Reflow Soldering Processes

Lee PhD, Ning-Cheng

ISBN 10: 0750672188 / ISBN 13: 9780750672184

Published by Newnes, 2002

Very Good. Dust Jacket may NOT BE INCLUDED.CDs may be missing. SHIPS FROM MULTIPLE LOCATIONS. Seller Inventory # ERICA82907506721883

Synopsis:

Focused on technological innovations in the field of electronics packaging and production, this book elucidates the changes in reflow soldering processes, its impact on defect mechanisms, and, accordingly, the troubleshooting techniques during these processes in a variety of board types. Geared toward electronics manufacturing process engineers, design engineers, as well as students in process engineering classes, Reflow Soldering Processes and Troubleshooting will be a strong contender in the continuing skill development market for manufacturing personnel. Written using a very practical, handson approach, Reflow Soldering Processes and Troubleshooting provides the means for engineers to increase their understanding of the principles of soldering, flux, and solder paste technology. The author facilitates learning about other essential topics, such as area array packagesincluding BGA, CSP, and FC designs, bumping technique, assembly, and rework process, and provides an increased understanding of the reliability failure modes of soldered SMT components. With cost effectiveness foremost in mind, this book is designed to troubleshoot errors or problems before boards go into the manufacturing process, saving time and money on the front end. The author's vast expertise and knowledge ensure that coverage of topics is expertly researched, written, and organized to best meet the needs of manufacturing process engineers, students, practitioners, and anyone with a desire to learn more about reflow soldering processes. Comprehensive and indispensable, this book will prove a perfect training and reference tool that readers will find invaluable.

Review: This excellent book on reflow soldering, by noted expert Doctor Ning-Cheng Lee, offers a unique approach that will be invaluable to anyone concerned with the practical applications of microelectronics packaging. - FlipChips Dot Com
Dr. Lee makes good use of the large (7 by 10 inch) format to place multiple graphics on almost every page. At less than one inch thick, this 280-page book can be easily slipped into an ordinary briefcase, and carried without muscle strain. - FlipChips Dot Com
An extensive list of references to technical literature follows each chapter, although only a specialist or a nut case would need to dig deeper than the material included in Dr. Lee's book. My major criticism of the book is that the title doesn't do full justice to Dr. Lee's unique approach. "Troubleshooting Reflow Soldering for Health and Happiness" would be my choice. - FlipChips Dot Com

...tool for those involved in reflow soldering surface mounted electronics devices. -SMT, April 2002

Lee is a well-known authority on soldering science, and is the author of numerous technical papers and studies. -SMT, April 2002

Bibliographic Details

Title: Reflow Soldering Processes
Publisher: Newnes
Publication Date: 2002
Binding: hardcover
Condition: Very Good
Dust Jacket Condition: Dust Jacket Included
Book Type: book