Solder Joint Reliability of BGA, CSP, Flip Chip, and Fine Pitch SMT Assemblies

Lau, John H., Pao, Yi-Hsin

ISBN 10: 0070366489 ISBN 13: 9780070366480
Published by McGraw-Hill Professional, 1996
Language: English
Condition: Used - Very good Hardcover

Sold by PAPER CAVALIER UK, London, United Kingdom

AbeBooks Seller since 10 January 2017

Seller rating 4 out of 5 stars 4-star rating, Learn more about seller ratings

View this seller's items


Used - Hardcover

Condition: Used - Very good

Price:
£ 16.79
£ 6 shipping
Ships from United Kingdom to U.S.A.

Quantity: 1 available

Add to basket