Condition: Good. 150 pp., Hardcover, ex library else text clean and binding tight. - If you are reading this, this item is actually (physically) in our stock and ready for shipment once ordered. We are not bookjackers. Buyer is responsible for any additional duties, taxes, or fees required by recipient's country.
Seller: Romtrade Corp., STERLING HEIGHTS, MI, U.S.A.
Condition: New. This is a Brand-new US Edition. This Item may be shipped from US or any other country as we have multiple locations worldwide.
hardcover. Condition: New. In shrink wrap. Looks like an interesting title!
Condition: As New. Unread book in perfect condition.
Seller: Ria Christie Collections, Uxbridge, United Kingdom
£ 96.88
Quantity: Over 20 available
Add to basketCondition: New. In.
Seller: Ria Christie Collections, Uxbridge, United Kingdom
£ 96.88
Quantity: Over 20 available
Add to basketCondition: New. In.
Condition: New.
Seller: GreatBookPricesUK, Woodford Green, United Kingdom
Condition: New.
Seller: Books Puddle, New York, NY, U.S.A.
Condition: New. pp. 172.
Condition: Sehr gut. Zustand: Sehr gut | Sprache: Englisch | Produktart: Bücher | Over the years there has been a large increase in the functionality available on a single integrated circuit. This has been mainly achieved by a continuous drive towards smaller feature sizes, larger dies, and better packing efficiency. However, this greater functionality has also resulted in substantial increases in the capital investment needed to build fabrication facilities. Given such a high level of investment, it is critical for IC manufacturers to reduce manufacturing costs and get a better return on their investment. The most obvious method of reducing the manufacturing cost per die is to improve manufacturing yield. Modern VLSI research and engineering (which includes design manufacturing and testing) encompasses a very broad range of disciplines such as chemistry, physics, material science, circuit design, mathematics and computer science. Due to this diversity, the VLSI arena has become fractured into a number of separate sub-domains with little or no interaction between them. This is the case with the relationships between testing and manufacturing. From Contamination to Defects, Faults and Yield Loss: Simulation and Applications focuses on the core of the interface between manufacturing and testing, i.e., the contamination-defect-fault relationship. The understanding of this relationship can lead to better solutions of many manufacturing and testing problems. Failure mechanism models are developed and presented which can be used to accurately estimate probability of different failures for a given IC. This information is critical in solving key yield-related applications such as failure analysis, fault modeling and design manufacturing.
Seller: GreatBookPricesUK, Woodford Green, United Kingdom
£ 104.65
Quantity: Over 20 available
Add to basketCondition: As New. Unread book in perfect condition.
Language: English
Published by Kluwer Academic Publishers, 1996
ISBN 10: 0792397142 ISBN 13: 9780792397144
Seller: Kennys Bookshop and Art Galleries Ltd., Galway, GY, Ireland
Condition: New. States that over the years there has been a large increase in the functionality available on a single integrated circuit. This book focuses on the core of the interface between manufacturing and testing, ie, the contamination-defect-fault relationship. Series: Frontiers in Electronic Testing. Num Pages: 166 pages, biography. BIC Classification: TJFC; TJFD. Category: (P) Professional & Vocational; (XV) Technical / Manuals. Dimension: 234 x 156 x 11. Weight in Grams: 930. . 1996. Hardback. . . . .
Language: English
Published by Kluwer Academic Publishers, 1996
ISBN 10: 0792397142 ISBN 13: 9780792397144
Seller: Kennys Bookstore, Olney, MD, U.S.A.
Condition: New. States that over the years there has been a large increase in the functionality available on a single integrated circuit. This book focuses on the core of the interface between manufacturing and testing, ie, the contamination-defect-fault relationship. Series: Frontiers in Electronic Testing. Num Pages: 166 pages, biography. BIC Classification: TJFC; TJFD. Category: (P) Professional & Vocational; (XV) Technical / Manuals. Dimension: 234 x 156 x 11. Weight in Grams: 930. . 1996. Hardback. . . . . Books ship from the US and Ireland.
Paperback. Condition: Like New. LIKE NEW. SHIPS FROM MULTIPLE LOCATIONS. book.
Kluwer Academic Publishers, Boston, 1996. 150 pages, Paperback--- - former library book in good condition - 468 Gramm.
Condition: new. Questo è un articolo print on demand.
Seller: moluna, Greven, Germany
Condition: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Over the years there has been a large increase in the functionality available on a single integrated circuit. This has been mainly achieved by a continuous drive towards smaller feature sizes, larger dies, and better packing efficiency. However, this gre.
Seller: moluna, Greven, Germany
Gebunden. Condition: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Over the years there has been a large increase in the functionality available on a single integrated circuit. This has been mainly achieved by a continuous drive towards smaller feature sizes, larger dies, and better packing efficiency. However, this gre.
Seller: Majestic Books, Hounslow, United Kingdom
Condition: New. Print on Demand pp. 172 49:B&W 6.14 x 9.21 in or 234 x 156 mm (Royal 8vo) Perfect Bound on White w/Gloss Lam.
Seller: Biblios, Frankfurt am main, HESSE, Germany
Condition: New. PRINT ON DEMAND pp. 172.