Adrian K Sterling (23 results)

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Paperback. Condition: new. Paperback. From Wafer Fabrication to Advanced Packaging for High-Performance Computing SystemsWhat happens between semiconductor design and the finished AI chip?Behind every AI accelerator is a highly coordinated manufacturing system involving materials, nanometer-scale patterns, contamination control, process variation, defects, yield, packaging, testing, and production efficiency.Semiconductor Manufacturing for the AI Era Handbook takes you inside this system and explains how modern semiconductor manufacturing works as one connected engineering process, where every decision can affect performance, yield, reliability, cost, and capacity.What You'll Discover Inside Semiconductor Materials & Wafer EngineeringSilicon crystal growth, wafer preparation, defects, resistivity, surface quality, contamination, engineered substrates, and wafer qualification.Cleanrooms & Fab InfrastructureContamination control, ultrapure water, process gases, vacuum systems, environmental control, vibration, and facility reliability. Thin-Film EngineeringOxidation, CVD, PVD, ALD, epitaxy, interfaces, film stress, conformality, uniformity, and process control. Photolithography & Advanced PatterningPhotoresist, optical imaging, critical dimensions, overlay, EUV, multiple patterning, computational lithography, and process-window control.Plasma Etching & Pattern TransferAnisotropic etching, selectivity, aspect-ratio effects, loading, profile control, endpoint detection, plasma damage, and 3D structures. Metrology, Process Control & YieldLearn how manufacturers measure variation, detect defects and excursions, investigate failures, and improve manufacturing yield. Memory, Chiplets, HBM & Advanced PackagingExplore silicon interposers, redistribution layers, TSVs, wafer thinning, hybrid bonding, microbumps, heterogeneous integration, chiplets, and high-bandwidth memory. AI-Enabled Smart FabsDiscover how AI and machine learning support process monitoring, excursion detection, predictive maintenance, factory scheduling, and manufacturing optimization. Manufacturing Economics & CapacityUnderstand yield, throughput, cycle time, bottlenecks, capital investment, packaging capacity, and cost per good die.Built for Engineers and Technology ProfessionalsIdeal for engineering students, semiconductor professionals, manufacturing engineers, technical managers, researchers, and technology professionals who want to understand the bigger picture.Rather than presenting disconnected process recipes, this handbook focuses on physical mechanisms, process interactions, engineering trade-offs, variability, measurement, yield, reliability, and manufacturability.You'll find worked examples, quantitative reasoning, figures, tables, practice problems, key equations, and engineering case studies to strengthen practical understanding.Why This Handbook MattersAI hardware is moving semiconductor manufacturing beyond transistor scaling. Greater performance now demands higher memory bandwidth, advanced interconnects, thermal management, sophisticated packaging, higher yield, and intelligent factories.From crystal growth and wafer fabrication to lithography, etching, interconnects, HBM, chiplets, advanced packaging, and AI-assisted process control, this handbook gives you a clear framework for understanding the complete manufacturing chain.Follow the wafer. Understand the process. Think like a semiconductor manufacturing engineer. This item is printed on Shipping may be from multiple locations in the US or from the UK, depending on stock availability.…

Paperback. Condition: new. Paperback. From Wafer Fabrication to Advanced Packaging for High-Performance Computing SystemsWhat happens between semiconductor design and the finished AI chip?Behind every AI accelerator is a highly coordinated manufacturing system involving materials, nanometer-scale patterns, contamination control, process variation, defects, yield, packaging, testing, and production efficiency.Semiconductor Manufacturing for the AI Era Handbook takes you inside this system and explains how modern semiconductor manufacturing works as one connected engineering process, where every decision can affect performance, yield, reliability, cost, and capacity.What You'll Discover Inside Semiconductor Materials & Wafer EngineeringSilicon crystal growth, wafer preparation, defects, resistivity, surface quality, contamination, engineered substrates, and wafer qualification.Cleanrooms & Fab InfrastructureContamination control, ultrapure water, process gases, vacuum systems, environmental control, vibration, and facility reliability. Thin-Film EngineeringOxidation, CVD, PVD, ALD, epitaxy, interfaces, film stress, conformality, uniformity, and process control. Photolithography & Advanced PatterningPhotoresist, optical imaging, critical dimensions, overlay, EUV, multiple patterning, computational lithography, and process-window control.Plasma Etching & Pattern TransferAnisotropic etching, selectivity, aspect-ratio effects, loading, profile control, endpoint detection, plasma damage, and 3D structures. Metrology, Process Control & YieldLearn how manufacturers measure variation, detect defects and excursions, investigate failures, and improve manufacturing yield. Memory, Chiplets, HBM & Advanced PackagingExplore silicon interposers, redistribution layers, TSVs, wafer thinning, hybrid bonding, microbumps, heterogeneous integration, chiplets, and high-bandwidth memory. AI-Enabled Smart FabsDiscover how AI and machine learning support process monitoring, excursion detection, predictive maintenance, factory scheduling, and manufacturing optimization. Manufacturing Economics & CapacityUnderstand yield, throughput, cycle time, bottlenecks, capital investment, packaging capacity, and cost per good die.Built for Engineers and Technology ProfessionalsIdeal for engineering students, semiconductor professionals, manufacturing engineers, technical managers, researchers, and technology professionals who want to understand the bigger picture.Rather than presenting disconnected process recipes, this handbook focuses on physical mechanisms, process interactions, engineering trade-offs, variability, measurement, yield, reliability, and manufacturability.You'll find worked examples, quantitative reasoning, figures, tables, practice problems, key equations, and engineering case studies to strengthen practical understanding.Why This Handbook MattersAI hardware is moving semiconductor manufacturing beyond transistor scaling. Greater performance now demands higher memory bandwidth, advanced interconnects, thermal management, sophisticated packaging, higher yield, and intelligent factories.From crystal growth and wafer fabrication to lithography, etching, interconnects, HBM, chiplets, advanced packaging, and AI-assisted process control, this handbook gives you a clear framework for understanding the complete manufacturing chain.Follow the wafer. Understand the process. Think like a semiconductor manufacturing engineer. This item i Shipping may be from our UK warehouse or from our Australian or US warehouses, depending on stock availability.…

Taschenbuch. Condition: Neu. Neuware - Modern industry depends on induction motors, and most are now powered by variable-frequency drives (VFDs). Yet understanding how the motor, inverter, control algorithms, and commissioning process work together remains one of the biggest challenges for students and practicing engineers. This handbook brings everything together in one practical, technically rigorous resource. Inside, you'll learn how to: - Understand induction motor operation, from equivalent circuits to advanced dq-axis dynamic models.- Design and compare V/Hz, Field-Oriented Control (FOC), Direct Torque Control (DTC), sensorless control, and Model Predictive Control (MPC).- Develop current and speed controllers using proven industrial tuning methods.- Implement sinusoidal PWM, Space Vector PWM (SVPWM), and discontinuous PWM with clear mathematical explanations.- Size, protect, simulate, commission, and troubleshoot complete VFD systems using industry best practices.- Apply your knowledge through real-world case studies covering pumps, cranes, high-speed spindles, and more.>Ideal for senior undergraduate and graduate students, electrical engineers, drive system designers, and power electronics professionals seeking a single, comprehensive reference. Build the expertise that modern industry demands. Whether you're preparing for advanced coursework, designing industrial drive systems, or improving your professional skills, this handbook will become an essential reference. Add this handbook to your engineering library today and gain the integrated knowledge needed to design, control, commission, and troubleshoot variable-frequency drive systems with confidence.…

Taschenbuch. Condition: Neu. Neuware.

Taschenbuch. Condition: Neu. Neuware - Every integrated circuit begins as a silicon ingot and ends as a packaged device. Between those points lies a precisely controlled sequence of manufacturing steps, and understanding the science behind each one is what enables engineers to diagnose, optimise, and design semiconductor processes rather than simply follow procedures. Many semiconductor manufacturing resources either oversimplify the science or treat individual processes in isolation, leaving readers to assemble a complete understanding from multiple sources. This textbook provides a rigorous, single-volume guide to the entire IC fabrication process, combining physical principles, engineering practice, and fully worked numerical examples in one consistent reference. Inside this book you will: - Understand the physical and chemical principles behind every major fabrication process through clearly derived equations instead of memorised rules. - Apply quantitative methods using fully worked examples with complete unit tracking and step-by-step calculations. - Strengthen problem-solving skills through practice questions with fully explained solutions. - Follow the complete CMOS manufacturing flow, from silicon crystal growth and wafer preparation to transistors, interconnects, packaging, and final device assembly. - Learn the terminology, metrology, yield analysis, and statistical process control techniques used in modern semiconductor fabrication facilities. - Study the material at a depth suitable for upper-level undergraduate and first-year graduate engineering courses. Topics include crystal growth, wafer preparation, clean-room practices, photolithography, advanced patterning, physical and chemical vapour deposition, epitaxy, atomic layer deposition, ion implantation, rapid thermal processing, wet and plasma etching, chemical mechanical planarisation, copper metallisation, dual-damascene interconnects, CMOS process integration, yield modelling, defect analysis, metrology, statistical process control, and semiconductor packaging. Designed for upper-level undergraduate and graduate students in electrical engineering, materials science, and chemical engineering, this book also serves process engineers and fabrication technicians seeking a rigorous, equation-based foundation in semiconductor manufacturing. Open the first chapter and begin building the quantitative, process-level understanding required to master modern integrated circuit fabrication. …

Paperback. Condition: new. Paperback. Modern industry depends on induction motors, and most are now powered by variable-frequency drives (VFDs). Yet understanding how the motor, inverter, control algorithms, and commissioning process work together remains one of the biggest challenges for students and practicing engineers. This handbook brings everything together in one practical, technically rigorous resource. Inside, you'll learn how to: Understand induction motor operation, from equivalent circuits to advanced dq-axis dynamic models.Design and compare V/Hz, Field-Oriented Control (FOC), Direct Torque Control (DTC), sensorless control, and Model Predictive Control (MPC).Develop current and speed controllers using proven industrial tuning methods.Implement sinusoidal PWM, Space Vector PWM (SVPWM), and discontinuous PWM with clear mathematical explanations.Size, protect, simulate, commission, and troubleshoot complete VFD systems using industry best practices.Apply your knowledge through real-world case studies covering pumps, cranes, high-speed spindles, and more.Covering electromagnetic machine theory, power electronics, digital control, thermal protection, commissioning, and fault diagnosis, this handbook provides a complete engineering workflow, from motor modeling to field deployment. Ideal for senior undergraduate and graduate students, electrical engineers, drive system designers, and power electronics professionals seeking a single, comprehensive reference. Build the expertise that modern industry demands. Whether you're preparing for advanced coursework, designing industrial drive systems, or improving your professional skills, this handbook will become an essential reference. Add this handbook to your engineering library today and gain the integrated knowledge needed to design, control, commission, and troubleshoot variable-frequency drive systems with confidence. This item is printed on demand. Shipping may be from multiple locations in the US or from the UK, depending on stock availability.…

PAP. Condition: New. New Book. Shipped from UK. THIS BOOK IS PRINTED ON DEMAND. Established seller since 2000.

PAP. Condition: New. New Book. Delivered from our UK warehouse in 4 to 14 business days. THIS BOOK IS PRINTED ON DEMAND. Established seller since 2000.

Condition: New. Print on Demand.

PAP. Condition: New. New Book. Shipped from UK. THIS BOOK IS PRINTED ON DEMAND. Established seller since 2000.

PAP. Condition: New. New Book. Delivered from our UK warehouse in 4 to 14 business days. THIS BOOK IS PRINTED ON DEMAND. Established seller since 2000.

Condition: New. Print on Demand.

Paperback. Condition: new. Paperback. Modern industry depends on induction motors, and most are now powered by variable-frequency drives (VFDs). Yet understanding how the motor, inverter, control algorithms, and commissioning process work together remains one of the biggest challenges for students and practicing engineers. This handbook brings everything together in one practical, technically rigorous resource. Inside, you'll learn how to: Understand induction motor operation, from equivalent circuits to advanced dq-axis dynamic models.Design and compare V/Hz, Field-Oriented Control (FOC), Direct Torque Control (DTC), sensorless control, and Model Predictive Control (MPC).Develop current and speed controllers using proven industrial tuning methods.Implement sinusoidal PWM, Space Vector PWM (SVPWM), and discontinuous PWM with clear mathematical explanations.Size, protect, simulate, commission, and troubleshoot complete VFD systems using industry best practices.Apply your knowledge through real-world case studies covering pumps, cranes, high-speed spindles, and more.Covering electromagnetic machine theory, power electronics, digital control, thermal protection, commissioning, and fault diagnosis, this handbook provides a complete engineering workflow, from motor modeling to field deployment. Ideal for senior undergraduate and graduate students, electrical engineers, drive system designers, and power electronics professionals seeking a single, comprehensive reference. Build the expertise that modern industry demands. Whether you're preparing for advanced coursework, designing industrial drive systems, or improving your professional skills, this handbook will become an essential reference. Add this handbook to your engineering library today and gain the integrated knowledge needed to design, control, commission, and troubleshoot variable-frequency drive systems with confidence. This item is printed on demand. Shipping may be from our UK warehouse or from our Australian or US warehouses, depending on stock availability.…

PAP. Condition: New. New Book. Delivered from our UK warehouse in 4 to 14 business days. THIS BOOK IS PRINTED ON DEMAND. Established seller since 2000.

Paperback. Condition: new. Paperback. Every integrated circuit begins as a silicon ingot and ends as a packaged device. Between those points lies a precisely controlled sequence of manufacturing steps, and understanding the science behind each one is what enables engineers to diagnose, optimise, and design semiconductor processes rather than simply follow procedures. Many semiconductor manufacturing resources either oversimplify the science or treat individual processes in isolation, leaving readers to assemble a complete understanding from multiple sources. This textbook provides a rigorous, single-volume guide to the entire IC fabrication process, combining physical principles, engineering practice, and fully worked numerical examples in one consistent reference. Inside this book you will: - Understand the physical and chemical principles behind every major fabrication process through clearly derived equations instead of memorised rules. - Apply quantitative methods using fully worked examples with complete unit tracking and step-by-step calculations. - Strengthen problem-solving skills through practice questions with fully explained solutions. - Follow the complete CMOS manufacturing flow, from silicon crystal growth and wafer preparation to transistors, interconnects, packaging, and final device assembly. - Learn the terminology, metrology, yield analysis, and statistical process control techniques used in modern semiconductor fabrication facilities. - Study the material at a depth suitable for upper-level undergraduate and first-year graduate engineering courses. Topics include crystal growth, wafer preparation, clean-room practices, photolithography, advanced patterning, physical and chemical vapour deposition, epitaxy, atomic layer deposition, ion implantation, rapid thermal processing, wet and plasma etching, chemical mechanical planarisation, copper metallisation, dual-damascene interconnects, CMOS process integration, yield modelling, defect analysis, metrology, statistical process control, and semiconductor packaging. Designed for upper-level undergraduate and graduate students in electrical engineering, materials science, and chemical engineering, this book also serves process engineers and fabrication technicians seeking a rigorous, equation-based foundation in semiconductor manufacturing. Open the first chapter and begin building the quantitative, process-level understanding required to master modern integrated circuit fabrication. This item is printed on demand. Shipping may be from multiple locations in the US or from the UK, depending on stock availability.…

Condition: New. Print on Demand.

PAP. Condition: New. New Book. Shipped from UK. THIS BOOK IS PRINTED ON DEMAND. Established seller since 2000.

Paperback. Condition: new. Paperback. Every integrated circuit begins as a silicon ingot and ends as a packaged device. Between those points lies a precisely controlled sequence of manufacturing steps, and understanding the science behind each one is what enables engineers to diagnose, optimise, and design semiconductor processes rather than simply follow procedures. Many semiconductor manufacturing resources either oversimplify the science or treat individual processes in isolation, leaving readers to assemble a complete understanding from multiple sources. This textbook provides a rigorous, single-volume guide to the entire IC fabrication process, combining physical principles, engineering practice, and fully worked numerical examples in one consistent reference. Inside this book you will: - Understand the physical and chemical principles behind every major fabrication process through clearly derived equations instead of memorised rules. - Apply quantitative methods using fully worked examples with complete unit tracking and step-by-step calculations. - Strengthen problem-solving skills through practice questions with fully explained solutions. - Follow the complete CMOS manufacturing flow, from silicon crystal growth and wafer preparation to transistors, interconnects, packaging, and final device assembly. - Learn the terminology, metrology, yield analysis, and statistical process control techniques used in modern semiconductor fabrication facilities. - Study the material at a depth suitable for upper-level undergraduate and first-year graduate engineering courses. Topics include crystal growth, wafer preparation, clean-room practices, photolithography, advanced patterning, physical and chemical vapour deposition, epitaxy, atomic layer deposition, ion implantation, rapid thermal processing, wet and plasma etching, chemical mechanical planarisation, copper metallisation, dual-damascene interconnects, CMOS process integration, yield modelling, defect analysis, metrology, statistical process control, and semiconductor packaging. Designed for upper-level undergraduate and graduate students in electrical engineering, materials science, and chemical engineering, this book also serves process engineers and fabrication technicians seeking a rigorous, equation-based foundation in semiconductor manufacturing. Open the first chapter and begin building the quantitative, process-level understanding required to master modern integrated circuit fabrication. This item is printed on demand. Shipping may be from our UK warehouse or from our Australian or US warehouses, depending on stock availability.…

Paperback. Condition: new. Paperback. Von der Waferfertigung bis zum Advanced Packaging fuer HochleistungsrechnersystemeDie Halbleiterfertigung steht im Zentrum der modernen KI-Revolution. Leistungsfaehige KI-Systeme benoetigen nicht nur immer dichtere Transistorstrukturen, sondern auch hohe Speicherbandbreite, effiziente Interconnects, zuverlaessige Stromversorgung, leistungsfaehiges Waermemanagement und hochentwickelte Packaging-Technologien.Dieses umfassende Ingenieurhandbuch vermittelt die Halbleiterproduktion als zusammenhaengendes technisches System - von den Grundlagen der Halbleitermaterialien und Wafertechnik bis zu modernen Fertigungs- und Integrationsverfahren.Behandelt werden unter anderem: Halbleitermaterialien, Kristallstrukturen und WafertechnikReinraeume, Kontaminationskontrolle und Fab-InfrastrukturOxidation, Abscheidung und DuennschichttechnikFotolithografie, AEtzen und IonenimplantationTransistorintegration und moderne Logik-ProzessfluesseVerdrahtung, Kontakte und BEOL-IntegrationMetrologie, Inspektion, Prozesskontrolle und Yield EngineeringSpeicherfertigung fuer KI-SystemeAdvanced Packaging, Chiplets und 2,5D-/3D-IntegrationKI-gestuetzte Smart Fabs und FertigungsautomationOEkonomie, Nachhaltigkeit, Lieferketten und die Fab der ZukunftBesonders wertvoll ist die systemische Betrachtung von Prozessfenstern, Variation, Messung, Ausbeute, Zuverlaessigkeit, thermischen und mechanischen Wechselwirkungen sowie Fertigungsoekonomie. Damit verbindet das Buch physikalische Grundlagen mit den praktischen Zusammenhaengen moderner Halbleiterproduktion.Ideal fuer fortgeschrittene Studierende, Ingenieurinnen und Ingenieure sowie Fach- und Fuehrungskraefte aus Elektrotechnik, Werkstofftechnik, Chemieingenieurwesen, Maschinenbau, Physik und Produktionstechnik.Entdecken Sie die technischen Prinzipien hinter den Chips der KI-AEra und bauen Sie mit diesem praxisorientierten Handbuch ein fundiertes Verstaendnis der modernen Halbleiterfertigung auf - sichern Sie sich jetzt Ihr Exemplar! This item is printed on demand. Shipping may be from multiple locations in the US or from the UK, depending on stock availability.…

Condition: New. Print on Demand.

Paperback. Condition: new. Paperback. Von der Waferfertigung bis zum Advanced Packaging fuer HochleistungsrechnersystemeDie Halbleiterfertigung steht im Zentrum der modernen KI-Revolution. Leistungsfaehige KI-Systeme benoetigen nicht nur immer dichtere Transistorstrukturen, sondern auch hohe Speicherbandbreite, effiziente Interconnects, zuverlaessige Stromversorgung, leistungsfaehiges Waermemanagement und hochentwickelte Packaging-Technologien.Dieses umfassende Ingenieurhandbuch vermittelt die Halbleiterproduktion als zusammenhaengendes technisches System - von den Grundlagen der Halbleitermaterialien und Wafertechnik bis zu modernen Fertigungs- und Integrationsverfahren.Behandelt werden unter anderem: Halbleitermaterialien, Kristallstrukturen und WafertechnikReinraeume, Kontaminationskontrolle und Fab-InfrastrukturOxidation, Abscheidung und DuennschichttechnikFotolithografie, AEtzen und IonenimplantationTransistorintegration und moderne Logik-ProzessfluesseVerdrahtung, Kontakte und BEOL-IntegrationMetrologie, Inspektion, Prozesskontrolle und Yield EngineeringSpeicherfertigung fuer KI-SystemeAdvanced Packaging, Chiplets und 2,5D-/3D-IntegrationKI-gestuetzte Smart Fabs und FertigungsautomationOEkonomie, Nachhaltigkeit, Lieferketten und die Fab der ZukunftBesonders wertvoll ist die systemische Betrachtung von Prozessfenstern, Variation, Messung, Ausbeute, Zuverlaessigkeit, thermischen und mechanischen Wechselwirkungen sowie Fertigungsoekonomie. Damit verbindet das Buch physikalische Grundlagen mit den praktischen Zusammenhaengen moderner Halbleiterproduktion.Ideal fuer fortgeschrittene Studierende, Ingenieurinnen und Ingenieure sowie Fach- und Fuehrungskraefte aus Elektrotechnik, Werkstofftechnik, Chemieingenieurwesen, Maschinenbau, Physik und Produktionstechnik.Entdecken Sie die technischen Prinzipien hinter den Chips der KI-AEra und bauen Sie mit diesem praxisorientierten Handbuch ein fundiertes Verstaendnis der modernen Halbleiterfertigung auf - sichern Sie sich jetzt Ihr Exemplar! This item is printed on demand. Shipping may be from our UK warehouse or from our Australian or US warehouses, depending on stock availability.…