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Hardcover. Condition: Good. 2002 printing. Book has light wear to the edges and corners, light rubbing to covers, with sporadic light pencil marks and five pages of highlighting, otherwise in good condition. Well-bound with bright and crisp pages.
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Condition: New. 1st ed. 2020 edition NO-PA16APR2015-KAP.
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Condition: Very Good. Very Good; Hardcover; Covers are still glossy; Unblemished textblock edges; The endpapers and all text pages are clean and unmarked; The binding is excellent with a straight spine; This book will be shipped in a sturdy cardboard box with foam padding; Medium-Large Format (Quatro, 9.75" - 10.75" tall); Purple and yellow covers with title in whtie and blue lettering; 2002, Newnes Publishing; 288 pages; "Reflow Soldering Processes," by Ning-Cheng Lee PhD.
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Electronics Manufacturing : with Lead-Free, Halogen-Free, and Conductive-Adhesive Materials
Language: English
Published by McGraw-Hill Professional, 2002
ISBN 10: 0071386246 ISBN 13: 9780071386241
Hardcover. Condition: Like New. LIKE NEW. SHIPS FROM MULTIPLE LOCATIONS. book.
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Assembly and Reliability of Lead-Free Solder Joints
Language: English
Published by Springer Nature Singapore, Springer Nature Singapore, 2021
ISBN 10: 9811539227 ISBN 13: 9789811539220
Taschenbuch. Condition: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book focuses on the assembly and reliability of lead-free solder joints. Both the principles and engineering practice are addressed, with more weight placed on the latter. This is achieved by providing in-depth studies on a number of major topics such as solder joints in conventional and advanced packaging components, commonly used lead-free materials, soldering processes, advanced specialty flux designs, characterization of lead-free solder joints, reliability testing and data analyses, design for reliability, and failure analyses for lead-free solder joints. Uniquely, the content not only addresses electronic manufacturing services (EMS) on the second-level interconnects, but also packaging assembly on the first-level interconnects and the semiconductor back-end on the 3D IC integration interconnects. Thus, the book offers an indispensable resource for the complete food chain of electronics products.
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Paperback. Condition: Brand New. 548 pages. 9.25x6.10x0.94 inches. In Stock.
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Condition: New.
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Assembly and Reliability of Lead-Free Solder Joints
Language: English
Published by Springer Nature Singapore, Springer Nature Singapore, 2020
ISBN 10: 9811539197 ISBN 13: 9789811539190
Buch. Condition: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book focuses on the assembly and reliability of lead-free solder joints. Both the principles and engineering practice are addressed, with more weight placed on the latter. This is achieved by providing in-depth studies on a number of major topics such as solder joints in conventional and advanced packaging components, commonly used lead-free materials, soldering processes, advanced specialty flux designs, characterization of lead-free solder joints, reliability testing and data analyses, design for reliability, and failure analyses for lead-free solder joints. Uniquely, the content not only addresses electronic manufacturing services (EMS) on the second-level interconnects, but also packaging assembly on the first-level interconnects and the semiconductor back-end on the 3D IC integration interconnects. Thus, the book offers an indispensable resource for the complete food chain of electronics products.
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Hardcover. Condition: New. NEW. SHIPS FROM MULTIPLE LOCATIONS. book.
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hardcover. Condition: Good. Good. Dust Jacket NOT present. CD WILL BE MISSING. . SHIPS FROM MULTIPLE LOCATIONS. book.
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Condition: Brand New. New. US edition. Print on demand title. Delivery takes 20-25 days.
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Condition: Brand New. New. US edition. Print on demand title. Delivery takes 20-25 days.
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Assembly and Reliability of Lead-Free Solder Joints
Language: English
Published by Springer Nature Singapore Mai 2021, 2021
ISBN 10: 9811539227 ISBN 13: 9789811539220
Seller: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, Germany
Seller rating 5 out of 5 stars
Taschenbuch. Condition: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -This book focuses on the assembly and reliability of lead-free solder joints. Both the principles and engineering practice are addressed, with more weight placed on the latter. This is achieved by providing in-depth studies on a number of major topics such as solder joints in conventional and advanced packaging components, commonly used lead-free materials, soldering processes, advanced specialty flux designs, characterization of lead-free solder joints, reliability testing and data analyses, design for reliability, and failure analyses for lead-free solder joints. Uniquely, the content not only addresses electronic manufacturing services (EMS) on the second-level interconnects, but also packaging assembly on the first-level interconnects and the semiconductor back-end on the 3D IC integration interconnects. Thus, the book offers an indispensable resource for the complete food chain of electronics products. 552 pp. Englisch.
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Assembly and Reliability of Lead-Free Solder Joints
Language: English
Published by Springer, Berlin|Springer Nature Singapore|Springer, 2021
ISBN 10: 9811539227 ISBN 13: 9789811539220
Condition: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. This book focuses on the assembly and reliability of lead-free solder joints. Both the principles and engineering practice are addressed, with more weight placed on the latter. This is achieved by providing in-depth studies on a number of major topics su.
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Condition: New. Print on Demand.
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Gebunden. Condition: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Offers an exclusive overview of packages and materials available for specified characteristicsIncludes in-depth of mechanism analysisCovers novel materials, including solder alloys and fluxes for advanced applicationsAddresses reliab.
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Condition: New. PRINT ON DEMAND.
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Assembly and Reliability of Lead-Free Solder Joints
Language: English
Published by Springer Nature Singapore Mai 2020, 2020
ISBN 10: 9811539197 ISBN 13: 9789811539190
Seller: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, Germany
Seller rating 5 out of 5 stars
Buch. Condition: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -This book focuses on the assembly and reliability of lead-free solder joints. Both the principles and engineering practice are addressed, with more weight placed on the latter. This is achieved by providing in-depth studies on a number of major topics such as solder joints in conventional and advanced packaging components, commonly used lead-free materials, soldering processes, advanced specialty flux designs, characterization of lead-free solder joints, reliability testing and data analyses, design for reliability, and failure analyses for lead-free solder joints. Uniquely, the content not only addresses electronic manufacturing services (EMS) on the second-level interconnects, but also packaging assembly on the first-level interconnects and the semiconductor back-end on the 3D IC integration interconnects. Thus, the book offers an indispensable resource for the complete food chain of electronics products. 552 pp. Englisch.
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Condition: New. Print on Demand.
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Condition: New. PRINT ON DEMAND.
