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Pao Yi Hsin (5 results)
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Solder Joint Reliability of BGA, CSP, Flip Chip, and Fine Pitch SMT Assemblies
Language: English
Published by McGraw-Hill Professional, 1996
ISBN 10: 0070366489 ISBN 13: 9780070366480
Condition: very good. Gently used. May include previous owner's signature or bookplate on the front endpaper, sticker on back and/or remainder mark on text block.
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Solder Joint Reliability of BGA, CSP, Flip Chip, and Fine Pitch SMT Assemblies
Language: English
Published by McGraw-Hill Professional, 1996
ISBN 10: 0070366489 ISBN 13: 9780070366480
Hardcover. Condition: Fair. No Jacket. Readable copy. Pages may have considerable notes/highlighting. ~ ThriftBooks: Read More, Spend Less.
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Solder Joint Reliability of BGA, CSP, Flip Chip, and Fine Pitch SMT Assemblies
Language: English
Published by McGraw-Hill Professional, 1996
ISBN 10: 0070366489 ISBN 13: 9780070366480
Hardcover. Condition: Good. No Jacket. Pages can have notes/highlighting. Spine may show signs of wear. ~ ThriftBooks: Read More, Spend Less.
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Solder Joint Reliability of BGA, CSP, Flip Chip, and Fine Pitch SMT Assemblies
Language: English
Published by McGraw-Hill Professional, 1996
ISBN 10: 0070366489 ISBN 13: 9780070366480
Hardcover. Condition: Very Good. No Jacket. May have limited writing in cover pages. Pages are unmarked. ~ ThriftBooks: Read More, Spend Less.
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Solder Joint Reliability of Bga, Csp, Flip Chip, and Fine Pitch Smt Assemblies
Language: English
Published by Blacklick, Ohio, U.S.A.: McGraw-Hill, 1996
ISBN 10: 0070366489 ISBN 13: 9780070366480
Hardcover. Condition: Near Fine. No Jacket. hardback book in near fine condition.
