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Multichip Modules: Systems Advantages, Major Constructions, and Materials Technologies (IEEE Press Selected Reprint Series)
Language: English
Published by IEEE Operations Center, 1991
ISBN 10: 087942267X ISBN 13: 9780879422677
Condition: New.
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Multichip Modules: Systems Advantages, Major Constructions, and Materials Technologies (IEEE Press Selected Reprint Series)
Language: English
Published by IEEE Operations Center, 1991
ISBN 10: 087942267X ISBN 13: 9780879422677
Condition: New.
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Multichip Modules: Systems Advantages, Major Constructions, and Materials Technologies (IEEE Press Selected Reprint Series)
Language: English
Published by IEEE Operations Center, 1991
ISBN 10: 087942267X ISBN 13: 9780879422677
Condition: New.
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Condition: Brand New. New. US edition. Expediting shipping for all USA and Europe orders excluding PO Box. Excellent Customer Service.
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Condition: New. This is a Brand-new US Edition. This Item may be shipped from US or any other country as we have multiple locations worldwide.
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Condition: New. Satisfaction Guaranteed or your money back.
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Multichip Modules: Systems Advantages, Major Constructions, and Materials Technologies (IEEE Press Selected Reprint Series)
Language: English
Published by IEEE Publications,U.S., 1991
ISBN 10: 087942267X ISBN 13: 9780879422677
Condition: Sehr gut. Zustand: Sehr gut | Seiten: 656 | Sprache: Englisch | Produktart: Bücher | Keine Beschreibung verfügbar.
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Foldable Flex and Thinned Silicon Multichip Packaging Technology (Emerging Technology in Advanced Packaging)
Seller: Ria Christie Collections, Uxbridge, United Kingdom
Seller rating 5 out of 5 stars
£ 136.79
£ 11.98 shipping
Ships from United Kingdom to U.S.A.Quantity: Over 20 available
Add to basketCondition: New. In.
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Foldable Flex and Thinned Silicon Multichip Packaging Technology (Emerging Technology in Advanced Packaging, 1)
Seller: Ria Christie Collections, Uxbridge, United Kingdom
Seller rating 5 out of 5 stars
£ 136.79
£ 11.98 shipping
Ships from United Kingdom to U.S.A.Quantity: Over 20 available
Add to basketCondition: New. In.
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Folded Flex and Thinned Silicon Chip Packaging Technology
Seller: GreatBookPricesUK, Woodford Green, United Kingdom
Seller rating 5 out of 5 stars
£ 136.78
£ 15 shipping
Ships from United Kingdom to U.S.A.Quantity: Over 20 available
Add to basketCondition: New.
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Condition: New.
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Condition: As New. Unread book in perfect condition.
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Condition: Sehr gut. Zustand: Sehr gut | Seiten: 347 | Sprache: Englisch | Produktart: Bücher | Foldable Flex and Thinned Silicon Multichip Packaging Technology presents newly emerging methods used to make stacked chip packages in the so-called 2-1/2 D technology (3-D in physical format, but interconnected only through the circuits on folded flex). It is also being used in single chip packages where the thinness of the chips and the flex substrate made packages significantly thinner than through any other means.
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Folded Flex and Thinned Silicon Chip Packaging Technology
Seller: GreatBookPricesUK, Woodford Green, United Kingdom
Seller rating 5 out of 5 stars
£ 152.24
£ 15 shipping
Ships from United Kingdom to U.S.A.Quantity: Over 20 available
Add to basketCondition: As New. Unread book in perfect condition.
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Condition: New. pp. 372.
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Taschenbuch. Condition: Neu. Foldable Flex and Thinned Silicon Multichip Packaging Technology | John W. Balde | Taschenbuch | xix | Englisch | 2014 | Springer US | EAN 9781461349778 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu.
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Foldable Flex and Thinned Silicon Multichip Packaging Technology
Language: English
Published by Kluwer Academic Publishers, 2003
ISBN 10: 0792376765 ISBN 13: 9780792376767
Seller: Kennys Bookshop and Art Galleries Ltd., Galway, GY, Ireland
Seller rating 5 out of 5 stars
Condition: New. Presents the methods used to make stacked chip packages in the 2-1/2 D technology (3-D in physical format, but interconnected only through the circuits on folded flex). It is also being used in single chip packages where the thinness of the chips and the flex substrate made packages significantly thinner than through any other means. Editor(s): Balde, John W. Series: Emerging Technology in Advanced Packaging. Num Pages: 347 pages, 266 black & white illustrations, biography. BIC Classification: TD; TJF. Category: (P) Professional & Vocational; (UP) Postgraduate, Research & Scholarly; (UU) Undergraduate. Dimension: 235 x 155 x 22. Weight in Grams: 703. . 2003. Hardback. . . . .
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Gebunden. Condition: New. Foldable Flex and Thinned Silicon Multichip Packaging Technology presents newly emerging methods used to make stacked chip packages in the so-called 2-1/2 D technology (3-D in physical format, but interconnected only through the circuits.
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Foldable Flex and Thinned Silicon Multichip Packaging Technology
Language: English
Published by Springer US, Springer US, 2014
ISBN 10: 146134977X ISBN 13: 9781461349778
Taschenbuch. Condition: Neu. Druck auf Anfrage Neuware - Printed after ordering - Foldable Flex and Thinned Silicon Multichip Packaging Technology presents newly emerging methods used to make stacked chip packages in the so-called 2-1/2 D technology (3-D in physical format, but interconnected only through the circuits on folded flex). It is also being used in single chip packages where the thinness of the chips and the flex substrate made packages significantly thinner than through any other means.
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Paperback. Condition: Brand New. 366 pages. 9.30x6.20x0.90 inches. In Stock.
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Foldable Flex and Thinned Silicon Multichip Packaging Technology
Language: English
Published by Kluwer Academic Publishers, 2003
ISBN 10: 0792376765 ISBN 13: 9780792376767
Condition: New. Presents the methods used to make stacked chip packages in the 2-1/2 D technology (3-D in physical format, but interconnected only through the circuits on folded flex). It is also being used in single chip packages where the thinness of the chips and the flex substrate made packages significantly thinner than through any other means. Editor(s): Balde, John W. Series: Emerging Technology in Advanced Packaging. Num Pages: 347 pages, 266 black & white illustrations, biography. BIC Classification: TD; TJF. Category: (P) Professional & Vocational; (UP) Postgraduate, Research & Scholarly; (UU) Undergraduate. Dimension: 235 x 155 x 22. Weight in Grams: 703. . 2003. Hardback. . . . . Books ship from the US and Ireland.
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Foldable Flex and Thinned Silicon Multichip Packaging Technology
Language: English
Published by Springer Us Jan 2003, 2003
ISBN 10: 0792376765 ISBN 13: 9780792376767
Buch. Condition: Neu. Neuware - Foldable Flex and Thinned Silicon Multichip Packaging Technology presents newly emerging methods used to make stacked chip packages in the so-called 2-1/2 D technology (3-D in physical format, but interconnected only through the circuits on folded flex). It is also being used in single chip packages where the thinness of the chips and the flex substrate made packages significantly thinner than through any other means.
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Condition: new. Questo è un articolo print on demand.
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Foldable Flex and Thinned Silicon Multichip Packaging Technology
Language: English
Published by Springer US Feb 2014, 2014
ISBN 10: 146134977X ISBN 13: 9781461349778
Seller: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, Germany
Seller rating 5 out of 5 stars
Taschenbuch. Condition: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -Foldable Flex and Thinned Silicon Multichip Packaging Technology presents newly emerging methods used to make stacked chip packages in the so-called 2-1/2 D technology (3-D in physical format, but interconnected only through the circuits on folded flex). It is also being used in single chip packages where the thinness of the chips and the flex substrate made packages significantly thinner than through any other means. 372 pp. Englisch.
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Condition: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Foldable Flex and Thinned Silicon Multichip Packaging Technology presents newly emerging methods used to make stacked chip packages in the so-called 2-1/2 D technology (3-D in physical format, but interconnected only through the circuits.
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Foldable Flex and Thinned Silicon Multichip Packaging Technology
Language: English
Published by Springer US, Springer US Feb 2014, 2014
ISBN 10: 146134977X ISBN 13: 9781461349778
Seller: buchversandmimpf2000, Emtmannsberg, BAYE, Germany
Seller rating 5 out of 5 stars
Taschenbuch. Condition: Neu. This item is printed on demand - Print on Demand Titel. Neuware -Foldable Flex and Thinned Silicon Multichip Packaging Technology presents newly emerging methods used to make stacked chip packages in the so-called 2-1/2 D technology (3-D in physical format, but interconnected only through the circuits on folded flex). It is also being used in single chip packages where the thinness of the chips and the flex substrate made packages significantly thinner than through any other means.Springer-Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 372 pp. Englisch.
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Condition: New. Print on Demand pp. 372 49:B&W 6.14 x 9.21 in or 234 x 156 mm (Royal 8vo) Perfect Bound on White w/Gloss Lam.
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Condition: New. PRINT ON DEMAND pp. 372.
