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Synopsis
Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have been introduced. This book provides a comprehensive overview of the recent developments in this industry, particularly in the areas of microelectronics, optoelectronics, digital health, and bio-medical applications. The book discusses established techniques, as well as emerging technologies, in order to provide readers with the most up-to-date developments in advanced packaging.
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From the Back Cover
Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have been introduced. Materials for Advanced Packaging provides a comprehensive review on the most recent developments in advanced packaging technologies including emerging technologies such as 3 dimensional (3D), nanopackaging, and biomedical packaging with a focus on materials and processing aspects.
This book discusses established techniques, as well as emerging technologies, in order to provide readers with the most up-to-date developments in advanced packaging including:
New bonding and joining techniques
Novel approaches to make electrical interconnects between integrated circuit (IC) and substrates
Latest advances in packaging materials such as lead-free solders, flip chip underfills, epoxy molding compounds, and conductive adhesives.
Materials and processing aspects on MEMS and wafer level chip scale packaging.
Written by experts in the field of materials and packaging, Materials for Advanced Packaging is a must have book for professionals in semiconductor, digital health and bio-medical areas, and graduate students studying materials science and engineering.
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Materials for Advanced Packaging.
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Materials for Advanced Packaging
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Materials for Advanced Packaging
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Materials for Advanced Packaging
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Materials for Advanced Packaging
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Materials for Advanced Packaging
Print on DemandSeller: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, Germany
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Buch. Condition: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have been introduced. This book provides a comprehensive overview of the recent developments in this industry, particularly in the areas of microelectronics, optoelectronics, digital health, and bio-medical applications. This book discusses established techniques, as well as emerging technologies, in order to provide readers with the most up-to-date developments in advanced packaging. 724 pp. Englisch. Seller Inventory # 9780387782188
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Materials for Advanced Packaging
Seller: AHA-BUCH GmbH, Einbeck, Germany
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Buch. Condition: Neu. Druck auf Anfrage Neuware - Printed after ordering - Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have been introduced. This book provides a comprehensive overview of the recent developments in this industry, particularly in the areas of microelectronics, optoelectronics, digital health, and bio-medical applications. This book discusses established techniques, as well as emerging technologies, in order to provide readers with the most up-to-date developments in advanced packaging. Seller Inventory # 9780387782188
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Materials for Advanced Packaging
Seller: moluna, Greven, Germany
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Gebunden. Condition: New. Provides a comprehensive summary of the most recent advances in materials development for advanced packagingCovers emerging technologies such as digital health, bio-medical, and nano-materials / processing, in addition to microelectronic and optoe. Seller Inventory # 458430730
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Materials for Advanced Packaging
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Materials for Advanced Packaging
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Hardcover. Condition: Like New. Like New. book. Seller Inventory # ERICA77303877821846
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