Jillian Y Evans (51 results)
- Softcover
Seller: HR1 Books, Hereford, United KingdomHR1 Books
Contact seller5-star sellerCondition: Used - Very good
£ 69.10
£ 15.50 shippingShips from United Kingdom to U.S.A.Quantity: 1 available
Paperback. Condition: Very Good. Same / next day dispatch (Monday - Friday).
Guide to Lead-free Solders : Physical Metallurgy And Reliability
Evans, John W.; Engelmaier, Werner (EDT); Kwon, Dongil (CON); Evans, Jillian Y. (CON)
- Hardcover
Seller: GreatBookPrices, Columbia, MD, U.S.A.GreatBookPrices
Contact seller5-star sellerCondition: Used - As new
£ 101.39
£ 1.95 shippingShips within U.S.A.Quantity: Over 20 available
Condition: As New. Unread book in perfect condition.
- Softcover
Seller: Ria Christie Collections, Uxbridge, United KingdomRia Christie Collections
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£ 96.88
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Condition: New. In.
Guide to Lead-free Solders : Physical Metallurgy And Reliability
Evans, John W.; Engelmaier, Werner (EDT); Kwon, Dongil (CON); Evans, Jillian Y. (CON)
- Hardcover
Seller: GreatBookPrices, Columbia, MD, U.S.A.GreatBookPrices
Contact seller5-star sellerCondition: New
£ 113.11
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Condition: New.
Guide to Lead-free Solders : Physical Metallurgy And Reliability
Evans, John W.; Engelmaier, Werner (EDT); Kwon, Dongil (CON); Evans, Jillian Y. (CON)
- Hardcover
Seller: GreatBookPricesUK, Woodford Green, United KingdomGreatBookPricesUK
Contact seller5-star sellerCondition: New
£ 96.87
£ 15.00 shippingShips from United Kingdom to U.S.A.Quantity: Over 20 available
Condition: New.
Guide to Lead-free Solders : Physical Metallurgy And Reliability
Evans, John W.; Engelmaier, Werner (EDT); Kwon, Dongil (CON); Evans, Jillian Y. (CON)
- Hardcover
Seller: GreatBookPricesUK, Woodford Green, United KingdomGreatBookPricesUK
Contact seller5-star sellerCondition: Used - As new
£ 103.39
£ 15.00 shippingShips from United Kingdom to U.S.A.Quantity: Over 20 available
Condition: As New. Unread book in perfect condition.
- Hardcover
Seller: GreatBookPrices, Columbia, MD, U.S.A.GreatBookPrices
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£ 121.02
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Condition: New.
- Hardcover
Seller: INDOO, Avenel, NJ, U.S.A.INDOO
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£ 123.03
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Condition: New.
- Hardcover
Seller: myVend, Altötting, GermanymyVend
Contact seller4-star sellerCondition: Used - As new
£ 114.74
£ 8.53 shippingShips from Germany to U.S.A.Quantity: 1 available
Hardcover Feb 28, 2001. Condition: Used: Like New. Inkl. Rechnung nach §19; Buch stammt aus aufgelà ster Buchsammlung; Label, Stempel und Notizen mà glich.
- Softcover
Seller: Books Puddle, New York, NY, U.S.A.Books Puddle
Contact seller4-star sellerCondition: New
£ 126.10
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Condition: New. pp. 420.
- Hardcover
Seller: PBShop.store UK, Fairford, GLOS, United KingdomPBShop.store UK
Contact seller5-star sellerCondition: New
£ 127.45
£ 5.87 shippingShips from United Kingdom to U.S.A.Quantity: 15 available
PAP. Condition: New. New Book. Shipped from UK. Established seller since 2000.
- Hardcover
Seller: Brook Bookstore On Demand, Napoli, NA, ItalyBrook Bookstore On Demand
Contact seller5-star sellerCondition: New
£ 133.75
£ 6.86 shippingShips from Italy to U.S.A.Quantity: Over 20 available
Condition: new.
- Hardcover
Seller: GreatBookPrices, Columbia, MD, U.S.A.GreatBookPrices
Contact seller5-star sellerCondition: Used - As new
£ 140.42
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Condition: As New. Unread book in perfect condition.
- Hardcover
Seller: GreatBookPricesUK, Woodford Green, United KingdomGreatBookPricesUK
Contact seller5-star sellerCondition: New
£ 127.44
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Condition: New.
- Softcover
Seller: AHA-BUCH GmbH, Einbeck, GermanyAHA-BUCH GmbH
Contact seller5-star sellerCondition: New
£ 94.50
£ 54.17 shippingShips from Germany to U.S.A.Quantity: 1 available
Taschenbuch. Condition: Neu. Druck auf Anfrage Neuware - Printed after ordering - Product Integrity and Reliability in Design is intended to serve either as a text for graduate students or as a reference for practicing engineers. The book develops the root-cause approach to reliability - often referred to as 'physics of failure'… in the reliability engineering field. It approaches the subject from the point of view of a process and integrates the necessary methods to support that process. The book can be used to teach first- or second-year postgraduate students in mechanical, electrical, manufacturing and materials engineering about addressing issues of reliability during product development. It will also serve practicing engineers involved in the design and development of electrical and mechanical components and systems, as a reference.The book takes an interdisciplinary approach appropriate to system engineering, stressing concepts that can be integrated into design and placing less emphasis on traditional assumptions about reliability and analysis as a separate development activity. Several case studies emphasize the understanding of failure mechanisms and failure prevention and show how reliability methods, including simulation and testing can be integrated into design and development.
- Hardcover
Seller: Ria Christie Collections, Uxbridge, United KingdomRia Christie Collections
Contact seller5-star sellerCondition: New
£ 138.20
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Condition: New. In English.
- Hardcover
Seller: Phatpocket Limited, Waltham Abbey, HERTS, United KingdomPhatpocket Limited
Contact seller5-star sellerCondition: Used - Good
£ 144.57
£ 10.64 shippingShips from United Kingdom to U.S.A.Quantity: 1 available
Condition: Good. Used - Good. Your purchase helps support Sri Lankan Children's Charity 'The Rainbow Centre.' Ex-library, but has been well cared for. Our donations to The Rainbow Centre have helped provide an education and a safe haven to hundreds of children who live in appalling conditions.
- Hardcover
Seller: GreatBookPricesUK, Woodford Green, United KingdomGreatBookPricesUK
Contact seller5-star sellerCondition: Used - As new
£ 142.21
£ 15.00 shippingShips from United Kingdom to U.S.A.Quantity: Over 20 available
Condition: As New. Unread book in perfect condition.
- Hardcover
Seller: California Books, Miami, FL, U.S.A.California Books
Contact seller4-star sellerCondition: New
£ 161.93
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Condition: New.
- Hardcover
Seller: Majestic Books, Hounslow, United KingdomMajestic Books
Contact seller4-star sellerCondition: New
£ 171.76
£ 6.50 shippingShips from United Kingdom to U.S.A.Quantity: 3 available
Condition: New. pp. 461.
- Hardcover
Seller: Ubiquity Trade, Miami, FL, U.S.A.Ubiquity Trade
Contact seller5-star sellerCondition: New
£ 177.69
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Condition: New. Brand new! Please provide a physical shipping address.
- Hardcover
- First Edition
Seller: Kennys Bookshop and Art Galleries Ltd., Galway, GY, IrelandKennys Bookshop and Art Galleries Ltd.
Contact seller5-star sellerCondition: New
£ 173.13
£ 8.15 shippingShips from Ireland to U.S.A.Quantity: Over 20 available
Condition: New. All packaging engineers and technologists who want to ensure that they give their customers the highest quality, most cost--effective products should know that the paradigm has shifted. Editor(s): Pecht, Michael; Dasgupta, Abhijit; Evans, John W.; Evans, Jillian Y. Num Pages: 462 pages, Illustrations. BIC Classif…ication: KJMV5; TGPQ; TGPR; TJF. Category: (P) Professional & Vocational; (UP) Postgraduate, Research & Scholarly. Dimension: 243 x 163 x 29. Weight in Grams: 888. . 1994. 1st Edition. Hardcover. . . . .
- Softcover
Seller: Mispah books, Redhill, SURRE, United KingdomMispah books
Contact seller4-star sellerCondition: Used - As new
£ 152.00
£ 25.00 shippingShips from United Kingdom to U.S.A.Quantity: 1 available
Paperback. Condition: Like New. LIKE NEW. SHIPS FROM MULTIPLE LOCATIONS. book.
- Softcover
- First Edition
Seller: CitiRetail, Stevenage, United KingdomCitiRetail
Contact seller5-star sellerCondition: New
£ 147.99
£ 37.00 shippingShips from United Kingdom to U.S.A.Quantity: 1 available
Paperback. Condition: new. Paperback. All packaging engineers and technologists who want to ensure thatthey give their customers the highest quality, most cost-effectiveproducts should know that the paradigm has shifted. It has shiftedaway from the MIL-STDs and other government standards and testprocedures that don't cost-effect…ively address potential failuremechanisms or the manufacturing processes of the product. It hasshifted decisively towards tackling the root causes of failure andthe appropriate implementation of cost-effective process controls,qualityscreens, and tests. This book's groundbreaking, science-based approach to developingqualification and quality assurance programs helps engineers reacha new level of reliability in today's high-performancemicroelectronics. It does this with powerful. * Techniques for identifying and modeling failure mechanismsearlier in the design cycle, breaking the need to rely on fielddata * Physics-of-failure product reliability assessment methods thatcan be proactively implemented throughout the design andmanufacture of the product * Process controls that decrease variabilities in the end productand reduce end-of-line screening and testing A wide range of microelectronic package and interconnectconfigurations for both single-and multi-chip modules is examined,including chip and wire-bonds, tape-automated (TAB), flip-TAB,flip-chip bonds, high-density interconnects, chip-on-board designs(COB), MCM, 3-D stack, and many more. The remaining packageelements, such as die attachment, case and lid, leads, and lid andlead seals are also discussed in detail. The product of a distinguished team of authors and editors, thisbook's guidelines for avoiding potential high-risk manufacturingand qualification problems, as well as for implementing ongoingquality assurance, are sure to prove invaluable to both studentsand practicing professionals. For the professional engineer involved in the design andmanufacture of products containing electronic components, here is acomprehensive handbook to the theory and methods surrounding theassembly of microelectronic and electronic components. The bookfocuses on computers and consumer electronic products with internalsubsystems that reflect mechanical design constraints, costlimitations, and aesthetic and ergonomic concerns. Taking a totalsystem approach to packaging, the book systematically examines:basic chip and computer architecture; design and layout;interassembly and interconnections; cooling scheme; materialsselection, including ceramics, glasses, and metals; stress,vibration, and acoustics; and manufacturing and assemblytechnology. 1994 (0-471-53299-1) 800 pp. INTEGRATED CIRCUIT, HYBRID, AND MULTICHIP MODULE PACKAGE DESIGNGUIDELINES: A Focus on Reliability --Michael Pecht This comprehensive guide features a uniquely organized time-phasedapproach to design, development, qualification, manufacture, andin-service management. It provides step-by-step instructions on howto define realistic system requirements, define the system usageenvironment, identify potential failure modes, characterizematerials and processes by the key control label factors, and useexperiment, step-stress, and accelerated methods to ensure optimumdesign before production begins. Topics covered include: detaileddesign guidelines for substrate.wire and wire, tape automated,and flip-chip bonding.element attachment and case, lead, lead andlid seals--incorporating dimensional and geometric configurationsof package elements, manufacturing and assembly conditions,materials selection, and loading conditions. 1993 (0-471-59446-6)454 pp. All packaging engineers and technologists who want to ensure that they give their customers the highest quality, most cost--effective products should know that the paradigm has shifte Shipping may be from our UK warehouse or from our Australian or US warehouses, depending on stock availability.
- Hardcover
Seller: Books Puddle, New York, NY, U.S.A.Books Puddle
Contact seller4-star sellerCondition: New
£ 188.99
£ 2.95 shippingShips within U.S.A.Quantity: 3 available
Condition: New. pp. 461.
- Hardcover
Seller: GreatBookPrices, Columbia, MD, U.S.A.GreatBookPrices
Contact seller5-star sellerCondition: New
£ 195.65
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Condition: New.
- Hardcover
Seller: California Books, Miami, FL, U.S.A.California Books
Contact seller4-star sellerCondition: New
£ 197.66
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Condition: New.
- Hardcover
Seller: GreatBookPricesUK, Woodford Green, United KingdomGreatBookPricesUK
Contact seller5-star sellerCondition: New
£ 180.37
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Condition: New.
- Hardcover
Seller: moluna, Greven, Germanymoluna
Contact seller5-star sellerCondition: New
£ 160.24
£ 42.01 shippingShips from Germany to U.S.A.Quantity: Over 20 available
Condition: New. All packaging engineers and technologists who want to ensure that they give their customers the highest quality, most cost--effective products should know that the paradigm has shifted.Über den AutorDR. MICHAEL PECHT is a ten-ur.
- Hardcover
Seller: Ria Christie Collections, Uxbridge, United KingdomRia Christie Collections
Contact seller5-star sellerCondition: New
£ 189.04
£ 11.98 shippingShips from United Kingdom to U.S.A.Quantity: Over 20 available
Condition: New. In.
