Order Total (1 Item Items):
Shipping Destination:
Noia Brandon Chakrabarty Krishnendu (9 results)
Feedback
Skip to main search results
Search filters
Product Type
- All Product Types
- Books (9)
- Magazines & Periodicals (No further results match this refinement)
- Comics (No further results match this refinement)
- Sheet Music (No further results match this refinement)
- Art, Prints & Posters (No further results match this refinement)
- Photographs (No further results match this refinement)
- Maps (No further results match this refinement)
- Manuscripts & Paper Collectibles (No further results match this refinement)
Condition Learn more
- New (7)
- As New, Fine or Near Fine (2)
- Very Good or Good (No further results match this refinement)
- Fair or Poor (No further results match this refinement)
- As Described (No further results match this refinement)
Binding
Collectible Attributes
- First Edition (No further results match this refinement)
- Signed (No further results match this refinement)
- Dust Jacket (No further results match this refinement)
- Seller-Supplied Images (2)
- Not Print on Demand (7)
Language (1)
Price
- Any Price
- Under £ 20 (No further results match this refinement)
- £ 20 to £ 35 (No further results match this refinement)
- Over £ 35
Free Shipping
Seller Location
Seller Rating
-
Condition: New. SUPER FAST SHIPPING.
-
Condition: New.
-
Condition: New.
-
Design-for-Test and Test Optimization Techniques for TSV-based 3D Stacked ICs
Seller: Ria Christie Collections, Uxbridge, United Kingdom
Seller rating 5 out of 5 stars
£ 94.13
Convert currency£ 11.98 shipping from United Kingdom to U.S.A.Quantity: Over 20 available
Add to basketCondition: New. In.
-
£ 129.01
Convert currency£ 25 shipping from United Kingdom to U.S.A.Quantity: 2 available
Add to basketHardcover. Condition: Brand New. 2014 edition. 274 pages. 9.50x6.50x0.75 inches. In Stock.
-
£ 141
Convert currency£ 25 shipping from United Kingdom to U.S.A.Quantity: 1 available
Add to basketHardcover. Condition: Like New. Like New. book.
-
£ 154
Convert currency£ 25 shipping from United Kingdom to U.S.A.Quantity: 1 available
Add to basketPaperback. Condition: Like New. Like New. book.
-
Design-for-Test and Test Optimization Techniques for TSV-based 3D Stacked ICs
Published by Springer International Publishing, 2013
ISBN 10: 3319023772 ISBN 13: 9783319023779
Language: English
£ 80.24
Convert currency£ 42.41 shipping from Germany to U.S.A.Quantity: Over 20 available
Add to basketCondition: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Provides a comprehensive guide to the challenges and solutions for the testing of TSV-based 3D stacked ICsIncludes in-depth explanation of key test and design-for-test technologies, emerging standards, and test- architecture and test-schedule opti.
-
Design-for-Test and Test Optimization Techniques for TSV-based 3D Stacked ICs
Published by Springer International Publishing, 2016
ISBN 10: 3319345346 ISBN 13: 9783319345345
Language: English
£ 82.37
Convert currency£ 42.41 shipping from Germany to U.S.A.Quantity: Over 20 available
Add to basketCondition: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Provides a comprehensive guide to the challenges and solutions for the testing of TSV-based 3D stacked ICsIncludes in-depth explanation of key test and design-for-test technologies, emerging standards, and test- architecture and test-schedule opti.
