Seller: Universitätsbuchhandlung Herta Hold GmbH, Berlin, Germany
XIX, 208 p. Hardcover. Versand aus Deutschland / We dispatch from Germany via Air Mail. Einband bestoßen, daher Mängelexemplar gestempelt, sonst sehr guter Zustand. Imperfect copy due to slightly bumped cover, apart from this in very good condition. Stamped. Sprache: Englisch.
Language: German
Published by Editura Didactica Si Pedagogica, Bukarest, 1973
Seller: Lektor e.K., Hainburg, Germany
First Edition
Gebunden. Condition: Second Hand. Dust Jacket Condition: Kein Schutzumschlag. 1. Auflage. Text in Rumänisch.
Condition: New.
Seller: Ria Christie Collections, Uxbridge, United Kingdom
£ 96.88
Quantity: Over 20 available
Add to basketCondition: New. In.
Seller: Ria Christie Collections, Uxbridge, United Kingdom
£ 96.88
Quantity: Over 20 available
Add to basketCondition: New. In.
Condition: New. pp. 208.
Condition: New. pp. XIX, 208 136 illus., 134 illus. in color. 1 Edition NO-PA16APR2015-KAP.
Seller: Revaluation Books, Exeter, United Kingdom
Paperback. Condition: Brand New. 228 pages. 9.25x6.10x0.54 inches. In Stock.
Seller: Revaluation Books, Exeter, United Kingdom
Hardcover. Condition: Brand New. 230 pages. 9.25x6.10x0.67 inches. In Stock.
Language: English
Published by Springer International Publishing, 2020
ISBN 10: 3030200531 ISBN 13: 9783030200534
Seller: AHA-BUCH GmbH, Einbeck, Germany
Taschenbuch. Condition: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book describes methods to address wearout/aging degradations in electronic chips and systems, caused by several physical mechanisms at the device level. The authors introduce a novel technique called accelerated active self-healing, which fixes wearout issues by enabling accelerated recovery. Coverage includes recovery theory, experimental results, implementations and applications, across multiple nodes ranging from planar, FD-SOI to FinFET, based on both foundry provided models and predictive models. Presents novel techniques, tested with experiments on real hardware;Discusses circuit and system level wearout recovery implementations, many of these designs are portable and friendly to the standard design flow;Provides circuit-architecture-system infrastructures that enable the accelerated self-healing for future resilient systems;Discusses wearout issues at both transistor and interconnect level, providing solutions that apply to both;Includes coverage of resilient aspects of emerging applications such as IoT.
Language: English
Published by Springer International Publishing, 2019
ISBN 10: 3030200507 ISBN 13: 9783030200503
Seller: AHA-BUCH GmbH, Einbeck, Germany
Buch. Condition: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book describes methods to address wearout/aging degradations in electronic chips and systems, caused by several physical mechanisms at the device level. The authors introduce a novel technique called accelerated active self-healing, which fixes wearout issues by enabling accelerated recovery. Coverage includes recovery theory, experimental results, implementations and applications, across multiple nodes ranging from planar, FD-SOI to FinFET, based on both foundry provided models and predictive models. Presents novel techniques, tested with experiments on real hardware;Discusses circuit and system level wearout recovery implementations, many of these designs are portable and friendly to the standard design flow;Provides circuit-architecture-system infrastructures that enable the accelerated self-healing for future resilient systems;Discusses wearout issues at both transistor and interconnect level, providing solutions that apply to both;Includes coverage of resilient aspects of emerging applications such as IoT.
Seller: Mispah books, Redhill, SURRE, United Kingdom
Hardcover. Condition: New. NEW. SHIPS FROM MULTIPLE LOCATIONS. book.
Language: Romanian
Published by Cluj-Napoca : Editura Dacia, 1980
24,5 x 17,5 cm. Condition: Sehr gut. 370 Seiten Leg?tura din pânz? este în stare foarte bun?, atât la interior, cât ?i la exterior. V? rug?m s? consulta?i fotografiile noastre. Leineneinband in sehr gutem Zustand, innen wie außen sehr gut. Bitte beachten Sie unsere Bilder. PU-162 ro Gewicht in Gramm: 920.
Language: English
Published by Springer International Publishing Aug 2020, 2020
ISBN 10: 3030200531 ISBN 13: 9783030200534
Seller: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, Germany
Taschenbuch. Condition: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -This book describes methods to address wearout/aging degradations in electronic chips and systems, caused by several physical mechanisms at the device level. The authors introduce a novel technique called accelerated active self-healing, which fixes wearout issues by enabling accelerated recovery. Coverage includes recovery theory, experimental results, implementations and applications, across multiple nodes ranging from planar, FD-SOI to FinFET, based on both foundry provided models and predictive models. Presents novel techniques, tested with experiments on real hardware;Discusses circuit and system level wearout recovery implementations, many of these designs are portable and friendly to the standard design flow;Provides circuit-architecture-system infrastructures that enable the accelerated self-healing for future resilient systems;Discusses wearout issues at both transistor and interconnect level, providing solutions that apply to both;Includes coverage of resilient aspects of emerging applications such as IoT. 228 pp. Englisch.
Language: English
Published by Springer International Publishing Jun 2019, 2019
ISBN 10: 3030200507 ISBN 13: 9783030200503
Seller: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, Germany
Buch. Condition: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -This book describes methods to address wearout/aging degradations in electronic chips and systems, caused by several physical mechanisms at the device level. The authors introduce a novel technique called accelerated active self-healing, which fixes wearout issues by enabling accelerated recovery. Coverage includes recovery theory, experimental results, implementations and applications, across multiple nodes ranging from planar, FD-SOI to FinFET, based on both foundry provided models and predictive models. Presents novel techniques, tested with experiments on real hardware;Discusses circuit and system level wearout recovery implementations, many of these designs are portable and friendly to the standard design flow;Provides circuit-architecture-system infrastructures that enable the accelerated self-healing for future resilient systems;Discusses wearout issues at both transistor and interconnect level, providing solutions that apply to both;Includes coverage of resilient aspects of emerging applications such as IoT. 228 pp. Englisch.
Language: English
Published by Springer International Publishing, 2019
ISBN 10: 3030200507 ISBN 13: 9783030200503
Seller: moluna, Greven, Germany
Gebunden. Condition: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Presents novel techniques, tested with experiments on real hardwareDiscusses circuit and system level wearout recovery implementations, many of these designs are portable and friendly to the standard design flowProvides circuit-architecture.
Language: English
Published by Springer International Publishing, 2020
ISBN 10: 3030200531 ISBN 13: 9783030200534
Seller: moluna, Greven, Germany
Condition: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Presents novel techniques, tested with experiments on real hardwareDiscusses circuit and system level wearout recovery implementations, many of these designs are portable and friendly to the standard design flowProvides circuit-architecture.
Seller: Majestic Books, Hounslow, United Kingdom
Condition: New. Print on Demand pp. 208.
Seller: Majestic Books, Hounslow, United Kingdom
Condition: New. Print on Demand pp. XIX, 208 136 illus., 134 illus. in color.
Seller: Biblios, Frankfurt am main, HESSE, Germany
Condition: New. PRINT ON DEMAND pp. 208.
Seller: Biblios, Frankfurt am main, HESSE, Germany
Condition: New. PRINT ON DEMAND pp. XIX, 208 136 illus., 134 illus. in color.