Solder Joint Reliability of Bga, Csp, Flip Chip, and Fine Pitch Smt Assemblies

Lau, John H.; Pao, Yi-Hsin

ISBN 10: 0070366489 ISBN 13: 9780070366480
Published by Blacklick, Ohio, U.S.A.: McGraw-Hill, 1996
Language: English
Condition: Used - Near fine Hardcover

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Used - Hardcover

Condition: Used - Near fine

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