Rahn Armin (21 results)

Condition: new.

Condition: New.

Condition: As New. Unread book in perfect condition.

HRD. Condition: New. New Book. Shipped from UK. Established seller since 2000.

Condition: New. In English.

Condition: New.

Condition: As New. Unread book in perfect condition.

Hardback. Condition: New. Based upon practical experience, it treats the entire joining technology in the electronics production cycle as it relates to soldering--including cleaning, statistical quality control, through-hole and S M joining. Promotes an understanding of the complex interrelations of various process parameters to lead readers to an analysis and resolution of this manufacturing procedure.…

Condition: New.

Condition: New. Describing the different soldering methods in use today, this guide presents both their theory and practical applications. It covers the topics of cleaning, statistical quality control, through-hole and joining. The author relates all theory to practical, on-site situations. Num Pages: 400 pages, index. BIC Classification: TDM; TGX; TNT. Category: (P) Professional & Vocational; (XV) Technical / Manuals. Dimension: 236 x 163 x 28. Weight in Grams: 696. . 1993. 1st Edition. Hardcover. . . . .…

Hardback. Condition: New. Based upon practical experience, it treats the entire joining technology in the electronics production cycle as it relates to soldering--including cleaning, statistical quality control, through-hole and S M joining. Promotes an understanding of the complex interrelations of various process parameters to lead readers to an analysis and resolution of this manufacturing procedure.…

Hardcover. Condition: Brand New. 400 pages. 9.50x6.50x1.00 inches. In Stock.

Condition: New. Describing the different soldering methods in use today, this guide presents both their theory and practical applications. It covers the topics of cleaning, statistical quality control, through-hole and joining. The author relates all theory to practical, on-site situations. Num Pages: 400 pages, index. BIC Classification: TDM; TGX; TNT. Category: (P) Professional & Vocational; (XV) Technical / Manuals. Dimension: 236 x 163 x 28. Weight in Grams: 696. . 1993. 1st Edition. Hardcover. . . . . Books ship from the US and Ireland.…

geheftet. Condition: Sehr gut. unpag. ca. 120 S. Abb. Einband etw. berieben, ansonsten sehr gut erhalten. Sprache: Deutsch Gewicht in Gramm: 1001.

Pappband, Gr. 8°, 174 S., Einband leichte Kratzer, Ecken und Kanten bestoßen, Einband leicht verzogen, sonst in Ordnung.

Condition: Sehr gut. 1. Aufl... Gr.8° 174 Seiten, 26 Abbildungen, 46 Tabellen; Orig.-Glanzfolienpappband; 520g; [Deutsch]; unscheinbare Delle an hinterer Stehkante, sonst kaum Gebrauchsspuren 1. Auflage; _ xXx_. BUCH.

Condition: gut. 2004. Bleifrei Löten. Ein Leitfaden für die Praxis. In deutscher Sprache. pages.

Condition: gut. 2014. Handbuch der Prozess- und Lötfehler In deutscher Sprache. pages.

Hardcover. Condition: new. Hardcover. Based upon practical experience, it treats the entire joining technology in the electronics production cycle as it relates to soldering--including cleaning, statistical quality control, through-hole and S M joining. Promotes an understanding of the complex interrelations of various process parameters to lead readers to an analysis and resolution of this manufacturing procedure. Based upon practical experience, it treats the entire joining technology in the electronics production cycle as it relates to soldering--including cleaning, statistical quality control, through-hole and S M joining. Promotes an understanding of the complex interrelations of various process parameters to lead readers to an analysis and resolution of this manufacturing procedure. This item is printed on demand. Shipping may be from our UK warehouse or from our Australian or US warehouses, depending on stock availability.…

Condition: New. pp. 400 This item is printed on demand.

Hardcover. Condition: Brand New. 400 pages. 9.50x6.50x1.00 inches. In Stock. This item is printed on demand.