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Electronics Manufacturing: with Lead-Free, Halogen-Free, and Conductive-Adhesive Materials - Hardcover

 
9780071386241: Electronics Manufacturing: with Lead-Free, Halogen-Free, and Conductive-Adhesive Materials
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Hardcover. Pub Date: 2002 08 Pages: 700 Publisher: McGraw-Hill Professional AN ENGINEER's Guidebook demonstrating non-toxic Electronics Manufacturing Processes

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Review:
"An excellent book in Flip Chip Technologies, March 2, 2000 Reviewer: David Young from Boston, MA I bought this book at NEPCON West on February 29 and read it on my way home to Boston. I like it very much! This book covers all the important subjects (many of those I am not aware of) on low-cost flip chip Technologies. Also, for each subject, useful data, technical know-how, and engineering analyses are presented. I strongly recommend it to everyone who is working in electronic packaging and interconnections. I am sure you will find it useful! Online reader review of Lau's Low Cost Flip Chip Technologies
From the Back Cover:
ELECTRONICS MANUFACTUIRNG WITH LEAD-FREE, HALOGEN-FREE, AND CONDUCTIVE-ADHESTIVE MATERIALS

This comprehensive guide provides cutting edge information on lead-free, halogen-free, and conductive-adhesive technologies and their application to low-cost, high-density, reliable, and green products. Essential for electronics manufacturing and packaging professionals who wish to master lead-free, halogen-free, and conductive-adhesive problem solving methods, and those demanding cost-effective designs and high-yield environmental benign manufacturing processes, this valuable reference covers all aspects of this fast-growing field.

Written for design, materials, process, equipment, manufacturing, reliability, component, packaging, and system engineers, and technical and marketing managers in electronics and photonics packaging and interconnection, this book teaches a practical understanding of the cost, design, materials, process, equipment, manufacturing, and reliability issues of lead-free, halogen-free, and conductive-adhesive technologies. Among the topics explored:


* Chip (wafer) level interconnects with lead-free solder bumps
* Lead-free solder wafer bumping with micro-ball mounting and paste printing methods
* Lead-free solder joint reliability of WLCSPs on organic and ceramic substrates
* Chip (wafer) level interconnects with solderless bumps such as Ni-Au, Au, and Cu, Cu wires, Au wires, Au studs, and Cu studs
* Design, materials, process, and reliability of WLCSPs with solderless interconnects on PCB/substrate
* Halogen-free molding compounds for PQFP, PBGA, and MAP-PBGA packages
* Environmentally benign die-attach films for PQFP and PBGA packages and lead-free die-attach bonding techniques for IC packaging
* Environmental issues for conventional PCBs and substrates
* Some environmentally conscious flame-retardants for PCBs and organic substrates
* Emerging technologies for fabricating environmental friendly PCBs such as design for environment, green PCB manufacturing, and environmental safety
* Lead-free soldering activities such as legislation, consortia programs, and regional preferences on lead-free solder alternatives
* Criteria, development approaches, and varieties of alloys and properties of lead-free solders
* Physical, mechanical, chemical, electrical, and soldering properties of lead-free solders
* Manufacturing process and performance of lead-free surface finishes for both PCB and component applications
* Implementation and execution challenges of lead-free soldering, especially for the reflow and wave soldering process
* Fundamental understanding of electrically conductive adhesive (ECA) technology
* Effects of lubricant removal and cure shrinkage on ECAs
* Mechanisms underlying the contact resistance shifts of ECAs
* Effects of electrolytes and moisture absorption on contact resistance shifts of ECAs
* Stabilization of contact resistance of ECAs using various additives

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  • PublisherMcGraw Hill
  • Publication date2002
  • ISBN 10 0071386246
  • ISBN 13 9780071386241
  • BindingHardcover
  • Number of pages700

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John H. Lau/ C.P. Wong/ Ning-Cheng Lee/ Ricky S.W. Lee
Published by McGraw-Hill (2002)
ISBN 10: 0071386246 ISBN 13: 9780071386241
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Lau, John; Wong, C.P.; Lee, Ning-Cheng; Lee, Ricky
Published by McGraw Hill (2002)
ISBN 10: 0071386246 ISBN 13: 9780071386241
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