Foldable Flex and Thinned Silicon Multichip Packaging Technology

John W. Balde

ISBN 10: 146134977X ISBN 13: 9781461349778
Published by Springer US, Springer US Feb 2014, 2014
Language: English
Condition: New Soft cover

Sold by buchversandmimpf2000, Emtmannsberg, BAYE, Germany

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New - Soft cover

Condition: New

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Ships from Germany to U.S.A.

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