Grabinski Hartmut (67 results)

Condition: Brand New. New. US edition. Expediting shipping for all USA and Europe orders excluding PO Box. Excellent Customer Service.

Hardcover. Condition: Very Good. No Dust Jacket. First Edition. Hard cover with printed boards, no jacket; Cover shows hardly noticable storage wear. Previous owner's name on FEP. Contents are otherwise clean, bright and tight. J. Used.

Condition: New. In English.

Condition: As New. Unread book in perfect condition.

Condition: New.

Condition: New. In English.

Condition: New.

Condition: New. In English.

Condition: New.

Condition: New. Comprises a selection of representative contributions to the 1st IEEE Workshop on Signal Propagation on Interconnects that was held at Travemunde, Germany, in 1997. This book contains chapters which cover an area of research results dealing with simulation and measurement of noise and radiated emissions on boards, describing ground bounce effects. Editor(s): Grabinski, Hartmut; Nordholz, Petra. Num Pages: 148 pages, biography. BIC Classification: TJK. Category: (P) Professional & Vocational; (UP) Postgraduate, Research & Scholarly; (XV) Technical / Manuals. Dimension: 234 x 156 x 11. Weight in Grams: 910. . 1998. Hardback. . . . .…

Condition: New.

Softcover. Condition: Gut. 249 S. Ehem. Bibliotheksexemplar mit Bib.-Signatur und Stempel in GUTEM Zustand. Kaum Gebrauchsspuren. 9783540539575 Sprache: Deutsch Gewicht in Gramm: 550.

Condition: New. pp. 160.

Taschenbuch. Condition: Neu. Druck auf Anfrage Neuware - Printed after ordering - The contents of this book are an expanded treatment of a set of presentations given at the first IEEE Workshop on Signal Propagation on Interconnects held Trnvemiindc, Germany, May 14- 16, 1997. Traditional VLSI-based cost and complexity measures have principally incolved transistor counts and chip area. Yet with the increase in clock frequency transistor has become an issue of major concern' At present the emergence of systems on silicon feces designers with a new challenge: how to guarantee signal integrity while propagating high signals between embedded cores on a Thus, interconnects are becuming a significant limiter of future system performance. The element~ involved arc mainly transmission lines but also other interconnect devices life vias, and packages' The electrical phenomena that have to investigated, as for example delay and crosstalk, are governed by electromagnetic theory. Consequently, even in digital circuits there large sectians in whieh the can longer considered logical ones and zeros but must be treated as analog waveforms. To complicate matters, the descriptian of subcircuits by ordinary differential eyuations is inadequate in many instsnces. Only the use yartial differential aquations should guarantee sufficiently accurate results. Yet this would unfortunately increase the camplexity af simulatian and besign tremendously' Therefore, new approuuhes need to be developed.…

Paperback. Condition: Brand New. 160 pages. 9.75x6.25x0.37 inches. In Stock.

Condition: Gut. Zustand: Gut | Sprache: Englisch | Produktart: Bücher | This book presents an updated selection of the most representative contributions to the 2nd and 3rd IEEE Workshops on Signal Propagation on Interconnects (SPI) which were held in Travemtinde (Baltic See Side), Germany, May 13-15, 1998, and in Titisee-Neustadt (Black Forest), Germany, May 19-21, 1999. This publication addresses the need of developers and researchers in the field of VLSI chip and package design. It offers a survey of current problems regarding the influence of interconnect effects on the electrical performance of electronic circuits and suggests innovative solutions. In this sense the present book represents a continua­ tion and a supplement to the first book "Signal Propagation on Interconnects", Kluwer Academic Publishers, 1998. The papers in this book cover a wide area of research directions: Beneath the des­ cription of general trends they deal with the solution of signal integrity problems, the modeling of interconnects, parameter extraction using calculations and measurements and last but not least actual problems in the field of optical interconnects.…

Taschenbuch. Condition: Neu. Signal Propagation on Interconnects | Petra Nordholz (u. a.) | Taschenbuch | x | Englisch | 2010 | Springer US | EAN 9781441950598 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu.…

Condition: New. Comprises a selection of representative contributions to the 1st IEEE Workshop on Signal Propagation on Interconnects that was held at Travemunde, Germany, in 1997. This book contains chapters which cover an area of research results dealing with simulation and measurement of noise and radiated emissions on boards, describing ground bounce effects. Editor(s): Grabinski, Hartmut; Nordholz, Petra. Num Pages: 148 pages, biography. BIC Classification: TJK. Category: (P) Professional & Vocational; (UP) Postgraduate, Research & Scholarly; (XV) Technical / Manuals. Dimension: 234 x 156 x 11. Weight in Grams: 910. . 1998. Hardback. . . . . Books ship from the US and Ireland.…

Gebunden. Condition: New.

Condition: New.

Condition: As New. Unread book in perfect condition.

Condition: New.

Condition: New.

Condition: New. In English.

Condition: New. In English.

Condition: As New. Unread book in perfect condition.

Buch. Condition: Neu. Neuware - The contents of this book are an expanded treatment of a set of presentations given at the first IEEE Workshop on Signal Propagation on Interconnects held Trnvemiindc, Germany, May 14- 16, 1997. Traditional VLSI-based cost and complexity measures have principally incolved transistor counts and chip area. Yet with the increase in clock frequency transistor has become an issue of major concern' At present the emergence of systems on silicon feces designers with a new challenge: how to guarantee signal integrity while propagating high signals between embedded cores on a Thus, interconnects are becuming a significant limiter of future system performance. The element~ involved arc mainly transmission lines but also other interconnect devices life vias, and packages' The electrical phenomena that have to investigated, as for example delay and crosstalk, are governed by electromagnetic theory. Consequently, even in digital circuits there large sectians in whieh the can longer considered logical ones and zeros but must be treated as analog waveforms. To complicate matters, the descriptian of subcircuits by ordinary differential eyuations is inadequate in many instsnces. Only the use yartial differential aquations should guarantee sufficiently accurate results. Yet this would unfortunately increase the camplexity af simulatian and besign tremendously' Therefore, new approuuhes need to be developed.…

Condition: New. Presents a selection of the most representative contributions to the 2nd and 3rd IEEE Workshops on Signal Propagation on Interconnects (SPI). This book addresses the need of developers and researchers in the field of VLSI chip and package design. The papers in it cover a wide area of research directions. Editor(s): Grabinski, Hartmut. Num Pages: 236 pages, biography. BIC Classification: TJFC; UY. Category: (P) Professional & Vocational; (UP) Postgraduate, Research & Scholarly. Dimension: 244 x 170 x 15. Weight in Grams: 526. . 2000. Hardback. . . . .…

Taschenbuch. Condition: Neu. Interconnects in VLSI Design | Hartmut Grabinski | Taschenbuch | vii | Englisch | 2012 | Humana | EAN 9781461369547 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu. …

Buch. Condition: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book presents an updated selection of the most representative contributions to the 2nd and 3rd IEEE Workshops on Signal Propagation on Interconnects (SPI) which were held in Travemtinde (Baltic See Side), Germany, May 13-15, 1998, and in Titisee-Neustadt (Black Forest), Germany, May 19-21, 1999. This publication addresses the need of developers and researchers in the field of VLSI chip and package design. It offers a survey of current problems regarding the influence of interconnect effects on the electrical performance of electronic circuits and suggests innovative solutions. In this sense the present book represents a continua tion and a supplement to the first book 'Signal Propagation on Interconnects', Kluwer Academic Publishers, 1998. The papers in this book cover a wide area of research directions: Beneath the des cription of general trends they deal with the solution of signal integrity problems, the modeling of interconnects, parameter extraction using calculations and measurements and last but not least actual problems in the field of optical interconnects.…