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Ehrenfried Zschech (83 results)
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![Seller image for Materials for Information Technology. Devices, Interconnects and Packaging. [Engineering Materials and Processes]. for sale by Antiquariat Thomas Haker GmbH & Co. KG](https://pictures.abebooks.com/inventory/md/md31015420387.jpg)
Materials for Information Technology. Devices, Interconnects and Packaging. [Engineering Materials and Processes].
Seller: Antiquariat Thomas Haker GmbH & Co. KG, Berlin, Germany
Association Member: GIAQ
Seller rating 5 out of 5 stars
Hardcover/Pappeinband. Condition: Sehr gut. 527 p. Very good. Shrink wrapped. / Sehr guter Zustand. In Folie verschweißt. Sprache: Englisch Gewicht in Gramm: 984.
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Materials for Information Technology: Devices, Interconnects and Packaging (Engineering Materials and Processes)
Seller: Phatpocket Limited, Waltham Abbey, HERTS, United Kingdom
Seller rating 5 out of 5 stars
Condition: Good. Your purchase helps support Sri Lankan Children's Charity 'The Rainbow Centre'. Ex-library, so some stamps and wear, but in good overall condition. Our donations to The Rainbow Centre have helped provide an education and a safe haven to hundreds of children who live in appalling conditions.
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Condition: New.
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Hardback or Cased Book. Condition: New. Characterization of Nanomaterials. Book.
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Condition: New.
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Condition: As New. Unread book in perfect condition.
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Characterization of Nanomaterials
Seller: Ria Christie Collections, Uxbridge, United Kingdom
Seller rating 5 out of 5 stars
£ 37.75
£ 11.98 shipping
Ships from United Kingdom to U.S.A.Quantity: Over 20 available
Add to basketCondition: New. In.
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Characterization Of Nanomaterials
Seller: GreatBookPricesUK, Woodford Green, United Kingdom
Seller rating 5 out of 5 stars
Condition: New.
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Characterization Of Nanomaterials
Seller: GreatBookPricesUK, Woodford Green, United Kingdom
Seller rating 5 out of 5 stars
Condition: As New. Unread book in perfect condition.
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Gebunden. Condition: Neu. Neu -Innovative Werkstoffe werden zukünftig ebenso wie Hochtechnologien mehr und mehr den wirtschaftlichen und gesellschaftlichen Fortschritt eines Landes, einer Region, ja der gesamten Welt bestimmen. Das vorliegende Buch vermittelt Werkstoffvisionen für das nächste Jahrhundert, vor allem aber realistische Entwicklungstrends. 150 pp. Deutsch.
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Materials for Information Technology: Devices, Interconnects And Packaging
Language: English
Published by Secaucus, New Jersey, U.S.A.: Springer Verlag, 2005
ISBN 10: 1852339411 ISBN 13: 9781852339418
Hardcover. Condition: Near Fine. 3rd Edition. 3rd ed.hardback book in near fine condition.
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Condition: New. This is a Brand-new US Edition. This Item may be shipped from US or any other country as we have multiple locations worldwide.
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Condition: Brand New. New. US edition. Expediting shipping for all USA and Europe orders excluding PO Box. Excellent Customer Service.
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Condition: Brand New. New. US edition. Expediting shipping for all USA and Europe orders excluding PO Box. Excellent Customer Service.
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![Stock image for Werkstoffe im Trend. Ken Easterling. Ehrenfried Zschech. [Übers. und bearb. von Ehrenfried Zschech] for sale by Wanda Schwörer](https://pictures.abebooks.com/isbn/9783341011737-uk-300.jpg)
Werkstoffe im Trend. Ken Easterling. Ehrenfried Zschech. [Übers. und bearb. von Ehrenfried Zschech]
Language: German
Published by Berlin : Verl. Technik,, 1997
ISBN 10: 3341011730 ISBN 13: 9783341011737
First Edition
Pp. Condition: Gut. 1. Aufl. 150 S. : Ill., graph. Darst. ; 25 cm gutes bis sehr gutes Exemplar Aufgrund meiner Knie-OP versende ich vorübergehend nur dienstags & freitags. Danke für eure Verständnis Sprache: Deutsch Gewicht in Gramm: 472.
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Stress-Induced Phenomena in Metallization
Language: English
Published by American Institute of Physics, 2006
ISBN 10: 0735403104 ISBN 13: 9780735403109
Condition: New. pp. xi + 372 1st Edition.
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Stress-Induced Phenomena in Metallization
Language: English
Published by American Institute of Physics, 2006
ISBN 10: 0735403104 ISBN 13: 9780735403109
Condition: New. pp. xi + 372 Illus.
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Condition: New.
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Condition: New. Brand New.
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Stress-Induced Phenomena in Metallization
Language: English
Published by American Institute of Physics, 2006
ISBN 10: 0735403104 ISBN 13: 9780735403109
Condition: New. pp. xi + 372.
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Condition: Used. pp. 532.
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Condition: Used. pp. 532 Illus.
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Condition: Used. pp. 532.
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Advanced Interconnects for ULSI Technology
Seller: GreatBookPricesUK, Woodford Green, United Kingdom
Seller rating 5 out of 5 stars
£ 164.99
£ 15 shipping
Ships from United Kingdom to U.S.A.Quantity: Over 20 available
Add to basketCondition: As New. Unread book in perfect condition.
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Hardcover. Condition: Like New. LIKE NEW. SHIPS FROM MULTIPLE LOCATIONS. book.
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Condition: As New. Unread book in perfect condition.
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Advanced Interconnects for ULSI Technology (Hardcover)
Language: English
Published by John Wiley & Sons Inc, New York, 2012
ISBN 10: 0470662549 ISBN 13: 9780470662540
First Edition
Hardcover. Condition: new. Hardcover. Finding new materials for copper/low-k interconnects is critical to the continuing development of computer chips. While copper/low-k interconnects have served well, allowing for the creation of Ultra Large Scale Integration (ULSI) devices which combine over a billion transistors onto a single chip, the increased resistance and RC-delay at the smaller scale has become a significant factor affecting chip performance. Advanced Interconnects for ULSI Technology is dedicated to the materials and methods which might be suitable replacements. It covers a broad range of topics, from physical principles to design, fabrication, characterization, and application of new materials for nano-interconnects, and discusses: Interconnect functions, characterisations, electrical properties and wiring requirementsLow-k materials: fundamentals, advances and mechanical propertiesConductive layers and barriersIntegration and reliability including mechanical reliability, electromigration and electrical breakdownNew approaches including 3D, optical, wireless interchip, and carbon-based interconnects Intended for postgraduate students and researchers, in academia and industry, this book provides a critical overview of the enabling technology at the heart of the future development of computer chips. Advanced Interconnects for ULSI Technology is dedicated to the materials and methods which might be suitable replacements. It covers a broad range of topics, from physical principles to design, fabrication, characterization, and application of new materials for nano-interconnects. Shipping may be from multiple locations in the US or from the UK, depending on stock availability.
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Materials for Information Technology: Devices, Interconnects and Packaging (Engineering Materials and Processes)
Seller: Ria Christie Collections, Uxbridge, United Kingdom
Seller rating 5 out of 5 stars
£ 189.04
£ 11.98 shipping
Ships from United Kingdom to U.S.A.Quantity: Over 20 available
Add to basketCondition: New. In.
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Materials for Information Technology: Devices, Interconnects and Packaging (Engineering Materials and Processes)
Seller: Ria Christie Collections, Uxbridge, United Kingdom
Seller rating 5 out of 5 stars
£ 189.04
£ 11.98 shipping
Ships from United Kingdom to U.S.A.Quantity: Over 20 available
Add to basketCondition: New. In.
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Advanced Interconnects for ULSI Technology
Seller: GreatBookPricesUK, Woodford Green, United Kingdom
Seller rating 5 out of 5 stars
£ 196.37
£ 15 shipping
Ships from United Kingdom to U.S.A.Quantity: Over 20 available
Add to basketCondition: New.
