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3D Integration for VLSI Systems
Language: English
Published by Jenny Stanford Publishing, 2011
ISBN 10: 981430381X ISBN 13: 9789814303811
Condition: very_good. Fast Free Shipping â" Very Good condition book with a firm cover and clean pages. Shows normal use and some light wear or limited notes markings. A solid, nice copy to enjoy.
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3D Integration for VLSI Systems
Language: English
Published by Jenny Stanford Publishing, 2011
ISBN 10: 981430381X ISBN 13: 9789814303811
Condition: As New. Unread book in perfect condition.
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3D Integration for VLSI Systems
Language: English
Published by Jenny Stanford Publishing, 2011
ISBN 10: 981430381X ISBN 13: 9789814303811
Condition: New.
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3D Integration for VLSI Systems (Hardcover)
Language: English
Published by Pan Stanford Publishing Pte Ltd, Singapore, 2011
ISBN 10: 981430381X ISBN 13: 9789814303811
Hardcover. Condition: new. Hardcover. Three-dimensional (3D) integration is identified as a possible avenue for continuous performance growth in integrated circuits (IC) as the conventional scaling approach is faced with unprecedented challenges in fundamental and economic limits. Wafer level 3D IC can take several forms, and they usually include a stack of several thinned IC layers that are vertically bonded and interconnected by through silicon via TSV. There is a long string of benefits that one can derive from 3D IC implementation such as form factor, density multiplication, improved delay and power, enhanced bandwidth, and heterogeneous integration. This book presents contributions by key researchers in this field, covering motivations, technology platforms, applications, and other design issues. Shipping may be from multiple locations in the US or from the UK, depending on stock availability.
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3D Integration for VLSI Systems
Language: English
Published by Jenny Stanford Publishing, 2011
ISBN 10: 981430381X ISBN 13: 9789814303811
Seller: GreatBookPricesUK, Woodford Green, United Kingdom
Seller rating 5 out of 5 stars
Condition: As New. Unread book in perfect condition.
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3D Integration for VLSI Systems
Language: English
Published by Pan Stanford Publishing, 2011
ISBN 10: 981430381X ISBN 13: 9789814303811
Condition: New. pp. 350.
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3D Integration for VLSI Systems
Language: English
Published by Jenny Stanford Publishing, 2011
ISBN 10: 981430381X ISBN 13: 9789814303811
Seller: Ria Christie Collections, Uxbridge, United Kingdom
Seller rating 5 out of 5 stars
£ 133.99
£ 11.98 shipping
Ships from United Kingdom to U.S.A.Quantity: Over 20 available
Add to basketCondition: New. In.
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3D Integration for VLSI Systems
Language: English
Published by Jenny Stanford Publishing, 2011
ISBN 10: 981430381X ISBN 13: 9789814303811
Seller: GreatBookPricesUK, Woodford Green, United Kingdom
Seller rating 5 out of 5 stars
Condition: New.
-
3D Integration for VLSI Systems
Language: English
Published by Pan Stanford Publishing, 2011
ISBN 10: 981430381X ISBN 13: 9789814303811
Condition: New. pp. 350.
-
3D Integration for VLSI Systems (Hardcover)
Language: English
Published by Pan Stanford Publishing Pte Ltd, Singapore, 2011
ISBN 10: 981430381X ISBN 13: 9789814303811
Hardcover. Condition: new. Hardcover. Three-dimensional (3D) integration is identified as a possible avenue for continuous performance growth in integrated circuits (IC) as the conventional scaling approach is faced with unprecedented challenges in fundamental and economic limits. Wafer level 3D IC can take several forms, and they usually include a stack of several thinned IC layers that are vertically bonded and interconnected by through silicon via TSV. There is a long string of benefits that one can derive from 3D IC implementation such as form factor, density multiplication, improved delay and power, enhanced bandwidth, and heterogeneous integration. This book presents contributions by key researchers in this field, covering motivations, technology platforms, applications, and other design issues. Shipping may be from our Sydney, NSW warehouse or from our UK or US warehouse, depending on stock availability.
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3d Integration of Integrated Circuits
Published by Pan Stanford Pub, 2011
ISBN 10: 981430381X ISBN 13: 9789814303811
Hardcover. Condition: Brand New. 1st edition. 350 pages. 9.50x6.50x1.00 inches. In Stock.
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Hardcover. Condition: New. HardCover.Pub Date:2020-09-01 Pages:32 Language:Chinese Publisher:Jiangsu Phoenix Children's Publishing House William lives in a very different place from ours: there is no electricity. and the sun goes to bed before going to bed; people often have to go to bed a day Eat a meal; many children drop out of school because they can't pay the tuition and go home.Drought. hungry. and poverty take turns. and there is no shortage of wind throughout the year.?One day. William found a community libra.
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3D Integration for VLSI Systems
Language: English
Published by Pan Stanford Publishing, 2011
ISBN 10: 981430381X ISBN 13: 9789814303811
Condition: New. pp. 350 This item is printed on demand.
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3D Integration for VLSI Systems
Language: English
Published by Jenny Stanford Publishing, 2011
ISBN 10: 981430381X ISBN 13: 9789814303811
Seller: PBShop.store UK, Fairford, GLOS, United Kingdom
Seller rating 4 out of 5 stars
£ 138.86
£ 5.02 shipping
Ships from United Kingdom to U.S.A.Quantity: Over 20 available
Add to basketHRD. Condition: New. New Book. Delivered from our UK warehouse in 4 to 14 business days. THIS BOOK IS PRINTED ON DEMAND. Established seller since 2000.
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3D Integration for VLSI Systems
Language: English
Published by Jenny Stanford Publishing, 2011
ISBN 10: 981430381X ISBN 13: 9789814303811
HRD. Condition: New. New Book. Shipped from UK. THIS BOOK IS PRINTED ON DEMAND. Established seller since 2000.
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3D Integration for VLSI Systems
Language: English
Published by Jenny Stanford Publishing, 2011
ISBN 10: 981430381X ISBN 13: 9789814303811
Gebunden. Condition: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Chuan Seng Tan, Kuan-Neng ChenThree-dimensional (3D) integration is identified as a possible avenue for continuous performance growth in integrated circuits (IC) as the conventional scaling approach is faced with unprecedented challenges in fundament.
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3D Integration for VLSI Systems
Language: English
Published by Jenny Stanford Publishing, 2011
ISBN 10: 981430381X ISBN 13: 9789814303811
Buch. Condition: Neu. 3D Integration for VLSI Systems | Chuan Seng Tan (u. a.) | Buch | Einband - fest (Hardcover) | Englisch | 2011 | Jenny Stanford Publishing | EAN 9789814303811 | Verantwortliche Person für die EU: Libri GmbH, Europaallee 1, 36244 Bad Hersfeld, gpsr[at]libri[dot]de | Anbieter: preigu Print on Demand.
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3D Integration for VLSI Systems
Language: English
Published by Jenny Stanford Publishing, 2011
ISBN 10: 981430381X ISBN 13: 9789814303811
Buch. Condition: Neu. nach der Bestellung gedruckt Neuware - Printed after ordering - Three-dimensional (3D) integration is identified as a possible avenue for continuous performance growth in integrated circuits (IC). Wafer level 3D IC can take several forms, and they usually include a stack of several thinned IC layers that are vertically bonded and interconnected by through silicon via TSV. This book presents contributions by key researchers in this field, covering motivations, technology platforms, applications, and other design issues.
-
3d Integration of Integrated Circuits
Published by Pan Stanford Pub, 2011
ISBN 10: 981430381X ISBN 13: 9789814303811
Hardcover. Condition: Brand New. 1st edition. 350 pages. 9.50x6.50x1.00 inches. In Stock. This item is printed on demand.
