Wafer-Level Chip-Scale Packaging
Language: English
Published by Springer New York, 2014
- Hardcover
- New
Condition: New
£ 124.43
Quantity: Over 20 available
Add to basketItem description from seller
Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Covers the development of wafer level power discrete packaging with regular wafer level design concept and directly bumping technologyIntroduces the development of the analog and power SIP/3D/TSV/stack die packaging technologyPresents the w.
Seller Inventory # 4214160
- Title
- Wafer-Level Chip-Scale Packaging
- Author
- Shichun Qu|Yong Liu
- Publisher
- Springer New York
- Publication year
- 2014
- Condition
- New
- Binding
- Gebunden
- Language
- English
- ISBN 10
- 149391555X
- ISBN 13
- 9781493915552
"Synopsis" may belong to another edition of this title.
From the Back Cover
This book presents a state-of-art and in-depth overview in analog and power WLCSP design, material characterization, reliability, and modeling. Recent advances in analog and power electronic WLCSP packaging are presented based on the development of analog technology and power device integration. The book covers in detail how advances in semiconductor content, analog and power advanced WLCSP design, assembly, materials, and reliability have co-enabled significant advances in fan-in and fan-out with redistributed layer (RDL) of analog and power device capability during recent years. Along with new analog and power WLCSP development, the role of modeling is a key to assure successful package design. An overview of the analog and power WLCSP modeling and typical thermal, electrical, and stress modeling methodologies is also provided.
This book also:
· Covers the development of wafer-level power discrete packaging with regular wafer-level design concepts and directly bumping technology
· Introduces the development of the analog and power SIP/3D/TSV/stack die packaging technology
· Presents the wafer-level analog IC packaging design through fan-in and fan-out with RDLs
"About the title" may belong to another edition of this title.
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| Item | 16 to 45 business days | 16 to 45 business days |
|---|---|---|
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