Foldable Flex and Thinned Silicon Multichip Packaging Technology (Emerging Technology in Advanced Packaging)

Balde, John W. (Editor)

ISBN 10: 146134977X ISBN 13: 9781461349778
Published by Springer, 2014
Language: English
Condition: New Soft cover

Sold by Revaluation Books, Exeter, United Kingdom

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New - Soft cover

Condition: New

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