Daniel C P Wong (50 results)
- Hardcover
Seller: Versandantiquariat buch-im-speicher, Berlin, , GermanyVersandantiquariat buch-im-speicher
Contact seller5-star sellerCondition: Used - Very good
£ 22.35
£ 26.91 shippingShips from Germany to U.S.A.Quantity: 1 available
Condition: Gut. 719 S. : Mit Abb., graph. Darst.; Sehr sauber und ohne Lesespuren / Very good condition, maybe unread book. Sprache: Englisch Gewicht in Gramm: 1193 24 cm, roter Org.-Pappb. / red hardcover.
- Softcover
Seller: Books From California, Simi Valley, CA, U.S.A.Books From California
Contact seller4-star sellerCondition: Used - Very good
£ 135.09
£ 3.78 shippingShips within U.S.A.Quantity: 1 available
paperback. Condition: Very Good.
- Hardcover
Seller: GoldBooks, Denver, CO, U.S.A.GoldBooks
Contact seller5-star sellerCondition: New
£ 144.33
£ 4.17 shippingShips within U.S.A.Quantity: 1 available
Hardcover. Condition: new. New Copy. Customer Service Guaranteed.
- Softcover
Seller: Books Puddle, New York, NY, U.S.A.Books Puddle
Contact seller4-star sellerCondition: New
£ 149.01
£ 3.02 shippingShips within U.S.A.Quantity: 1 available
Condition: New. pp. 985.
- Softcover
Seller: Biblios, frankfurt am main, HESSE, GermanyBiblios
Contact seller4-star sellerCondition: New
£ 157.85
£ 8.64 shippingShips from Germany to U.S.A.Quantity: 1 available
Condition: New. pp. 985.
- Hardcover
Seller: GreatBookPrices, Columbia, MD, U.S.A.GreatBookPrices
Contact seller5-star sellerCondition: New
£ 168.63
£ 2.00 shippingShips within U.S.A.Quantity: 15 available
Condition: New.
- Hardcover
Seller: Ria Christie Collections, Uxbridge, United KingdomRia Christie Collections
Contact seller5-star sellerCondition: New
£ 158.32
£ 11.98 shippingShips from United Kingdom to U.S.A.Quantity: Over 20 available
Condition: New. In.
- Softcover
Seller: Ria Christie Collections, Uxbridge, United KingdomRia Christie Collections
Contact seller5-star sellerCondition: New
£ 168.56
£ 11.98 shippingShips from United Kingdom to U.S.A.Quantity: Over 20 available
Condition: New. In.
- Hardcover
Seller: GreatBookPrices, Columbia, MD, U.S.A.GreatBookPrices
Contact seller5-star sellerCondition: Used - As new
£ 194.41
£ 2.00 shippingShips within U.S.A.Quantity: 15 available
Condition: As New. Unread book in perfect condition.
- Softcover
Seller: Books Puddle, New York, NY, U.S.A.Books Puddle
Contact seller4-star sellerCondition: New
£ 212.27
£ 3.02 shippingShips within U.S.A.Quantity: 4 available
Condition: New. pp. 452.
- Softcover
Seller: GreatBookPrices, Columbia, MD, U.S.A.GreatBookPrices
Contact seller5-star sellerCondition: New
£ 220.02
£ 2.00 shippingShips within U.S.A.Quantity: 15 available
Condition: New.
- Hardcover
Seller: moluna, Greven, , Germanymoluna
Contact seller5-star sellerCondition: New
£ 184.85
£ 42.52 shippingShips from Germany to U.S.A.Quantity: Over 20 available
Gebunden. Condition: New. Provides a comprehensive summary of the most recent advances in materials development for advanced packagingCovers emerging technologies such as digital health, bio-medical, and nano-materials / processing, in addition to microelectronic and optoe.
- Hardcover
Seller: GreatBookPrices, Columbia, MD, U.S.A.GreatBookPrices
Contact seller5-star sellerCondition: New
£ 239.99
£ 2.00 shippingShips within U.S.A.Quantity: Over 20 available
Condition: New.
- Softcover
Seller: GreatBookPrices, Columbia, MD, U.S.A.GreatBookPrices
Contact seller5-star sellerCondition: Used - As new
£ 241.63
£ 2.00 shippingShips within U.S.A.Quantity: 15 available
Condition: As New. Unread book in perfect condition.
More images- Softcover
Seller: preigu, Osnabrück, Germanypreigu
Contact seller5-star sellerCondition: New
£ 181.30
£ 60.76 shippingShips from Germany to U.S.A.Quantity: 5 available
Taschenbuch. Condition: Neu. Materials for Advanced Packaging | C. P. Wong (u. a.) | Taschenbuch | xvi | Englisch | 2018 | Springer Nature Switzerland | EAN 9783319832098 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu.
- Hardcover
Seller: GreatBookPricesUK, Woodford Green, United KingdomGreatBookPricesUK
Contact seller5-star sellerCondition: New
£ 222.43
£ 15.00 shippingShips from United Kingdom to U.S.A.Quantity: Over 20 available
Condition: New.
- Softcover
Seller: Mispah books, Redhill, SURRE, United KingdomMispah books
Contact seller4-star sellerCondition: Used - As new
£ 214.00
£ 25.00 shippingShips from United Kingdom to U.S.A.Quantity: 1 available
Paperback. Condition: Like New. LIKE NEW. SHIPS FROM MULTIPLE LOCATIONS. book.
- Hardcover
Seller: Ria Christie Collections, Uxbridge, United KingdomRia Christie Collections
Contact seller5-star sellerCondition: New
£ 230.00
£ 11.98 shippingShips from United Kingdom to U.S.A.Quantity: Over 20 available
Condition: New. In.
- Hardcover
Seller: Books Puddle, New York, NY, U.S.A.Books Puddle
Contact seller4-star sellerCondition: New
£ 250.93
£ 3.02 shippingShips within U.S.A.Quantity: 4 available
Condition: New. pp. 732.
- Hardcover
Seller: Revaluation Books, Exeter, , United KingdomRevaluation Books
Contact seller5-star sellerCondition: New
£ 233.66
£ 12.50 shippingShips from United Kingdom to U.S.A.Quantity: 2 available
Hardcover. Condition: Brand New. 437 pages. 9.00x6.00x1.00 inches. In Stock.
- Hardcover
Seller: AHA-BUCH GmbH, Einbeck, GermanyAHA-BUCH GmbH
Contact seller5-star sellerCondition: New
£ 201.17
£ 57.90 shippingShips from Germany to U.S.A.Quantity: 2 available
Buch. Condition: Neu. Druck auf Anfrage Neuware - Printed after ordering - Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have been introduced. This book provides a comprehensive overview of the recent developments in this… industry, particularly in the areas of microelectronics, optoelectronics, digital health, and bio-medical applications. This book discusses established techniques, as well as emerging technologies, in order to provide readers with the most up-to-date developments in advanced packaging.
Language: English
Published by Springer International Publishing, Springer Nature Switzerland 2018
- Softcover
Seller: AHA-BUCH GmbH, Einbeck, GermanyAHA-BUCH GmbH
Contact seller5-star sellerCondition: New
£ 210.43
£ 58.43 shippingShips from Germany to U.S.A.Quantity: 1 available
Taschenbuch. Condition: Neu. Druck auf Anfrage Neuware - Printed after ordering - This second edition continues to be the most comprehensive review on the developments in advanced packaging technologies. Experts in the field discuss established techniques, as well as emerging technologies, to provide readers with the most up-to-…date developments in advanced packaging. Original chapters on bonding and joining techniques, nanopackaging and biomedical packaging, MEMS and wafer level chip scale packaging, and packaging materials such as lead-free solders, flip chip underfills, epoxy molding compounds, and conductive adhesives have all been updated with the latest developments in the field. New chapters have also been added on fast growing and emerging applications such as flexible and printed electronics, materials solutions to enable next generation thinner/lighter/more functional mobile devices, and functional coating for electronic devices such as anti-fingerprint coating, anti-scratch coating, and more. This book is ideal for professionals in semiconductor, digital health, and bio-medical areas as well as graduate students studying materials science and engineering.
- Hardcover
Seller: California Books, Miami, FL, U.S.A.California Books
Contact seller4-star sellerCondition: New
£ 302.73
Free ShippingShips within U.S.A.Quantity: Over 20 available
Condition: New.
- Hardcover
Seller: BUCHSERVICE / ANTIQUARIAT Lars Lutzer, Wahlstedt, GermanyBUCHSERVICE / ANTIQUARIAT Lars Lutzer
Contact seller5-star sellerCondition: Used - Very good
£ 268.11
£ 34.67 shippingShips from Germany to U.S.A.Quantity: 1 available
Condition: gut. Materials for Advanced Packaging In deutscher Sprache. pages.
- Hardcover
Seller: Mispah books, Redhill, SURRE, United KingdomMispah books
Contact seller4-star sellerCondition: Used - As new
£ 269.00
£ 25.00 shippingShips from United Kingdom to U.S.A.Quantity: 1 available
Hardcover. Condition: Like New. Like New. book.
- Hardcover
Seller: GreatBookPricesUK, Woodford Green, United KingdomGreatBookPricesUK
Contact seller5-star sellerCondition: Used - As new
£ 276.99
£ 15.00 shippingShips from United Kingdom to U.S.A.Quantity: Over 20 available
Condition: As New. Unread book in perfect condition.
- Softcover
Seller: Mispah books, Redhill, SURRE, United KingdomMispah books
Contact seller4-star sellerCondition: New
£ 268.00
£ 25.00 shippingShips from United Kingdom to U.S.A.Quantity: 1 available
Paperback. Condition: New. NEW. SHIPS FROM MULTIPLE LOCATIONS. book.
- Hardcover
Seller: Mispah books, Redhill, SURRE, United KingdomMispah books
Contact seller4-star sellerCondition: Used - As new
£ 277.00
£ 25.00 shippingShips from United Kingdom to U.S.A.Quantity: 1 available
Hardcover. Condition: Like New. LIKE NEW. SHIPS FROM MULTIPLE LOCATIONS. book.
- Hardcover
Seller: GreatBookPrices, Columbia, MD, U.S.A.GreatBookPrices
Contact seller5-star sellerCondition: Used - As new
£ 311.38
£ 2.00 shippingShips within U.S.A.Quantity: Over 20 available
Condition: As New. Unread book in perfect condition.
Language: English
Published by Springer International Publishing, Springer International Publishing 2016
- Hardcover
Seller: AHA-BUCH GmbH, Einbeck, GermanyAHA-BUCH GmbH
Contact seller5-star sellerCondition: New
£ 286.96
£ 59.13 shippingShips from Germany to U.S.A.Quantity: 1 available
Buch. Condition: Neu. Druck auf Anfrage Neuware - Printed after ordering - This second edition continues to be the most comprehensive review on the developments in advanced packaging technologies. Experts in the field discuss established techniques, as well as emerging technologies, to provide readers with the most up-to-date de…velopments in advanced packaging. Original chapters on bonding and joining techniques, nanopackaging and biomedical packaging, MEMS and wafer level chip scale packaging, and packaging materials such as lead-free solders, flip chip underfills, epoxy molding compounds, and conductive adhesives have all been updated with the latest developments in the field. New chapters have also been added on fast growing and emerging applications such as flexible and printed electronics, materials solutions to enable next generation thinner/lighter/more functional mobile devices, and functional coating for electronic devices such as anti-fingerprint coating, anti-scratch coating, and more. This book is ideal for professionals in semiconductor, digital health, and bio-medical areas as well as graduate students studying materials science and engineering.
