Solder Joint Reliability of BGA, CSP and Flip Chip Assemblies (Electronic Packaging & Interconnection Series)

5 avg rating
( 1 ratings by GoodReads )
 
9780070366480: Solder Joint Reliability of BGA, CSP and Flip Chip Assemblies (Electronic Packaging & Interconnection Series)

This new volume by interconnection expert on solder joints, Johns H. Lau, deals with BGA, CSP, Flip Chips, and other new technologies that underlie the electronics industry's need for smaller, faster products. Naturally, as ever-smaller products are created, the reliability of the solder joints that bind them becomes increasingly crucial. Balancing concepts and practical applications, the authors explain the fundamentals of solder joint reliability and present creative, robust packaging techniques for cost-effective interconnection.

"synopsis" may belong to another edition of this title.

Product Description:

Dealing with BGA, CSP, flip chips and other new technologies that underlie the electronics industry's need for smaller, faster products, this text explains the fundamentals of solder joint reliability and presents creative, robust packaging techniques for cost-effective interconnection.

From the Back Cover:

The explosive growth of high-density packaging has created a tremendous impact on the electronic assembly and manufacturing industry. Ball grid array (BGA), chip-scale package (CSP), and solder-bumped flip chip technologies are taking the lead in this advanced manufacturing process. Many major equipment makers and leading electronic companies are now gearing up for these emerging and advanced packaging technologies. For these technologies, solder is the electrical and mechanical "glue," and thus solder joint reliability is one of the most critical issues in the development of these technologies. This book is a one-stop guide to the state of the art of solder joint reliability problem-solving methods, or choose a creative, high-performance, robust, and cost-effective design and high-yield manufacturing process for their interconnect systems will be able to do so with this unique sourcebook. It meets the reference needs of design, material, process, equipment, manufacturing, quality control, product assurance, reliability, component, packaging, vendor, marketing, and system engineers, and technical managers working in electronic packaging and interconnection. This book is structured to provide readers with the necessary know-how for practical, on-the-job problem-solving guidance. The book covers the solder joint reliability of BGA, CSP, flip chip, and FPT assemblies completely, proceeding from the theoretical basics to applications. Specific areas covered include: Definition of reliability, life distribution, failure rate, mean time to failure, etc.; Some well-known life distributions; Accelerated testing; Parameter estimation of life distributions; Acceleration factors for solders; Solder mechanics: plasticity, creep, and constitutive equations; Design, material, and manufacturing processes of BGA, CSP, flip chip, and FTP; Failure analysis and root cause of failure for BGA, CSP, flip chip, and FPT solder joints; Design for reliability of BGA, CSP, flip chip and FPT solder joints; Solder joint reliability of CBGA, PBGA, DBGA, and TBGA assemblies under thermal fatigue, mechanical bending and twisting, and shock and vibration conditions; solder joint reliability of flip chip (e.g., high-temperature and eutectic solder bumped flip chips on ceramic and PCB) assemblies under thermal fatigue, mechanical pulling, shearing, bending and twisting, and shock and vibration conditions; Solder joint reliability of CSP (e.g., LG Semicon's, Mitsubishi's, Motorola's, Tessera's, NEC's, nitto Denko's and Toshiba's) assemblies under thermal fatigue and mechanical bending conditions; Solder joint reliability of PQFP and TSOP assemblies under thermal fatigue, mechanical bending and twisting, and vibration conditions.

"About this title" may belong to another edition of this title.

Top Search Results from the AbeBooks Marketplace

1.

Lau, John H.; Pao, Yi-Hsin
Published by McGraw-Hill Professional
ISBN 10: 0070366489 ISBN 13: 9780070366480
New Hardcover Quantity Available: 1
Seller
Your Online Bookstore
(Houston, TX, U.S.A.)
Rating
[?]

Book Description McGraw-Hill Professional. Hardcover. Book Condition: New. 0070366489 Ships promptly from Texas. Bookseller Inventory # AUD7410LPLC033116H0207A

More Information About This Seller | Ask Bookseller a Question

Buy New
49.19
Convert Currency

Add to Basket

Shipping: FREE
Within U.S.A.
Destination, Rates & Speeds

2.

Lau, John H., Pao, Yi-Hsin
Published by McGraw-Hill Professional (1996)
ISBN 10: 0070366489 ISBN 13: 9780070366480
New Hardcover Quantity Available: 3
Seller
Murray Media
(North Miami Beach, FL, U.S.A.)
Rating
[?]

Book Description McGraw-Hill Professional, 1996. Hardcover. Book Condition: New. Bookseller Inventory # P110070366489

More Information About This Seller | Ask Bookseller a Question

Buy New
50.96
Convert Currency

Add to Basket

Shipping: 2.40
Within U.S.A.
Destination, Rates & Speeds

3.

John H. Lau, Yi-Hsin Pao
Published by McGraw-Hill Professional (1996)
ISBN 10: 0070366489 ISBN 13: 9780070366480
New Hardcover Quantity Available: 1
Seller
Ergodebooks
(RICHMOND, TX, U.S.A.)
Rating
[?]

Book Description McGraw-Hill Professional, 1996. Hardcover. Book Condition: New. 1. Bookseller Inventory # DADAX0070366489

More Information About This Seller | Ask Bookseller a Question

Buy New
68.06
Convert Currency

Add to Basket

Shipping: 3.20
Within U.S.A.
Destination, Rates & Speeds

4.

John H. Lau; Yi-Hsin Pao
Published by McGraw-Hill Professional (1996)
ISBN 10: 0070366489 ISBN 13: 9780070366480
New Hardcover Quantity Available: 1
Seller
Irish Booksellers
(Rumford, ME, U.S.A.)
Rating
[?]

Book Description McGraw-Hill Professional, 1996. Hardcover. Book Condition: New. book. Bookseller Inventory # 0070366489

More Information About This Seller | Ask Bookseller a Question

Buy New
71.73
Convert Currency

Add to Basket

Shipping: FREE
Within U.S.A.
Destination, Rates & Speeds