHIPS FROM MULTIPLE LOCATIONS. book.

Condition: As New. Unread book in perfect condition.

Paperback. Condition: Like New. LIKE NEW. SHIPS FROM MULTIPLE LOCATIONS. book.

Condition: new. Questo è un articolo print on demand.

Condition: new. Questo è un articolo print on demand.

Kartoniert / Broschiert. Condition: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Covers the development of wafer level power discrete packaging with regular wafer level design concept and directly bumping technologyIntroduces the development of the analog and power SIP/3D/TSV/stack die packaging technologyPresents the w.…

Gebunden. Condition: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Covers the development of wafer level power discrete packaging with regular wafer level design concept and directly bumping technologyIntroduces the development of the analog and power SIP/3D/TSV/stack die packaging technologyPresents the w.…

Condition: New. Print on Demand.

Condition: New. PRINT ON DEMAND.