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![Seller image for Materials for Information Technology. Devices, Interconnects and Packaging. [Engineering Materials and Processes]. for sale by Antiquariat Thomas Haker GmbH & Co. KG](https://pictures.abebooks.com/inventory/md/md31015420387.jpg)
Materials for Information Technology. Devices, Interconnects and Packaging. [Engineering Materials and Processes].
Seller: Antiquariat Thomas Haker GmbH & Co. KG, Berlin, Germany
Association Member: GIAQ
Seller rating 5 out of 5 stars
Hardcover/Pappeinband. Condition: Sehr gut. 527 p. Very good. Shrink wrapped. / Sehr guter Zustand. In Folie verschweißt. Sprache: Englisch Gewicht in Gramm: 984.
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Materials for Information Technology: Devices, Interconnects and Packaging (Engineering Materials and Processes)
Seller: Phatpocket Limited, Waltham Abbey, HERTS, United Kingdom
Seller rating 5 out of 5 stars
Condition: Good. Your purchase helps support Sri Lankan Children's Charity 'The Rainbow Centre'. Ex-library, so some stamps and wear, but in good overall condition. Our donations to The Rainbow Centre have helped provide an education and a safe haven to hundreds of children who live in appalling conditions.
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Materials for Information Technology: Devices, Interconnects And Packaging
Language: English
Published by Secaucus, New Jersey, U.S.A.: Springer Verlag, 2005
ISBN 10: 1852339411 ISBN 13: 9781852339418
Hardcover. Condition: Near Fine. 3rd Edition. 3rd ed.hardback book in near fine condition.
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Condition: New. This is a Brand-new US Edition. This Item may be shipped from US or any other country as we have multiple locations worldwide.
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Condition: Brand New. New. US edition. Expediting shipping for all USA and Europe orders excluding PO Box. Excellent Customer Service.
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Condition: Used. pp. 532.
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Condition: Used. pp. 532 Illus.
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Condition: Used. pp. 532.
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Materials for Information Technology: Devices, Interconnects and Packaging (Engineering Materials and Processes)
Seller: Ria Christie Collections, Uxbridge, United Kingdom
Seller rating 5 out of 5 stars
£ 189.04
£ 11.98 shipping
Ships from United Kingdom to U.S.A.Quantity: Over 20 available
Add to basketCondition: New. In.
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Materials for Information Technology: Devices, Interconnects and Packaging (Engineering Materials and Processes)
Seller: Ria Christie Collections, Uxbridge, United Kingdom
Seller rating 5 out of 5 stars
£ 189.04
£ 11.98 shipping
Ships from United Kingdom to U.S.A.Quantity: Over 20 available
Add to basketCondition: New. In.
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Taschenbuch. Condition: Neu. Materials for Information Technology | Devices, Interconnects and Packaging | Ehrenfried Zschech (u. a.) | Taschenbuch | Engineering Materials and Processes | xix | Englisch | 2010 | Springer | EAN 9781849969673 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu.
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Condition: New. pp. 532.
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Taschenbuch. Condition: Neu. Druck auf Anfrage Neuware - Printed after ordering - The fast-developing information technology industry is driving a need for new materials in order to facilitate the development of more reliable microelectronic products. Materials for Information Technology is an up-to-date overview of current developments and R&D activities in the field of materials used for information technology with a focus on future applications. Included are:materials for silicon-based semiconductor devices (including high-k gate dielectric materials); materials for nonvolatile memories; materials for on-chip interconnects and interlayer dielectrics (including silicides, barrier materials, low-k and ultra low-k dielectric materials); and materials for assembly and packaging The latest results in materials science and engineering as well as applications in the semiconductor industry are covered including the synthesis of blanket and patterned thin film materials, their properties, constitution, structure and microstructure. Computer modelling and analytical techniques to characterise thin film structures are also included to give a comprehensive survey of materials for the IT industry.The Engineering Materials and Processes series focuses on all forms of materials and the processes used to synthesise and formulate them as they relate to the various engineering disciplines. The series deals with a diverse range of materials: ceramics; metals (ferrous and non-ferrous); semiconductors; composites, polymers, biomimetics etc. Each monograph in the series is written by a specialist and demonstrates how enhancements in materials and the processes associated with them can improve performance in the field of engineering in which they are used.
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Condition: New. No other book covers all of the materials used in the information technology industry, covering characterisation, properties and synthesis of novel materials for this fast-changing industryDr Ehrenfried Zschech is manager of the Materials Anal.
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Condition: As New. Unread book in perfect condition.
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Paperback. Condition: Like New. Like New. book.
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Condition: As New. Unread book in perfect condition.
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Materials for Information Technology : Devices, Interconnects and Packaging
Language: English
Published by Springer London Sep 2005, 2005
ISBN 10: 1852339411 ISBN 13: 9781852339418
Buch. Condition: Neu. Neuware - The fast-developing information technology industry is driving a need for new materials in order to facilitate the development of more reliable microelectronic products. Materials for Information Technology is an up-to-date overview of current developments and R&D activities in the field of materials used for information technology with a focus on future applications. Included are:materials for silicon-based semiconductor devices (including high-k gate dielectric materials); materials for nonvolatile memories; materials for on-chip interconnects and interlayer dielectrics (including silicides, barrier materials, low-k and ultra low-k dielectric materials); and materials for assembly and packaging The latest results in materials science and engineering as well as applications in the semiconductor industry are covered including the synthesis of blanket and patterned thin film materials, their properties, constitution, structure and microstructure. Computer modelling and analytical techniques to characterise thin film structures are also included to give a comprehensive survey of materials for the IT industry.The Engineering Materials and Processes series focuses on all forms of materials and the processes used to synthesise and formulate them as they relate to the various engineering disciplines. The series deals with a diverse range of materials: ceramics; metals (ferrous and non-ferrous); semiconductors; composites, polymers, biomimetics etc. Each monograph in the series is written by a specialist and demonstrates how enhancements in materials and the processes associated with them can improve performance in the field of engineering in which they are used.
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Hardcover. Condition: Like New. LIKE NEW. SHIPS FROM MULTIPLE LOCATIONS. book.
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Condition: new. Questo è un articolo print on demand.
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Condition: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. No other book covers all of the materials used in the information technology industry, covering characterisation, properties and synthesis of novel materials for this fast-changing industryDr Ehrenfried Zschech is manager of the Materials Anal.
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Materials for Information Technology
Language: English
Published by Springer London Okt 2010, 2010
ISBN 10: 1849969671 ISBN 13: 9781849969673
Seller: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, Germany
Seller rating 5 out of 5 stars
Taschenbuch. Condition: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -This book provides an up to date survey of the state of the art of research into the materials used in information technology, and will be bought by researchers in universities, institutions as well as research workers in the semiconductor and IT industries. 532 pp. Englisch.
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Materials for Information Technology
Language: English
Published by Springer, Springer Okt 2010, 2010
ISBN 10: 1849969671 ISBN 13: 9781849969673
Seller: buchversandmimpf2000, Emtmannsberg, BAYE, Germany
Seller rating 5 out of 5 stars
Taschenbuch. Condition: Neu. This item is printed on demand - Print on Demand Titel. Neuware -This book provides an up to date survey of the state of the art of research into the materials used in information technology, and will be bought by researchers in universities, institutions as well as research workers in the semiconductor and IT industries.Springer-Verlag KG, Sachsenplatz 4-6, 1201 Wien 532 pp. Englisch.
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Condition: New. Print on Demand pp. 532 49:B&W 6.14 x 9.21 in or 234 x 156 mm (Royal 8vo) Perfect Bound on White w/Gloss Lam.
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Condition: New. PRINT ON DEMAND pp. 532.
